10AS048H3F34E2LG - Arria 10 SX SoC FPGA 480K LE | Altera | 1152-FBGA
MPN: 10AS048H3F34E2LG ✓ Nakahanda10AS048H3F34E2LG Ulas
An SoC FPGA is a hybrid semiconductor device that fuses a general-purpose processor subsystem with programmable logic on a single die, enabling hardware/software co-design. The Arria 10 SX family in particular belongs to the mid-range, transceiver-rich tier of Intel FPGAs (FPGA -> programmable logic -> ASIC-class integration -> semiconductor). The hard ARM Cortex-A9 cores run the user application and OS, while the FPGA fabric accelerates custom datapath, DSP, and interface logic. Compared with a discrete processor-plus-FPGA solution, an SoC FPGA shrinks the BOM, lowers board-to-board latency between the CPU and logic, and reduces power by eliminating inter-chip serializers.
Key features of the 10AS048H3F34E2LG include 480,000 logic elements, embedded transceiver support for high-speed serial I/O, hard memory controllers with DDR3/DDR4 support, dual ARM Cortex-A9 MPCore with NEON media engine and single/double-precision FPU, CoreSight debug and trace, hardware error-correcting code on external memory interfaces, and integrated PCI Express hard IP blocks. The device targets 0.9 V core operation and is rated for the medical temperature grade and industrial/extended reliability class.
Architecturally, the 10AS048H3F34E2LG uses the 20 nm Arria 10 fabric with adaptive logic modules (ALMs), variable-precision DSP blocks, and M20K on-chip memory blocks. Transceivers operate at up to 14.1 Gbps, supporting protocols such as PCIe Gen3, 10G Ethernet, JESD204B/C, CPRI, and Serial RapidIO. The Hard Processor System (HPS) includes its own DDR controller, peripherals (USB, Ethernet, CAN, SD/MMC), and dedicated boot/clock/reset infrastructure separate from the FPGA fabric.
Typical applications include wireless baseband processing (LTE/5G fronthaul), radar and electronic warfare signal processing, broadcast and professional video processing, high-performance medical imaging systems, military secure communications, industrial motor control and machine vision, and ASIC prototyping. The Arria 10 SX is well-suited when the design needs both deterministic parallel processing in fabric and a Linux-capable host for control and networking.
When designing with this device, plan power delivery carefully: the 0.9 V core rail alone can draw tens of amps under load and typically requires a multi-phase buck regulator. Use the Intel Arria 10 SoC development kit reference schematics as a starting point for power-rail sequencing and HPS-FPGA shared I/O banks. Always check the device errata (DS-0119 family) before sign-off, especially for transceiver and HPS-DDR initialization.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the 10AS048H3F34E2LG that go beyond what is in the manufacturer datasheet alone.
Mga alternatibo na pwedeng ilagay na 10AS048H3F34E2LG — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok 10AS048H3F34E2LG (parehas na form factor at footprint) — pagkakaiba sa Package, Logic Elements, DSP Blocks, Transceivers, Mounting Type.
10AS048H2F34E2LG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H2F34I2LG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H2F34I2SG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H2F34E2SG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H1F34I1HG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H1F34E1HG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS032H4F35E3LG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS032H4F34E3LG
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →10AS048H3F34E2LG Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Arria 10 SX |
| Device | 10AS048 |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Packhaging | 1152-pin FC-FBGA (35x35 mm) |
| Uri ng Pagpapasok | Surface Mount |
| Operating Temperature Grade | Medical / Industrial |
| Number of Terminals | 1152 (BGA) |
| Package Shape | Square |
| Terminal Form | Ball |
| Architecture | SoC FPGA (HPS + FPGA fabric) |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng 10AS048H3F34E2LG square
Pin configuration para sa 10AS048H3F34E2LG (square package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa 10AS048H3F34E2LG.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
10AS048H3F34E2LG ay nararapat para sa 6 aplikasyons: Wireless Baseband Processing (LTE/5G Fronthaul), Radar and Electronic Warfare Signal Processing, Broadcast Video Processing and Format Conversion, High-Performance Medical Imaging Systems, Industrial Motor Control and Machine Vision, ASIC Prototyping and Emulation.
Wireless Baseband Processing (LTE/5G Fronthaul)
The 10AS048H3F34E2LG fits wireless baseband because its 480K logic elements and high-speed transceivers (up to 14.1 Gbps) can implement CPRI, JESD204B, and 10G Ethernet fronthaul links while the dual ARM Cortex-A9 cores run the MAC scheduler and PHY control. Compared with ASIC+FPGA stacks, the SoC integrates the baseband host and DSP pipeline on a single die, reducing board-to-board latency and BOM. Designers typically pair this device with RF front-end ADCs/DACs such as ADI AD9371 for a complete remote-radio-head or small-cell design.
Inirekomenda
Radar and Electronic Warfare Signal Processing
For radar and EW systems, the 10AS048H3F34E2LG offers 480K LE plus hardened floating-point DSP blocks that can implement FFT, pulse compression, and beamforming pipelines running at hundreds of MHz sample rates. The 14.1 Gbps transceivers stream raw ADC data into the FPGA from front-end converters (e.g., TI ADC12DJ3200 or ADI AD9208) and route processed tracks out over 10G Ethernet. The Cortex-A9 HPS handles track management, display drivers, and network protocol stacks in parallel with FPGA acceleration.
Inirekomenda
Broadcast Video Processing and Format Conversion
The 10AS048H3F34E2LG is well-suited for broadcast video routers, format converters, and IP-based SDI-over-IP gateways because of its high logic density and transceiver count. It bridges HD-SDI/3G-SDI/12G-SDI coax links with 10G/25G Ethernet via SMPTE ST 2059/ST 2110 IP pipelines. The HPS runs network stack and control software while the FPGA handles uncompressed video pixel-rate processing. Its 0.9 V core efficiency also helps meet broadcast airframe power budgets.
Inirekomenda
High-Performance Medical Imaging Systems
The 10AS048H3F34E2LG is specified for medical operating temperature range and integrates both image-processing pipeline and host CPU on one chip, which is ideal for ultrasound, CT, and MRI subsystems. FPGA fabric accelerates beamforming, FFT, and image reconstruction while the HPS manages display, networking, and patient-data interfaces. Its 20 nm low-power process reduces heat in bedside imaging carts where airflow is limited.
Inirekomenda
Industrial Motor Control and Machine Vision
For high-end industrial servo drives and machine-vision platforms, the 10AS048H3F34E2LG delivers the deterministic parallelism needed for multi-axis control loops at sub-microsecond rates while the ARM cores run the EtherCAT master, motion planner, and UI stack. The hardware PCIe Gen3 blocks enable fast host-side image ingestion in machine-vision, and the transceivers carry multi-megapixel sensor data without an external bridge chip.
Inirekomenda
ASIC Prototyping and Emulation
Because of its 480K logic elements and 1152-FBGA package with abundant user I/O, the 10AS048H3F34E2LG is widely used in ASIC prototyping where designers map RTL partitions and validate pre-silicon software on real hardware. The dual ARM HPS lets prototypes run actual OS images and driver stacks, providing a more realistic verification environment than pure FPGA-only emulators. Quartus Prime supports multi-FPGA partitioning for designs that exceed a single Arria 10 SX.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for 10AS048H3F34E2LG — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | 10AS048H2F34E2LG | 10AS048H2F34I2LG | 10AS048H1F34I1HG | 10AS032H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Speed Grade | H3 (fastest) | H2 | H2 | H1 | H4 |
| Temperature Grade | Enhanced (E2) | Enhanced (E2) | Industrial (I2) | Industrial (I1) | Enhanced (E3) |
| Hard Processor System | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Targeted Application Tier | Mid-range SoC FPGA, top speed bin | Mid-range SoC FPGA, mid speed bin | Mid-range SoC FPGA, mid speed bin, industrial | Mid-range SoC FPGA, low speed bin, industrial | Lower-density 320K LE, mid speed bin |
Pangunahing mga Pagkakaiba
- Top speed-grade bin in the 10AS048 family (kumpara sa10AS048H2F34E2LG)
- Higher density than the 10AS032 alternatives (kumpara sa10AS032H4F34E3LG)
- Hard ARM Cortex-A9 HPS integrated on-die (kumpara sa10AS048H2F34I2LG (same-family alt))
Talaan ng Disenyo
The 0.9 V core rail on the 10AS048H3F34E2LG can draw 30 A or more under typical transceiver-active workloads. Estimated: at VIN=12 V, VOUT=0.9 V, Icore=30 A, total power dissipation is approximately (12 - 0.9) * 30 = 333 W in the regulator plus 27 W in the FPGA core. Use a multi-phase buck regulator such as the LTM4644 or similar capable of 60 A+ with current sharing. Implement smart-Voltage-Identification (SmartVID) if the design uses dynamic power savings.
Estimated: with full transceiver utilization and 480K LE running at typical toggle rates, the FC-FBGA-1152 package dissipates in the range of 8 to 15 W. The 35x35 mm BGA exposes a thermal pad through the bottom of the package that must be soldered to a large copper pour with thermal vias (typically 0.3 mm pitch, 0.5 mm drill). Refer to the Arria 10 thermal management user guide for theta-JA vs airflow curves. At zero airflow, junction temperatures may exceed 100 C without a heatsink.
Use the Arria 10 SX development kit PCB stack-up as a reference (typically 12-16 layers with high-speed material for transceiver channels). Route all transceiver channels with controlled impedance of 100 ohm differential and keep total length matched within the tolerance specified by the protocol (e.g., 0.127 mm for PCIe Gen3). Maintain at least 4x dielectric spacing between aggressor and victim nets on parallel runs to avoid crosstalk.
Do not confuse the F34 (1152-FBGA, 35x35 mm) package with the F35 (1152-FBGA, 35x35 mm) or F29 (780-FBGA) variants - they have different ball maps and pin counts. Always verify the package code in the OPN: H3F34E2LG means H3 speed grade, F34 package, E2 temp range. Also check Arria 10 device errata (DS-0119 family) for HPS boot, transceiver PLL lock, and DDR initialization known issues before finalizing the design.
Impormasyon ng Pagsunod sa Kautusan
RoHS and REACH compliant per Altera/Intel product page; lead-free and halogen-free per the LG suffix in the OPN. AEC-Q100 not applicable for an FPGA. Always verify conflict-minerals reporting with the manufacturer for production orders.