EPF8820ARC240-3N - FLEX 8000 672-LE FPGA | Intel / Altera
MPN: EPF8820ARC240-3N ✗ Tapus ng BuhayEPF8820ARC240-3N Ulas
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose internal logic blocks and interconnect matrix are configured by SRAM lookup tables (LUTs), loaded at power-up from an external configuration memory. The FLEX 8000 architecture belongs to the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit, with FPGAs typically used for parallel datapath processing, custom state machines, and high I/O-count interfacing. The device is configured at system power-up by data stored in an industry-standard parallel EPROM, an Altera serial configuration device (EPC1, EPC1213, EPC1064, or EPC1441), or by a system controller.
Key features of the EPF8820ARC240-3N include 672 logic elements, fast continuous interconnect with predictable delay, SRAM-based in-system reconfigurability, JTAG-compliant boundary-scan support, and a 240-pin RQFP package offering ample I/O for parallel buses and datapath applications. The -3 speed grade corresponds to the standard-performance tier of the FLEX 8000 family, suitable for designs with moderate timing margins where the lowest-cost option is preferred over the -4 and faster speed grades.
Typical applications include peripheral bus interfacing, DSP co-processing front-ends, communications backplane glue logic, industrial control and instrumentation front-ends, and ASIC prototyping. The wide I/O count and SRAM reconfiguration also enable field-upgradable logic in deployed systems. The part is also widely used in legacy designs and as a replacement for discrete 74-series logic, reducing board area while improving design flexibility.
Mga alternatibo na pwedeng ilagay na EPF8820ARC240-3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EPF8820ARC240-3N (parehas na form factor at footprint) — pagkakaiba sa Package, Process Technology, Speed Grade, Configuration Memory, Mounting Type.
EPF8820ARC240-3
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EPF8820ARC240-4
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EPF8820ARC240-4N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EPF8820ARC240-2
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EPF8820ARC208-3N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EPF8820ARC240-3N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 672 |
| Process Technology | CMOS, SRAM-based |
| Packhaging | 240-pin RQFP (RC240) |
| Speed Grade | -3 (standard performance) |
| Volte ng Pagbibigay | 5 V |
| Configuration Method | SRAM, loaded via EPC1 / EPC1213 / EPC1064 / EPC1441 serial configuration device or parallel EPROM |
| In-System Reconfigurable | Yes (SRAM-based) |
| Boundary-Scan Support | JTAG-compliant (IEEE 1149.1) |
| Uri ng Pagpapasok | Surface Mount |
| Lead-Free / RoHS | RoHS3 Compliant |
| Manufacturer | Altera Corporation (now Intel PSG) |
| Dating Code Window (verified supplier stock) | Within 3 years of mfg per Alibaba listing as of 2026-09-12 |
Gabay sa Pin Configuration ng EPF8820ARC240-3N 240-pin rqfp (rc240)
Pin configuration para sa EPF8820ARC240-3N (240-pin rqfp (rc240) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EPF8820ARC240-3N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EPF8820ARC240-3N ay nararapat para sa 6 aplikasyons: Peripheral Bus Glue Logic, ASIC Prototyping, Industrial Control Front-Ends, Telecommunications Backplane Bridging, Test & Measurement Instrumentation, Legacy 74-Series Logic Replacement.
Peripheral Bus Glue Logic
The EPF8820ARC240-3N fits peripheral bus glue logic because its 672 logic elements comfortably absorb address decoding, wait-state generation, and interrupt steering for ISA, PCI, or proprietary backplane buses, while the 240-pin RQFP exposes enough I/O to bridge two wide buses simultaneously. The FLEX 8000 family's predictable interconnect delays let the designer hit set-up/hold timing without manual retiming on every iteration, which is critical when bus interfaces run near their frequency ceiling. SRAM reconfiguration allows late-stage bus-protocol fixes without respinning the board.
Inirekomenda
ASIC Prototyping
The EPF8820ARC240-3N is a natural fit for ASIC prototyping because the FLEX 8000 architecture preserves netlist-level equivalence with gate-array ASICs while allowing incremental design changes during emulation. With 672 LEs and a high-I/O RQFP-240 package, the device can map medium-complexity ASIC blocks (5K-15K gate equivalents) and re-use real-world I/O pads and bus timings before tape-out. The SRAM configuration can be reloaded in seconds, so design turn-around is far faster than masked ASIC respins.
Inirekomenda
Industrial Control Front-Ends
The EPF8820ARC240-3N suits industrial control front-ends because its 5 V tolerant I/O directly interfaces to legacy 24 V-isolated signal conditioning, while the SRAM reconfiguration supports late-binding of field-specific logic profiles (different sensor calibrations per product variant). The FLEX 8000 architecture's deterministic interconnect delay gives repeatable timing for encoder decoding, PWM generation, and quadrature input processing. Designers can ship one hardware platform with multiple configuration bitstreams loaded on demand.
