XC6SLX75-3FGG676C vs XC6SLX75-3FG676I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-3FGG676C sa pamamagitan ng Xilinx at XC6SLX75-3FG676I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Xilinx
XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C ✓ NakahandaPagsanggunian na paghahambing
| Parametro | XC6SLX75-3FGG676C | XC6SLX75-3FG676I |
|---|---|---|
| Brand | Xilinx | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Unknown |
| Device Type | FPGA (Field Programmable Gate Array) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 74,637 | 74,637 cells |
| Configurable Logic Blocks (CLBs) | 5,831 | — |
| User I/O | 408 | — |
| DSP48A1 Slices | 132 | — |
| Block RAM | 3,096 Kbit | — |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) | — |
| Volte ng Pagbibigay | 1.14 V to 1.26 V | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) | -3 |
| Temperature na Operasyon | 0 C to 85 C (commercial) | — |
| Package Type | FBGA-676 (PBGA676) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Clock Management | DCM and PLL present | — |
| Lead-Free | Yes | — |
| RoHS | [DATA_NEEDED: RoHS compliance statement for this exact orderable] | — |
| REACH | [DATA_NEEDED: REACH declaration for this exact orderable] | — |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade | — |
| Maximum Package Pin Count | 676 balls | — |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Maximum Frequency | — | 862 MHz |
| I/O Count | — | 408 I/O |
| Packhaging | — | 676-ball FCBGA |
| Package Body Size | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Count | — | 676 terminals |
| Temperature Grade | — | Industrial |
| Surface-Mount Type | — | Ball Grid Array (BGA) |
| Verified Distributor Price | — | USD 67.1347 per unit |
| LCSC Availability | — | In stock |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Automotive Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |