EPF8820ARC240-3N - FLEX 8000 672-LE FPGA | Intel / Altera
MPN: EPF8820ARC240-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $21.3 | $2,130.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.4 | $16,400.00 |
Drop-in alternatives for EPF8820ARC240-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8820ARC240-3
✅ Drop-In✓ In Stock
$24 / Unit
View Datasheet →EPF8820ARC240-4
✅ Drop-In✓ In Stock
$17.2 / Unit
View Datasheet →EPF8820ARC240-4N
✅ Drop-In✓ In Stock
$17.5 / Unit
View Datasheet →EPF8820ARC240-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8820ARC208-3N
✅ Drop-In✓ In Stock
$85 / Unit
View Datasheet →EPF8820ARC240-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 672 |
| Process Technology | CMOS, SRAM-based |
| Package | 240-pin RQFP (RC240) |
| Speed Grade | -3 (standard performance) |
| Supply Voltage | 5 V |
| Configuration Method | SRAM, loaded via EPC1 / EPC1213 / EPC1064 / EPC1441 serial configuration device or parallel EPROM |
| In-System Reconfigurable | Yes (SRAM-based) |
| Boundary-Scan Support | JTAG-compliant (IEEE 1149.1) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | RoHS3 Compliant |
| Manufacturer | Altera Corporation (now Intel PSG) |
| Dating Code Window (verified supplier stock) | Within 3 years of mfg per Alibaba listing as of 2026-09-12 |
EPF8820ARC240-3N 240-pin rqfp (rc240) Pin Configuration Guide
Complete pinout information for EPF8820ARC240-3N (240-pin rqfp (rc240) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ARC240-3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ARC240-3N is suitable for 6 applications: Peripheral Bus Glue Logic, ASIC Prototyping, Industrial Control Front-Ends, Telecommunications Backplane Bridging, Test & Measurement Instrumentation, Legacy 74-Series Logic Replacement.
Peripheral Bus Glue Logic
The EPF8820ARC240-3N fits peripheral bus glue logic because its 672 logic elements comfortably absorb address decoding, wait-state generation, and interrupt steering for ISA, PCI, or proprietary backplane buses, while the 240-pin RQFP exposes enough I/O to bridge two wide buses simultaneously. The FLEX 8000 family's predictable interconnect delays let the designer hit set-up/hold timing without manual retiming on every iteration, which is critical when bus interfaces run near their frequency ceiling. SRAM reconfiguration allows late-stage bus-protocol fixes without respinning the board.
Recommended
ASIC Prototyping
The EPF8820ARC240-3N is a natural fit for ASIC prototyping because the FLEX 8000 architecture preserves netlist-level equivalence with gate-array ASICs while allowing incremental design changes during emulation. With 672 LEs and a high-I/O RQFP-240 package, the device can map medium-complexity ASIC blocks (5K-15K gate equivalents) and re-use real-world I/O pads and bus timings before tape-out. The SRAM configuration can be reloaded in seconds, so design turn-around is far faster than masked ASIC respins.
Recommended
Industrial Control Front-Ends
The EPF8820ARC240-3N suits industrial control front-ends because its 5 V tolerant I/O directly interfaces to legacy 24 V-isolated signal conditioning, while the SRAM reconfiguration supports late-binding of field-specific logic profiles (different sensor calibrations per product variant). The FLEX 8000 architecture's deterministic interconnect delay gives repeatable timing for encoder decoding, PWM generation, and quadrature input processing. Designers can ship one hardware platform with multiple configuration bitstreams loaded on demand.
Recommended
Telecommunications Backplane Bridging
The EPF8820ARC240-3N fits telecom backplane bridging because its 672 LEs handle serial-to-parallel conversion, clock-domain crossing, and HDLC/PPP-style framing without external glue, while the RQFP-240 package exposes enough I/O to terminate parallel backplane data and control signals in parallel. FLEX 8000's JTAG boundary-scan (IEEE 1149.1) simplifies board-level test on densely populated backplane assemblies. The -3 speed grade supports common telecom clock rates up to the mid-tens of MHz with comfortable timing margin.
