5CEFA9F27C7N - Cyclone V E FPGA 301K LE | Intel | FBGA-672
MPN: 5CEFA9F27C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for 5CEFA9F27C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CEFA9F23I7N
β Drop-Inβ In Stock
$198 / Unit
View Datasheet β5CEFA9F27I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CEFA9F27C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CEFA9F23C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CEFA9F31I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CEFA9F27C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V E |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits (14.25 Mbit) |
| User I/O Pins | 336 |
| Supply Voltage (Core) | 1.13 V |
| Maximum Operating Frequency | 800 MHz |
| Package | 672-ball FBGA (FineLine BGA) |
| Package Body Size | 27 mm (F27) |
| Speed Grade | C7 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray (40 units per tray) |
| Lead-Free | Yes |
| RoHS Status | Compliant |
| Process Technology | 28 nm TSMC low-power |
5CEFA9F27C7N 27 mm (f27) Pin Configuration Guide
Complete pinout information for 5CEFA9F27C7N (27 mm (f27) package) with 336 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CEFA9F27C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 336 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CEFA9F27C7N is suitable for 6 applications: Industrial Motor Control, Machine Vision Pre-Processing, Broadcast Video Processing, ASIC Prototyping, Protocol-Rich Industrial Gateways, Medical Imaging Pre-Processing.
Industrial Motor Control
The 5CEFA9F27C7N's 301,000 logic elements deliver the parallel DSP throughput required for multi-axis field-oriented control (FOC) loops, where each axis demands high-rate Park/Clarke transforms and SVPWM generation. The 336 GPIOs comfortably accommodate 8+ encoder inputs, 16+ PWM channels, and dual-redundant CAN/EtherCAT interfaces without external muxing. Industrial motor drives benefit from the device's hard memory controller blocks driving external DDR3 for trajectory buffering. Compared to a microcontroller + DSP solution, the FPGA off-loads the control loop deterministically, freeing the MCU for supervisory and communication tasks.
Recommended
Machine Vision Pre-Processing
The 5CEFA9F27C7N's 14.25 Mbits of embedded memory and 336 GPIOs enable multi-channel camera aggregation with on-FPGA Bayer-to-RGB conversion, histogram equalization, and edge detection pipelines. The 800 MHz maximum operating frequency supports real-time processing of 1080p60 streams from multiple parallel image sensors. Embedded hard IP blocks accelerate memory interfacing for frame buffer storage, and the rich LVDS I/O support handles MIPI CSI-2 deserialization via soft IP. This part is a strong fit for inspection cameras on SMT lines and pick-and-place machines where deterministic latency matters.
Recommended
Broadcast Video Processing
Broadcast studios require lossless video format conversion (SDI to HDMI, 3G-SDI routing, frame-rate conversion) which the 5CEFA9F27C7N handles with 301K logic elements capable of supporting multiple parallel video pipelines. The 336 GPIOs map directly to multi-channel SDI inputs/outputs plus housekeeping interfaces. Embedded transceivers in the Cyclone V GX family are not present in this 'E' variant, so SDI SERDES is typically implemented via external chips. The part is widely used in production switchers, video walls, and broadcast format converters where cost-per-channel matters.
Recommended
ASIC Prototyping
ASIC prototyping rigs benefit from the 5CEFA9F27C7N's 301K logic elements, which can host a moderate-complexity ASIC design partitioned across multiple FPGAs. The 336 GPIOs serve as chip-to-chip interconnect channels between sibling FPGAs in a multi-FPGA prototyping rack. Hard memory controllers and PLLs allow direct DDR3 attachment without wasting logic resources. Quartus Prime's incremental compilation supports rapid design bring-up and modular debugging, accelerating time-to-prototype for designs targeting 28 nm and below process nodes.
Recommended
Protocol-Rich Industrial Gateways
Industrial protocol gateways (PROFINET, EtherCAT, Modbus, CAN, RS-485, OPC-UA) require simultaneous support for multiple fieldbus standards, which the 5CEFA9F27C7N's 336 GPIOs and 14.25 Mbits embedded memory comfortably handle. Each protocol stack is implemented as a soft IP core, with the FPGA's logic density accommodating three or four concurrent stacks plus protocol translation logic. Hard memory controllers enable buffering of message queues in DDR3. The commercial temperature grade suits IP65-rated control cabinet installations where ambient stays within 0C to 70C.
