XC6SLX75-2FGG484I vs XC6SLX75-2FG484C Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-2FGG484I sa pamamagitan ng AMD at XC6SLX75-2FG484C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX75-2FGG484I XC6SLX75-2FG484C
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Unknown
Device Family Spartan-6 LX —
Logic Cells 74,637 74,637 cells
Logic Elements / Slices 11,650 slices —
System Gates 3,170,304 —
Block RAM 4,824 Kbits (180 x 18 Kbit) [DATA_NEEDED: block RAM]
DSP Slices (DSP48A1) 132 —
User I/Os 280 —
Maximum Internal Frequency 667 MHz —
Process Technology 45 nm CMOS CMOS
Core Supply Voltage (VCCINT) 1.14 V to 1.26 V —
Auxiliary Supply Voltage (VCCAUX) 3.3 V —
Speed Grade -2 (mid-range) -2
Packhaging 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch —
Operating Temperature (Industrial) -40 °C to +100 °C (junction to +125 °C) —
Uri ng Pagpapasok Surface Mount (BGA) Surface mount ball grid array
Level ng MSL 3 (168 hours) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX
Internal Frequency — 667 MHz
Configurable Logic Blocks — 5,831 CLBs
Package Type — 484-BBGA, MS-034 FBGA
Package Dimensions — 23 x 23 mm
Package Pitch — 1 mm
Number of Balls — 484 balls
Temperature na Operasyon — 0 to 85 C
Temperature Grade — Commercial
Configuration — [DATA_NEEDED: configuration architecture]
Volte ng Pagbibigay — [DATA_NEEDED: supply voltage]
DSP Resources — [DATA_NEEDED: DSP resources]
User I/O — [DATA_NEEDED: user I/O count]

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