XC6SLX9-2FTG256C vs EP4CE10F17C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX9-2FTG256C sa pamamagitan ng AMD at EP4CE10F17C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX9-2FTG256C | EP4CE10F17C8N |
|---|---|---|
| Brand | AMD | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Spartan-6 LX | — |
| Device Logic Cells | 9,152 LE | — |
| Adaptive Logic Modules (ALMs) | 1,430 ALM | — |
| Configurable Logic Blocks (CLBs) | 715 CLB | — |
| Embedded Block RAM | 576 Kbits | — |
| Distributed RAM | 32 Kbits | — |
| DSP / Multiplier Blocks | 16 (18 x 18 multipliers) | — |
| Maximum User I/Os | 186 | 179 |
| Speed Grade | -2 (commercial) | — |
| Internal Performance | Up to 667 MHz | — |
| Process Technology | 45 nm low-power CMOS | 60 nm low-power SRAM |
| Packhaging | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (F17), 17x17 mm |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0C to +85C (Commercial) |
| Volte ng Pagbibigay | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free FTBGA) | Compliant |
| Configuration Modes | SPI, JTAG, BPI, Master Serial | — |
| Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 10320 |
| Embedded Memory | — | 423936 bits (414 Kbit) |
| Embedded Multipliers (18x18) | — | 23 |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Maximum Internal Frequency | — | 402 MHz |
| Configuration Method | — | SRAM, requires external EPCS/EPCQ flash |