EPM570F256I5N vs EPM570F256C3N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM570F256I5N tarafından Intel ve EPM570F256C3N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EPM570F256I5N | EPM570F256C3N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements | 570 | — |
| Macrocells | 440 | — |
| User I/O Count | 160 | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory | 8 kbits (9220 bits) | — |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | — |
| Maximum Internal Frequency | 304 MHz | — |
| Global Clock Networks | 4 | — |
| Global Clear/Reset Signals | 2 | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) | — |
| Paket | 256-ball FineLine BGA (17 mm x 17 mm) | 256-ball FBGA (FineLine BGA) |
| Montaj Türü | Surface Mount | Surface Mount |
| İşletim Sıcaklığı | -40C to +100C (TJ, industrial) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| RoHS Durumu | Compliant (N suffix = Pb-free) | Compliant (per DigiKey listing) |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| MSL Seviyesi | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |