XC6SLX75-2FGG484I vs XC6SLX75-2FG484C 对比
详细并排对比 XC6SLX75-2FGG484I 出自 AMD 和 XC6SLX75-2FG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-2FGG484I | XC6SLX75-2FG484C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | 74,637 cells |
| Logic Elements / Slices | 11,650 slices | — |
| System Gates | 3,170,304 | — |
| Block RAM | 4,824 Kbits (180 x 18 Kbit) | [DATA_NEEDED: block RAM] |
| DSP Slices (DSP48A1) | 132 | — |
| User I/Os | 280 | — |
| Maximum Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | CMOS |
| Core Supply Voltage (VCCINT) | 1.14 V to 1.26 V | — |
| Auxiliary Supply Voltage (VCCAUX) | 3.3 V | — |
| Speed Grade | -2 (mid-range) | -2 |
| 封装 | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction to +125 °C) | — |
| 安装类型 | Surface Mount (BGA) | Surface mount ball grid array |
| MSL 等级 | 3 (168 hours) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX |
| Internal Frequency | — | 667 MHz |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Package Type | — | 484-BBGA, MS-034 FBGA |
| Package Dimensions | — | 23 x 23 mm |
| Package Pitch | — | 1 mm |
| Number of Balls | — | 484 balls |
| 工作温度 | — | 0 to 85 C |
| Temperature Grade | — | Commercial |
| Configuration | — | [DATA_NEEDED: configuration architecture] |
| 电源电压 | — | [DATA_NEEDED: supply voltage] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |
| User I/O | — | [DATA_NEEDED: user I/O count] |