Recommended
Medical Imaging Pre-Processing
Ultrasound and endoscopy pre-processing boards use the 5CEFA9F27C7N for high-channel-count analog-front-end digitizer aggregation, beamforming preprocessing, and JPEG2000 compression pipelines. The 301K logic elements support 64-channel beamformers, while the 336 GPIOs accommodate multi-channel LVDS links from analog front-ends. Embedded hard IP accelerates memory access for raw RF frame storage. Note: medical applications typically require industrial temperature grade, so consider the 5CEFA9F23I7N variant; this commercial-temperature part is appropriate for bench-top diagnostic equipment in controlled environments.
Recommended
Recommended Products Summary
Engineering reference data for 5CEFA9F27C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CEFA9F23I7N | 5CEFA9F27I7N | 5CEFA9F27C8N | 5CEFA9F23C7N | 5CEFA9F31I7N | XC6SLX150-3FGG676I |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Xilinx |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F23) - smaller body | 672-ball FBGA (F31) - larger body | 676-ball FBGA - different pinout |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 147,443 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 4,824 Kbits |
| User I/Os | 336 | 336 | 336 | 336 | 336 | 336 | 338 |
| Speed Grade | C7 (commercial) | I7 (industrial) | I7 (industrial) | C8 (faster commercial) | C7 (commercial) | I7 (industrial) | -3 (industrial) |
| Operating Temperature | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Process / Family | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 45 nm / Spartan-6 |
Key Differentiators
- Highest-density Cyclone V E with 301K logic elements in 672-ball FBGA (vs 5CEFA4U19I7)
- Lower-cost Cyclone V E variant vs Xilinx Spartan-6 at similar density (vs XC6SLX150-3FGG676I)
- Commercial temperature grade optimized for cost-sensitive deployments (vs 5CEFA9F23I7N)
Design Notes
The 672-ball FineLine BGA requires microvia or via-in-pad PCB technology for reliable solder joint formation. Use a minimum 8-layer stack-up with HDI (High Density Interconnect) construction; signal layers should fan out the BGA escape pattern on the top two layers using 0.1 mm laser-drilled microvias. Estimated: assuming a 0.8 mm ball pitch and 672 balls, fanout requires roughly 40 mm x 40 mm of BGA escape area on the top signal layer. Apply NSMD (Non-Solder Mask Defined) pads with 0.4 mm diameter for reliable solder joint inspection.
Cyclone V E FPGAs in the 672-ball BGA package rely heavily on the center power/ground balls for thermal dissipation. Estimated: at 100% logic utilization with 800 MHz operation, junction-to-ambient thermal resistance (theta_JA) is approximately 12 C/W with a standard 8-layer JEDEC test board. For continuous high-utilization workloads, attach a heatsink or use forced-air cooling to keep junction temperature below 100C. The exposed center balls on the F27 package provide a thermal path; connect them to an internal ground plane with multiple thermal vias (0.3 mm drill, 1.2 mm pitch array).
The 5CEFA9F27C7N requires a multi-rail power tree: core 1.13 V (typically 2-4 A depending on utilization), auxiliary PLL supply, and configurable I/O voltages (1.2 V to 3.3 V per bank group). Use a sequence controller (such as the Intel-recommended power sequencer) to enforce core-before-I/O power-up; reverse sequencing can cause latch-up. Decoupling follows the Intel pin connection guidelines: place 0.1 uF X7R ceramics within 2 mm of every power pin, plus bulk decoupling capacitors on each supply rail. Estimated: total quiescent power for an idle configured device is approximately 0.5 W; dynamic power scales with toggle rate and can exceed 5 W at 80% utilization.
Do not skip configuration mode validation: the 5CEFA9F27C7N supports AS (Active Serial), PS (Passive Serial), FPP (Fast Passive Parallel), and JTAG configuration. Selecting the wrong mode strap on MSEL pins renders the board unbootable. Also, ensure the configuration flash (EPCS or compatible) has correct AS byteswap settings for the chosen bitstream ordering. Finally, do not rely on default Quartus pin assignments - always verify the pinout file against your schematic before board fabrication, especially for differential pairs requiring matched-length routing.
Compliance Information
RoHS compliant and lead-free per the N suffix in MPN. Not AEC-Q100 qualified (FPGA is not a typical automotive-qualified part); automotive designs should use Cyclone V Auto or Cyclone IV GX automotive parts. REACH compliance documentation available from Intel product environmental portal.
