XC7A35T-2FTG256C vs XC7A35T-2FTG256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC7A35T-2FTG256C sa pamamagitan ng AMD at XC7A35T-2FTG256I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

AMD
XC7A35T-2FTG256C XC7A35T-2FTG256C - 33,280-Cell Artix-7 FPGA | AMD

XC7A35T-2FTG256C - 33,280-Cell Artix-7 FPGA | AMD

XC7A35T-2FTG256C ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro XC7A35T-2FTG256C XC7A35T-2FTG256I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Katayuan ng Stock — In Stock
Presyo ng Yunit (USD) — $31.17
Device Type Artix-7 Field Programmable Gate Array (FPGA) —
Logic Cells 33,280 cells 33,280
Number of I/Os 170 I/Os (DigiKey and Octopart listings) —
Alternate I/O Count Listing 100 I/Os (Newark listing) —
Process Technology 28 nm —
Speed Grade -2 -2
Package Type FTG256, 256-ball low-profile BGA (256-LBGA) —
Device Family Artix-7 —
Architecture 28 nm FPGA —
Product Classification IC FPGA 170 I/O 256FTBGA —
Programming Technology Reconfigurable FPGA logic —
Surface-Mount Form Surface Mount —
Lead-Free Packaging Availability Available in Pb-free package options —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Hanay ng Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
Block RAM [DATA_NEEDED: block RAM capacity] 1,843,200 bits (50 x 36 Kb blocks)
DSP Slices [DATA_NEEDED: DSP slice count] —
Maksimum na Taktiko ng Oras [DATA_NEEDED: maximum clock frequency] —
I/O Standard Support [DATA_NEEDED: supported I/O standards] —
Family — Artix-7
Slices — 5,200
DSP48E1 Slices — 90
User I/Os (max in FTBGA-256) — 170
Clock Management Tiles (CMTs) — 4 (1 MMCM + 2 PLLs each)
GTP Transceivers — 4 (up to 6.6 Gb/s)
Temperature Grade — Industrial (-40C to +100C)
Process Node — 28 nm HKMG
Packhaging — 256-ball FTBGA (FTG256)
Uri ng Pagpapasok — Surface Mount (BGA)
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-free — Yes

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