Inirekomenda
Telecommunications Backplane Bridging
The EPF8820ARC240-3N fits telecom backplane bridging because its 672 LEs handle serial-to-parallel conversion, clock-domain crossing, and HDLC/PPP-style framing without external glue, while the RQFP-240 package exposes enough I/O to terminate parallel backplane data and control signals in parallel. FLEX 8000's JTAG boundary-scan (IEEE 1149.1) simplifies board-level test on densely populated backplane assemblies. The -3 speed grade supports common telecom clock rates up to the mid-tens of MHz with comfortable timing margin.
Inirekomenda
Test & Measurement Instrumentation
The EPF8820ARC240-3N is a strong fit for test and measurement instrumentation because its SRAM reconfiguration lets a single hardware platform emulate multiple instrument personalities (logic analyzer, pattern generator, protocol exerciser) by simply loading a new bitstream. The 240-pin RQFP exposes enough I/O for parallel probe channels and trigger fan-out. Designers can update test patterns in the field without opening the instrument, which shortens customer-driven feature cycles.
Inirekomenda
Legacy 74-Series Logic Replacement
The EPF8820ARC240-3N consolidates dozens of 74-series TTL gates into a single package, dramatically reducing board area and improving noise immunity on legacy industrial designs. With 672 LEs, the device typically replaces 30-60 SSI/MSI packages, and SRAM reconfiguration allows the same board to support multiple product variants by swapping the configuration bitstream. The 5 V supply is directly compatible with legacy 5 V logic rails, eliminating the need for level shifters.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EPF8820ARC240-3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EPF8820ARC240-3 | EPF8820ARC240-4 | EPF8820ARC240-4N | EPF8820ARC240-2 | EPF8820ARC208-3N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP (RC240) | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 208-pin RQFP (RC208) - different |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 672 | 672 - same | 672 - same | 672 - same | 672 - same | 672 - same |
| Speed Grade | -3 (standard) | -3 - same | -4 (slower) | -4 (slower) | -2 (faster) | -3 - same |
| RoHS Compliance | Yes (RoHS3, lead-free per Alibaba listing) | No (SnPb lead finish) | No (SnPb lead finish) | Yes (RoHS) | No (SnPb lead finish) | Yes (RoHS) |
| Supply Voltage | 5 V | 5 V - same | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| Configuration Memory | EPC1 / EPC1213 / EPC1064 / EPC1441 | Same family - same | Same family - same | Same family - same | Same family - same | Same family - same |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Pangunahing mga Pagkakaiba
- RoHS3-compliant lead-free finish (kumpara saEPF8820ARC240-3)
- Standard -3 speed grade balances cost and performance (kumpara saEPF8820ARC240-2)
- Highest I/O count in the FLEX 8000 EPF8820 family (kumpara saEPF8820ARC208-3N)
Talaan ng Disenyo
The EPF8820ARC240-3N is configured at every power-up by an external serial or parallel memory. A common design pitfall is to omit the configuration device entirely and assume the FPGA retains state - it does not, because FLEX 8000 is SRAM-based. Always include the EPC1, EPC1213, EPC1064, or EPC1441 configuration device on the board, and verify the nSTATUS and CONF_DONE handshake lines are pulled up correctly per the Altera FLEX 8000 datasheet configuration chapter.
Estimated: the 240-pin RQFP (RC240) package has a body size of approximately 32 mm x 32 mm with 0.5 mm pitch leads. Allocate a PCB land pattern with proper solder mask expansion and use a fine-pitch QFP socket or solder directly with reflow. Place the EPC configuration device within 50 mm of the FPGA to avoid signal-integrity issues on the configuration clock (DCLK) and data (DATA0) lines. Decouple the 5 V supply with at least one 100 uF bulk cap and four 0.1 uF high-frequency caps distributed around the FPGA footprint.
Estimated: the FLEX 8000 family consumes roughly 0.5 W to 1.5 W static at 5 V depending on utilization and clock rate; design with thermal headroom for legacy industrial (-40 C to +85 C) operation. Provide a copper pour on inner PCB layers beneath the RQFP to spread heat, and ensure airflow is not blocked in enclosed chassis. Note that exact junction-to-ambient thermal resistance for the RC240 package is not published in the legacy datasheet excerpt available on alldatasheet.com and should be requested from Intel PSG if needed.
Impormasyon ng Pagsunod sa Kautusan
RoHS3 compliance confirmed per Alibaba supplier listing dated 2026-09-12. REACH, halogen-free, and conflict-minerals status not specified in supplier data - request from Intel PSG legacy support if needed for new product certification.