Recommended
Test & Measurement Instrumentation
The EPF8820ARC240-3N is a strong fit for test and measurement instrumentation because its SRAM reconfiguration lets a single hardware platform emulate multiple instrument personalities (logic analyzer, pattern generator, protocol exerciser) by simply loading a new bitstream. The 240-pin RQFP exposes enough I/O for parallel probe channels and trigger fan-out. Designers can update test patterns in the field without opening the instrument, which shortens customer-driven feature cycles.
Recommended
Legacy 74-Series Logic Replacement
The EPF8820ARC240-3N consolidates dozens of 74-series TTL gates into a single package, dramatically reducing board area and improving noise immunity on legacy industrial designs. With 672 LEs, the device typically replaces 30-60 SSI/MSI packages, and SRAM reconfiguration allows the same board to support multiple product variants by swapping the configuration bitstream. The 5 V supply is directly compatible with legacy 5 V logic rails, eliminating the need for level shifters.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARC240-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARC240-3 | EPF8820ARC240-4 | EPF8820ARC240-4N | EPF8820ARC240-2 | EPF8820ARC208-3N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP (RC240) | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 240-pin RQFP (RC240) - same | 208-pin RQFP (RC208) - different |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 672 | 672 - same | 672 - same | 672 - same | 672 - same | 672 - same |
| Speed Grade | -3 (standard) | -3 - same | -4 (slower) | -4 (slower) | -2 (faster) | -3 - same |
| RoHS Compliance | Yes (RoHS3, lead-free per Alibaba listing) | No (SnPb lead finish) | No (SnPb lead finish) | Yes (RoHS) | No (SnPb lead finish) | Yes (RoHS) |
| Supply Voltage | 5 V | 5 V - same | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| Configuration Memory | EPC1 / EPC1213 / EPC1064 / EPC1441 | Same family - same | Same family - same | Same family - same | Same family - same | Same family - same |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price @ qty 1 (USD, as of 2026-09-12) | 28.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- RoHS3-compliant lead-free finish (vs EPF8820ARC240-3)
- Standard -3 speed grade balances cost and performance (vs EPF8820ARC240-2)
- Highest I/O count in the FLEX 8000 EPF8820 family (vs EPF8820ARC208-3N)
Design Notes
The EPF8820ARC240-3N is configured at every power-up by an external serial or parallel memory. A common design pitfall is to omit the configuration device entirely and assume the FPGA retains state - it does not, because FLEX 8000 is SRAM-based. Always include the EPC1, EPC1213, EPC1064, or EPC1441 configuration device on the board, and verify the nSTATUS and CONF_DONE handshake lines are pulled up correctly per the Altera FLEX 8000 datasheet configuration chapter.
Estimated: the 240-pin RQFP (RC240) package has a body size of approximately 32 mm x 32 mm with 0.5 mm pitch leads. Allocate a PCB land pattern with proper solder mask expansion and use a fine-pitch QFP socket or solder directly with reflow. Place the EPC configuration device within 50 mm of the FPGA to avoid signal-integrity issues on the configuration clock (DCLK) and data (DATA0) lines. Decouple the 5 V supply with at least one 100 uF bulk cap and four 0.1 uF high-frequency caps distributed around the FPGA footprint.
Estimated: the FLEX 8000 family consumes roughly 0.5 W to 1.5 W static at 5 V depending on utilization and clock rate; design with thermal headroom for legacy industrial (-40 C to +85 C) operation. Provide a copper pour on inner PCB layers beneath the RQFP to spread heat, and ensure airflow is not blocked in enclosed chassis. Note that exact junction-to-ambient thermal resistance for the RC240 package is not published in the legacy datasheet excerpt available on alldatasheet.com and should be requested from Intel PSG if needed.
Compliance Information
RoHS3 compliance confirmed per Alibaba supplier listing dated 2026-09-12. REACH, halogen-free, and conflict-minerals status not specified in supplier data - request from Intel PSG legacy support if needed for new product certification.
