XC6SLX16-3FT256I vs XC6SLX16-2FTG256C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX16-3FT256I sa pamamagitan ng AMD at XC6SLX16-2FTG256C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX16-3FT256I | XC6SLX16-2FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Katayuan ng Stock | — | In Stock |
| Presyo ng Yunit (USD) | — | $16.41 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX (logic-optimized) | — |
| Logic Cells | 14,579 cells | 14,579 |
| Configurable Logic Blocks (CLBs) | 1,139 CLBs | 1,139 |
| User I/O Count | 186 I/O | — |
| Max Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -3 (highest Spartan-6 LX performance grade) | -2 |
| Packhaging | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch |
| Package Body Size | 17 x 17 mm, 1.0 mm ball pitch | — |
| Terminal Count | 256 terminals | — |
| Temperature na Operasyon | 0 C to +85 C (32 F to 185 F) | 0 °C to +85 °C (Commercial) |
| Temperature Grade Marking | Industrial | — |
| Lead-Free Status | Lead-free package construction | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Package Code | LBGA / FT256 | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Configuration Interface Details | [DATA_NEEDED: configuration interface details] | — |
| Family | — | Spartan-6 LX |
| Slices | — | 2,278 |
| Block RAM Bits | — | 589,824 bits |
| Block RAM Blocks (18 Kb) | — | 32 |
| DSP Slices (18×18 multipliers) | — | 32 |
| Maximum User I/Os | — | 186 |
| Maximum Single-Ended I/O Banks | — | 4 |
| Process Node | — | 45 nm CMOS, 9-metal layer |
| Supply Voltage (Core) | — | 1.2 V nominal |
| Lead-Free / RoHS | — | Yes (compliant) |
| Configuration Modes | — | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel |
| Clock Management Tiles (CMTs) | — | 2 (each with PLL + MMCM) |
| PCIe Support | — | Soft IP only (no integrated PCIe hard cores) |