EP3CLS200F484C8 vs EP3CLS200F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C8 sa pamamagitan ng Intel at EP3CLS200F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484C8 | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS (low-power Cyclone III) | — |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | 12,404 |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | 8,211,456 bits |
| Embedded 18x18 Multipliers | 210 | 210 |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Packhaging | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, JTAG (IEEE 1149.1) |
| Security | Design encryption / bitstream AES | — |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| User I/O | — | 226 |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |