EP20K600CF1020C8 - APEX 20KC 600K Gate FPGA, 1020-BGA | Altera
MPN: EP20K600CF1020C8 ✗ Son Kullanım ZamanıEP20K600CF1020C8 Genel Bakış
What is an APEX 20KC FPGA? The APEX 20KC family belongs to the broader category of programmable logic devices (PLDs), which sit hierarchically under FPGAs (Field-Programmable Gate Arrays) and CPLDs (Complex Programmable Logic Devices). APEX 20KC extends the original APEX 20K architecture by embedding dedicated True-Look-Up-Table memory blocks called ESBs (Embedded System Blocks), enabling single-chip implementation of logic, on-chip memory, and specialty functions such as CAMs and FIFOs. It occupies a specific position in the historical Altera roadmap between APEX 20K (logic-only) and the later Stratix family.
Key features include MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces, hot-socketing capability, JTAG IEEE 1149.1 boundary-scan testing, and a 4-wire serial configuration interface. The PLLs provide flexible clock management, while the ESBs can be configured as dual-port RAM up to 311 Kbit, ROM, or CAM. The device also supports DDR SDRAM and ZBT SRAM external memory interfaces through dedicated I/O circuitry.
Typical applications include telecommunications line cards, PCI bridge designs, high-speed digital signal processing, custom microcontroller implementation, and ASIC prototyping. Industrial designers frequently use the EP20K600CF1020C8 in 3.3 V backplane designs where its 588 I/Os replace multiple discrete glue-logic devices.
When designing with this part, ensure the PCB accommodates the 1.00 mm BGA pitch and that the multi-voltage I/O banks are powered correctly. Quiescent supply current rises significantly with logic utilization, so thermal dissipation analysis is recommended at >70 % utilization.
Drop-in alternatifler için EP20K600CF1020C8 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP20K600CF1020C8 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
EP20K600CF1020C7
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K600CB652C8
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K600CB652C8N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K600CB672C8
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K600CB672C7
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K600CF1020C8 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | APEX 20KC |
| Series | EP20K600 |
| Logic Elements / Cells | 24,320 |
| System Gates | 600,000 |
| Embedded Memory (ESB) | 311 Kbit (max) |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Maximum Internal Frequency | 301.21 MHz (C8 speed grade) |
| User I/O Pins | 588 |
| Dedicated Inputs | 4 |
| Paket | 1020-ball FC-FBGA (1.00 mm pitch) |
| İşletim Sıcaklığı | 0 °C to +85 °C (commercial, "C") |
| Speed Grade | C8 |
| Configuration Interface | Serial / JTAG (IEEE 1149.1) |
| PCI Compliance | PCI SIG Local Bus Spec Rev 2.2, 32/64-bit, 33/66 MHz, 3.3 V |
EP20K600CF1020C8 1020-ball fc-fbga (1.00 mm pitch) Pin Yapısı Kılavuzu
EP20K600CF1020C8 (1020-ball fc-fbga (1.00 mm pitch) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP20K600CF1020C8.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP20K600CF1020C8 için uygundur 6 uygulamas: Telecommunications Line Card, ASIC Prototyping Platform, PCI Bus Bridge, Industrial Automation Controller, High-Speed Digital Signal Processing, Custom Microcontroller / Soft-Core CPU.
Telecommunications Line Card
The EP20K600CF1020C8's 588 user I/Os and PCI 2.2 compliance make it well-suited for telecom line cards aggregating T1/E1 or ATM traffic. Its 311 Kbit embedded memory implements per-channel FIFOs without external SRAM, while the 301 MHz internal frequency supports 66 MHz PCI 64-bit system bus bridging with comfortable timing margin.
Önerilen
ASIC Prototyping Platform
With 24,320 logic elements and 600 K system gates, the EP20K600CF1020C8 emulates ASICs up to ~500 K gates before partitioning. Its ESBs map cleanly to ASIC SRAM/CAM blocks, and MultiVolt I/O (1.8/2.5/3.3 V) connects directly to legacy ASIC pin voltages, shortening prototype-to-silicon bring-up cycles.
