EP1K30TC144-3N - 30K Gate ACEX-1K FPGA 144-LQFP | Intel / Altera
MPN: EP1K30TC144-3N ⚠ Son Satın AlmaEP1K30TC144-3N Genel Bakış
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be redefined after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, non-volatile, lower density) and ASICs (fixed-function, highest density). ACEX-1K specifically targets low-cost, high-volume glue-logic and bus-interface applications where discrete logic or a small ASIC would otherwise be required.
Key features of the EP1K30TC144-3N include an enhanced embedded array structure (EAB - Embedded Array Block) that efficiently implements megafunctions such as dual-port RAM, ROM, FIFO and DSP multipliers. The device supports in-system programmability via a serial configuration interface, IEEE 1149.1 JTAG boundary-scan testing, and a MultiVolt™ I/O interface allowing the I/O bank voltage to differ from the core voltage for mixed-voltage system integration.
The architecture consists of 216 Logic Array Blocks (LABs), each containing 8 Logic Elements (LEs), and 6 Embedded Array Blocks (EABs) providing 4,096 bits of dual-port RAM each. The speed grade -3 indicates the slowest of the ACEX-1K speed tiers and is suitable for cost-sensitive industrial and consumer designs where timing closure is not aggressive.
Typical applications include glue-logic replacement, bus interfacing (PCI bridge logic, legacy 8/16-bit microprocessor bus translation), industrial control I/O expansion, communications line-card pre-processing, and low-volume prototyping. The 102 user I/O pins make it well suited to bridging multiple parallel buses in industrial and embedded systems.
Designers should note that the ACEX-1K family is mature and approaching end-of-life; the EP1K30TC144-3N is widely available on the secondary market but not recommended for new designs where the Cyclone® series offers equivalent density with modern features, lower core voltage, and active product support.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the EP1K30 family, and practical design notes not found in the original ACEX-1K datasheet, providing information gain over distributor-only catalog listings.
Drop-in alternatifler için EP1K30TC144-3N — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP1K30TC144-3N (aynı form faktörü ve ayağa oturma) — farklı olan Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.
EP1K30TC144-3
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1K30TC144-2N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1K30TC144-1N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1K30TC144-2
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1K30TC144-1
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP1K30TC144-3N Maksimum Değerlendirmeler & Elektriksel Özellikler
| Series | ACEX-1K |
| Family | ACEX-1K® Field Programmable Gate Array |
| Typical Gates | 30,000 |
| Logic Elements (LE) | 1,728 |
| Logic Array Blocks (LAB) | 216 |
| Embedded Array Blocks (EAB) | 6 |
| Total RAM Bits | 24,576 |
| User I/O Pins | 102 |
| Process Technology | 0.22 µm CMOS (SRAM-based) |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -3 (slowest tier of ACEX-1K) |
| Paket | 144-pin LQFP (TQFP) 22x22 mm |
| Montaj Türü | Surface Mount |
| Configuration | SRAM, in-system programmable via serial / JTAG |
| RoHS Durumu | Unknown (legacy part - verify with distributor) |
EP1K30TC144-3N 144-pin lqfp (tqfp) 22x22 mm Pin Yapısı Kılavuzu
EP1K30TC144-3N (144-pin lqfp (tqfp) 22x22 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP1K30TC144-3N.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP1K30TC144-3N için uygundur 6 uygulamas: Glue-Logic Replacement, Parallel Bus Interface Bridging, Industrial Control I/O Expansion, Legacy Microprocessor Bus Translation, Communication Line-Card Pre-Processing, Low-Volume Prototype and Emulation Platform.
Glue-Logic Replacement
The EP1K30TC144-3N replaces discrete 74-series and PAL/GAL glue logic on legacy industrial boards, consolidating address decoding, chip-select generation, and bus-control logic into a single programmable device. Its 1,728 logic elements and 6 embedded array blocks (EABs) provide ample capacity for typical board-level glue functions, while the 102 user I/O pins in the 144-LQFP package expose enough pins to drive multiple peripheral buses simultaneously. The SRAM-based configuration allows in-system reprogramming via JTAG during board bring-up, a major advantage over hardwired PLAs. The 2.5 V core supply and MultiVolt™ I/O make it straightforward to bridge 3.3 V and 5 V peripherals on mixed-voltage boards. Designers should note that -3 speed grade is the slowest tier, so timing-critical paths may require the EP1K30TC144-2N instead.
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Parallel Bus Interface Bridging
With 102 user I/O pins and 1,728 logic elements, the EP1K30TC144-3N is well suited as a bus-bridge between legacy 8-bit or 16-bit microprocessors and modern peripherals such as SDRAM controllers, PCI bridge devices, or high-speed serial transceivers. The 144-LQFP package provides sufficient I/O to expose both ends of the bridge simultaneously, eliminating the need for external bus switches. Embedded array blocks can implement FIFO buffers up to 4,096 bits each, enabling transparent bus-width conversion with on-chip buffering. The 200 MHz internal performance at speed grade -3 supports typical bus frequencies up to 50 MHz on the external pins with comfortable timing margin. JTAG-based in-system programmability allows late-stage bus-protocol changes without PCB rework.
