XC6SLX75-3FGG676C vs XC6SLX75-3FG676C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-3FGG676C sa pamamagitan ng Xilinx at XC6SLX75-3FG676C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Xilinx
XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C ✓ NakahandaPagsanggunian na paghahambing
| Parametro | XC6SLX75-3FGG676C | XC6SLX75-3FG676C |
|---|---|---|
| Brand | Xilinx | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | 74,637 cells |
| Configurable Logic Blocks (CLBs) | 5,831 | — |
| User I/O | 408 | — |
| DSP48A1 Slices | 132 | — |
| Block RAM | 3,096 Kbit | [DATA_NEEDED: block RAM resources] |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) | 667 MHz |
| Volte ng Pagbibigay | 1.14 V to 1.26 V | [DATA_NEEDED: supply voltage] |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) | -3 |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0°C to 85°C (32°F to 185°F) |
| Package Type | FBGA-676 (PBGA676) | 676-BGA |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch | 27 mm × 27 mm |
| Uri ng Pagpapasok | Surface Mount | Surface mount |
| Clock Management | DCM and PLL present | — |
| Lead-Free | Yes | — |
| RoHS | [DATA_NEEDED: RoHS compliance statement for this exact orderable] | — |
| REACH | [DATA_NEEDED: REACH declaration for this exact orderable] | — |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade | — |
| Maximum Package Pin Count | 676 balls | — |
| Device Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Package Description | — | FBGA-676 |
| Ball Pitch | — | 1.0 mm |
| Terminal Count | — | 676 terminals |
| Package Family | — | FBGA |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |