EP3CLS200F484C8 vs EP3CLS70F484C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C8 sa pamamagitan ng Intel at EP3CLS70F484C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484C8 | EP3CLS70F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Packhaging | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' suffix) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 70,208 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 3,068,928 |
| Embedded Memory Blocks | — | M9K (4 Kbit each) |
| Embedded Multipliers (18x18) | — | 300 |
| Maximum User I/O Pins | — | 278 |
| Global Clock Networks | — | 20 |
| Core Supply Voltage | — | 1.2 V |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| Bitstream Encryption | — | AES-256 (Cyclone III LS feature) |
| Configuration Mode | — | Active serial, passive serial, JTAG, fast passive parallel |
| Lead-Free | — | Yes |