10AS048H3F34E2LG - Arria 10 SX SoC FPGA 480K LE | Altera | 1152-FBGA
MPN: 10AS048H3F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1280 | $1,280,000.00 |
Drop-in alternatives for 10AS048H3F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS048H3F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device | 10AS048 |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Package | 1152-pin FC-FBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Medical / Industrial |
| Number of Terminals | 1152 (BGA) |
| Package Shape | Square |
| Terminal Form | Ball |
| Architecture | SoC FPGA (HPS + FPGA fabric) |
| RoHS Status | Compliant |
10AS048H3F34E2LG square Pin Configuration Guide
Complete pinout information for 10AS048H3F34E2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H3F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H3F34E2LG is suitable for 6 applications: Wireless Baseband Processing (LTE/5G Fronthaul), Radar and Electronic Warfare Signal Processing, Broadcast Video Processing and Format Conversion, High-Performance Medical Imaging Systems, Industrial Motor Control and Machine Vision, ASIC Prototyping and Emulation.
Wireless Baseband Processing (LTE/5G Fronthaul)
The 10AS048H3F34E2LG fits wireless baseband because its 480K logic elements and high-speed transceivers (up to 14.1 Gbps) can implement CPRI, JESD204B, and 10G Ethernet fronthaul links while the dual ARM Cortex-A9 cores run the MAC scheduler and PHY control. Compared with ASIC+FPGA stacks, the SoC integrates the baseband host and DSP pipeline on a single die, reducing board-to-board latency and BOM. Designers typically pair this device with RF front-end ADCs/DACs such as ADI AD9371 for a complete remote-radio-head or small-cell design.
Recommended
Radar and Electronic Warfare Signal Processing
For radar and EW systems, the 10AS048H3F34E2LG offers 480K LE plus hardened floating-point DSP blocks that can implement FFT, pulse compression, and beamforming pipelines running at hundreds of MHz sample rates. The 14.1 Gbps transceivers stream raw ADC data into the FPGA from front-end converters (e.g., TI ADC12DJ3200 or ADI AD9208) and route processed tracks out over 10G Ethernet. The Cortex-A9 HPS handles track management, display drivers, and network protocol stacks in parallel with FPGA acceleration.
Recommended
Broadcast Video Processing and Format Conversion
The 10AS048H3F34E2LG is well-suited for broadcast video routers, format converters, and IP-based SDI-over-IP gateways because of its high logic density and transceiver count. It bridges HD-SDI/3G-SDI/12G-SDI coax links with 10G/25G Ethernet via SMPTE ST 2059/ST 2110 IP pipelines. The HPS runs network stack and control software while the FPGA handles uncompressed video pixel-rate processing. Its 0.9 V core efficiency also helps meet broadcast airframe power budgets.
Recommended
High-Performance Medical Imaging Systems
The 10AS048H3F34E2LG is specified for medical operating temperature range and integrates both image-processing pipeline and host CPU on one chip, which is ideal for ultrasound, CT, and MRI subsystems. FPGA fabric accelerates beamforming, FFT, and image reconstruction while the HPS manages display, networking, and patient-data interfaces. Its 20 nm low-power process reduces heat in bedside imaging carts where airflow is limited.
Recommended
Industrial Motor Control and Machine Vision
For high-end industrial servo drives and machine-vision platforms, the 10AS048H3F34E2LG delivers the deterministic parallelism needed for multi-axis control loops at sub-microsecond rates while the ARM cores run the EtherCAT master, motion planner, and UI stack. The hardware PCIe Gen3 blocks enable fast host-side image ingestion in machine-vision, and the transceivers carry multi-megapixel sensor data without an external bridge chip.
Recommended
ASIC Prototyping and Emulation
Because of its 480K logic elements and 1152-FBGA package with abundant user I/O, the 10AS048H3F34E2LG is widely used in ASIC prototyping where designers map RTL partitions and validate pre-silicon software on real hardware. The dual ARM HPS lets prototypes run actual OS images and driver stacks, providing a more realistic verification environment than pure FPGA-only emulators. Quartus Prime supports multi-FPGA partitioning for designs that exceed a single Arria 10 SX.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H3F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H2F34E2LG | 10AS048H2F34I2LG | 10AS048H1F34I1HG | 10AS032H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Speed Grade | H3 (fastest) | H2 | H2 | H1 | H4 |
| Temperature Grade | Enhanced (E2) | Enhanced (E2) | Industrial (I2) | Industrial (I1) | Enhanced (E3) |
| Hard Processor System | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Targeted Application Tier | Mid-range SoC FPGA, top speed bin | Mid-range SoC FPGA, mid speed bin | Mid-range SoC FPGA, mid speed bin, industrial | Mid-range SoC FPGA, low speed bin, industrial | Lower-density 320K LE, mid speed bin |
Key Differentiators
- Top speed-grade bin in the 10AS048 family (vs 10AS048H2F34E2LG)
- Higher density than the 10AS032 alternatives (vs 10AS032H4F34E3LG)
- Hard ARM Cortex-A9 HPS integrated on-die (vs 10AS048H2F34I2LG (same-family alt))
Design Notes
The 0.9 V core rail on the 10AS048H3F34E2LG can draw 30 A or more under typical transceiver-active workloads. Estimated: at VIN=12 V, VOUT=0.9 V, Icore=30 A, total power dissipation is approximately (12 - 0.9) * 30 = 333 W in the regulator plus 27 W in the FPGA core. Use a multi-phase buck regulator such as the LTM4644 or similar capable of 60 A+ with current sharing. Implement smart-Voltage-Identification (SmartVID) if the design uses dynamic power savings.
Estimated: with full transceiver utilization and 480K LE running at typical toggle rates, the FC-FBGA-1152 package dissipates in the range of 8 to 15 W. The 35x35 mm BGA exposes a thermal pad through the bottom of the package that must be soldered to a large copper pour with thermal vias (typically 0.3 mm pitch, 0.5 mm drill). Refer to the Arria 10 thermal management user guide for theta-JA vs airflow curves. At zero airflow, junction temperatures may exceed 100 C without a heatsink.
Use the Arria 10 SX development kit PCB stack-up as a reference (typically 12-16 layers with high-speed material for transceiver channels). Route all transceiver channels with controlled impedance of 100 ohm differential and keep total length matched within the tolerance specified by the protocol (e.g., 0.127 mm for PCIe Gen3). Maintain at least 4x dielectric spacing between aggressor and victim nets on parallel runs to avoid crosstalk.
Do not confuse the F34 (1152-FBGA, 35x35 mm) package with the F35 (1152-FBGA, 35x35 mm) or F29 (780-FBGA) variants - they have different ball maps and pin counts. Always verify the package code in the OPN: H3F34E2LG means H3 speed grade, F34 package, E2 temp range. Also check Arria 10 device errata (DS-0119 family) for HPS boot, transceiver PLL lock, and DDR initialization known issues before finalizing the design.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page; lead-free and halogen-free per the LG suffix in the OPN. AEC-Q100 not applicable for an FPGA. Always verify conflict-minerals reporting with the manufacturer for production orders.
