M1AFS1500-2FG676I vs M1AFS1500-1FG676I Karşılaştırma

Ayrıntılı yan yana karşılaştırma M1AFS1500-2FG676I tarafından Microchip Technology ve M1AFS1500-1FG676I tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Aktif
Microchip Technology
M1AFS1500-1FG676I M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I ✓ Aktif

Özellik Karşılaştırması

Parametre M1AFS1500-2FG676I M1AFS1500-1FG676I
Marka Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Aktif
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 1.5 M —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V 1.5 V
Speed Grade 2 -1
Paket 676-ball FBGA (FG676) —
Montaj Türü Surface Mount —
Configuration Memory On-chip flash (non-volatile, instant-on) —
İşletim Sıcaklığı Aralığı Industrial (I suffix) -40C to +100C —
Embedded Analog Features On-chip ADC, clock conditioning circuit (CCC), power-on reset —
External Configuration Device Not required —
RoHS Durumu RoHS Non-Compliant (contains lead) RoHS Non-Compliant
Lead Free Status Contains Lead Contains Lead
Packaging Method Tray —
Number of User I/O [DATA_NEEDED: Number of User I/O] —
Embedded SRAM [DATA_NEEDED: Embedded SRAM capacity] —
DLL/PLL Blocks [DATA_NEEDED: Number of CCC blocks] —
Manufacturer Part Number — M1AFS1500-1FG676I
Manufacturer — Microchip Technology (Microsemi)
Product Type — Fusion Mixed-Signal FPGA
Number of Gates — 1.5 M
Number of I/O — 252
Paket / Kas — 676-Pin FBGA
Montaj Stili — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Nem Hassasiyet Seviyesi (MSL) — 3 (168 Hours)
Peak Reflow Time — 30 s
Packaging — Tray

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