EP3SE80F1152C3N vs EP3SE260F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C3N sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE80F1152C3N EP3SE260F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Stratix III E Stratix III E
Logic Elements (LEs) 80,000 —
Total Memory Bits 6,843,392 bits —
Number of LABs/CLBs 3200 —
Number of User I/O 744 —
Bilang ng Outputs 744 —
Packhaging / Kaso 1152-BBGA, FCBGA (FineLine BGA) —
Temperature na Operasyon 0C to +85C (commercial, C3 grade) 0 C to +85 C (Commercial)
Speed/Power Grade C3 —
Process Technology 40 nm CMOS 65 nm
Uri ng Pagpapasok Surface Mount Surface Mount
Lead Free Yes —
Level ng MSL 3 (per JEDEC J-STD-020) —
Configuration Memory SRAM-based, volatile (needs external config device) —
Tindminan RoHS Compliant Compliant
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
Packhaging — 1152-BBGA, FCBGA
Core Voltage — 1.1 V
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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