MMA6262QR2-FR vs MMA6263QR2 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MMA6262QR2-FR tarafından NXP Semiconductors ve MMA6263QR2 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndNXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MMA6262QR2-FR | MMA6263QR2 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Yaşam Döngüsü Durumu | NRND | Son Alış Zamanı |
| Duyarlılık Türü | Accelerometer, dual-axis (X, Y) | Accelerometer, Dual Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g (g-select to ±6 g) |
| Sensitivity | 800 mV/g (typical, ratiometric) | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) |
| Çıkış Türü | Analog, ratiometric to VDD | Analog, ratiometric voltage |
| Number of Axes | 2 (X, Y) | — |
| Bandwidth (-3 dB) | 150 Hz (internal 1-pole LPF) | — |
| Supply Voltage (VDD) | 2.2 V to 3.6 V | — |
| Besleme Akımı | 2 mA (typical) | — |
| Zero-g Output (ratiometric) | VDD/2 (typical) | — |
| İşletim Sıcaklığı | -40 °C to +105 °C | — |
| Shock Survival | 2000 g | — |
| Self-Test | Yes (external logic input) | Logic-level input on each axis |
| Paket | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad | 16-QFN-EP (6x6 mm) with exposed pad |
| Montaj Türü | Surface Mount | Surface Mount |
| RoHS Durumu | RoHS Compliant (Contains Lead in some variants - check datasheet) | RoHS Compliant |
| MEMS Process | Capacitive micromachined (surface micromachining) | — |
| Besleme Gerilimi | — | 3.3 V nominal (range per datasheet) |
| Bandwidth | — | 900 Hz sensor bandwidth |
| Low-Pass Filter | — | 1-pole on-chip, ~400 Hz cutoff |
| Zero-g Output (Typ) | — | 1.65 V (mid-supply) |
| Temperature Compensation | — | On-chip factory trimmed |
| Lead Status | — | Contains Lead (legacy package) |
| Operating Principle | — | Capacitive micromachined (MEMS) |