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Industrial Control I/O Expansion
Industrial controllers commonly require scanning large numbers of digital inputs and driving banks of relays, solenoids, and indicator LEDs, all of which the EP1K30TC144-3N handles natively through its 102 user I/O pins. The 1,728 logic elements can implement debounce filters, pulse-stretching circuits, encoder quadrature decoders, and PWM generators without external components. The device's industrial temperature range and 144-LQFP surface-mount package suit factory-automation boards where through-hole legacy PLDs are being phased out. EAB-based dual-port RAM blocks allow zero-overhead sharing of I/O status between the FPGA and an external microcontroller. For new industrial designs, however, Cyclone-series equivalents offer better long-term supply assurance and lower power consumption.
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Legacy Microprocessor Bus Translation
The EP1K30TC144-3N acts as a translator between legacy 8/16-bit microprocessors (e.g. 8051, Z80, 68k) and modern memory or peripheral devices, offloading address-latch, bank-switch, and wait-state generation logic. The 102 user I/O count comfortably accommodates both the legacy CPU bus and the modern target bus simultaneously, avoiding the need for external bus transceivers. The SRAM-based configuration supports rapid protocol changes during development, and JTAG in-system programmability means a single board can be reprogrammed for different CPU families. With 6 EABs offering 24,576 bits of dual-port RAM, the device can implement on-chip mailbox RAM for inter-CPU communication without consuming external memory. The 200 MHz internal performance at speed grade -3 supports legacy bus frequencies up to 50 MHz with margin.
Önerilen
Communication Line-Card Pre-Processing
In telecom and datacom line cards, the EP1K30TC144-3N performs low-latency pre-processing functions such as cell/packet delineation, framing, CRC verification, and timeslot switching before handing data to an ASIC or network processor. The 102 user I/O pins allow direct connection to multiple E1/T1 framers, Ethernet PHYs, or serial背plane interfaces without external bus expanders. EAB-based dual-port RAM blocks serve as elastic stores for rate adaptation between trunk and backplane clocks. The SRAM configuration supports field upgrades for new framing protocols via JTAG. Designers targeting -3 speed grade should validate that the design meets timing at the slowest PVT corner; EP1K30TC144-2N is recommended where timing closure is aggressive.
Önerilen
Low-Volume Prototype and Emulation Platform
Designers and labs use the EP1K30TC144-3N on JTAG-programmable daughter cards to prototype ASIC designs, emulate legacy controllers, or validate custom bus protocols before committing to silicon. The 144-LQFP package is breadboard-friendly via adapters, and the 1,728 logic elements can host moderately complex state machines, FIFO controllers, and memory-mapped register files. In-system JTAG programming allows iterative design changes in minutes, making the device valuable in university and research environments. The 24,576 bits of dual-port RAM distributed across 6 EABs is enough to implement trace buffers and pattern generators for protocol validation. Note that ACEX-1K uses legacy Altera Quartus II design software (now Intel Quartus Prime 13.0sp1 or earlier), so design entry should be frozen on a compatible tool version.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP1K30TC144-3N — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP1K30TC144-3 | EP1K30TC144-2N | EP1K30TC144-1N | EP1K30TC144-2 | EP1K30TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -3 | -3 (same) | -2 (faster) | -1 (fastest) | -2 (faster) | -1 (fastest) |
| Lead-Free (N suffix) | Yes | No (SnPb finish) | Yes | Yes | No (SnPb finish) | No (SnPb finish) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature |
Ana Farklılayıcılar
- Lead-free terminal finish (N suffix) for ROHS-compliant assembly (karşılaştırma:EP1K30TC144-3)
- Faster speed grade available in same package (karşılaştırma:EP1K30TC144-2N)
- Lowest-cost entry point in the 144-LQFP EP1K30 family (karşılaştırma:EP1K30TC144-1N)
Tasarım Notları
ACEX-1K devices are SRAM-based, so they lose their configuration on power-down. In production designs an external configuration memory (EPC1, EPC2, or compatible EPC device) is required to load the bitstream at power-up. The JTAG interface can be used for in-system reprogramming during development but cannot replace the boot memory. Designers new to ACEX-1K frequently forget the configuration memory, causing the FPGA to remain unconfigured after power cycling.
The 144-LQFP package has limited thermal dissipation compared with BGA or QFP-with-exposed-pad alternatives. Estimated: at 2.5 V core supply and typical industrial utilization (50-70% LE switching at 100 MHz), the EP1K30TC144-3N dissipates approximately 0.5-1.0 W internally, requiring at least 4 square inches of unbroken ground plane beneath the package. For sealed enclosures without forced airflow, derate the clock frequency or limit utilization to keep junction temperature below 100 °C.
ACEX-1K MultiVolt I/O banks support independent VCCIO voltages per bank, but all VCCIO pins in a given bank must share the same supply. Decoupling requires at least one 0.1 µF ceramic capacitor per VCC pin and one 10 µF bulk capacitor per supply rail, placed within 5 mm of the package. The 144-LQFP fine-pitch lead footprint demands 0.4 mm pitch traces and 0.2 mm via-in-pad or tented vias to escape the inner pins; use a 4-layer PCB stack-up with dedicated ground and power planes for signal-integrity compliance.
Uyumluluk Bilgisi
Lead-free per N suffix per Altera ordering information; specific RoHS / REACH / halogen-free status for ACEX-1K legacy parts should be verified with the Intel product declaration document because ACEX-1K pre-dates the harmonized compliance documentation format. AEC-Q100 is not applicable for FPGAs in this product class.
