XC6SLX9-2FT256C vs XC6SLX9-2FTG256C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX9-2FT256C sa pamamagitan ng AMD at XC6SLX9-2FTG256C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX9-2FT256C | XC6SLX9-2FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Unknown | Aktibo |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 9,152 cells | — |
| I/O Count | 186 I/O | — |
| Internal Frequency | 667 MHz | — |
| Speed Grade | -2 | -2 (commercial) |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Package Type | FTBGA-256 | — |
| Package Dimensions | 17 mm × 17 mm | — |
| Package Pitch | 1 mm | — |
| Package Outline | MS-034 | — |
| Ball Count | 256 balls | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Hanay ng Temperature na Operasyon | 0°C to 85°C | — |
| Temperature Grade | Commercial | — |
| Configuration | Programmable FPGA | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free FTBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 LE |
| Adaptive Logic Modules (ALMs) | — | 1,430 ALM |
| Configurable Logic Blocks (CLBs) | — | 715 CLB |
| Embedded Block RAM | — | 576 Kbits |
| Distributed RAM | — | 32 Kbits |
| DSP / Multiplier Blocks | — | 16 (18 x 18 multipliers) |
| Maximum User I/Os | — | 186 |
| Internal Performance | — | Up to 667 MHz |
| Process Technology | — | 45 nm low-power CMOS |
| Packhaging | — | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch |
| Temperature na Operasyon | — | 0 C to 85 C (commercial) |
| Volte ng Pagbibigay | — | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) |
| Configuration Modes | — | SPI, JTAG, BPI, Master Serial |