Önerilen
PCI Bus Bridge
The EP20K600CF1020C8 is PCI SIG 2.2 compliant for both 32-bit and 64-bit, 33 MHz and 66 MHz operation at 3.3 V. Designers use it as a PCI-to-PCI bridge or custom peripheral controller, leveraging the 588 I/Os to expose multiple PCI segments plus local processor and memory buses on one device.
Önerilen
Industrial Automation Controller
Industrial motion-control and PLC platforms benefit from the EP20K600CF1020C8's 588 I/Os, which directly drive hundreds of opto-isolated digital channels. The 1.8 V core plus 3.3 V I/O simplifies interfacing to legacy 5 V-tolerant logic via external buffers, while the 0 °C to +85 °C commercial temperature range suits factory-floor enclosures.
Önerilen
High-Speed Digital Signal Processing
The 301 MHz internal frequency of the EP20K600CF1020C8 enables multi-channel FIR filtering and FFT datapaths at sample rates above 100 MSPS. ESBs configured as dual-port RAM store tap coefficients, while the 588 I/Os stream data to external DDR SDRAM or ZBT SRAM at sustained throughput without bus contention.
Önerilen
Custom Microcontroller / Soft-Core CPU
The 600 K system gates comfortably host 32-bit soft processors such as Nios, ARM7TDMI, or OpenRISC alongside peripherals. Designers implement UARTs, timers, DMA, and external bus controllers in the EP20K600CF1020C8's logic fabric, using ESBs as register files and cache, while exposing 588 I/Os as GPIO and bus pins.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP20K600CF1020C8 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP20K600CF1020C7 | EP20K600CB652C8 | EP20K600CB652C8N | EP20K600CB672C8 | EP20K600CB672C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (1.00 mm pitch) | 1020-ball FC-FBGA (1.00 mm pitch) - same | 652-ball FBGA - smaller | 652-ball FBGA - smaller | 672-ball FBGA - smaller | 672-ball FBGA - smaller |
| Speed Grade | C8 (~301 MHz) | C7 (~260 MHz) | C8 (~301 MHz) | C8 (~301 MHz) | C8 (~301 MHz) | C7 (~260 MHz) |
| User I/O Pins | 588 | 588 | 380 | 380 | 408 | 408 |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K | 600 K |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (ESB) | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Ana Farklılayıcılar
- Largest I/O count in the APEX 20KC family (karşılaştırma:EP20K600CB652C8)
- Highest speed grade available in this footprint (karşılaştırma:EP20K600CF1020C7)
- Largest embedded memory budget at full I/O (karşılaştırma:EP20K600CB672C8)
Tasarım Notları
The 1020-ball FC-FBGA package uses a 1.00 mm ball pitch. PCB layout requires HDI microvia stack-ups with 0.4 mm via pitch escape routing, plus a continuous ground plane beneath the BGA for return-current integrity. Recommended microvia aspect ratio is 1:1 or smaller for reliable assembly yield.
Core current scales with toggle rate and logic utilisation. At >70 % utilisation the EP20K600CF1020C8 typically draws 1.5-2.5 A on the 1.8 V VCCINT rail, so use a low-dropout regulator with at least 3 A headroom and decouple each VCCINT ball pair with 0.1 µF plus 10 µF bulk ceramic capacitors placed within 5 mm of the package.
The FC-FBGA package relies on PCB thermal conduction rather than a heatsink. At 2 A × 1.8 V ≈ 3.6 W dissipation, ensure the top and inner copper layers connected to GND provide at least 25 cm² of continuous pour. Without this, junction temperature may exceed the 125 °C limit and trigger thermal-shutdown-induced bit corruption during long configuration cycles.
MultiVolt I/O banks must each be powered even if unused, or the unpowered bank draws leakage that prevents configuration. Program all bank VCCIO pins before JTAG configuration. Also, MSEL pins must be tied to the correct logic level to select the configuration mode (Fast Passive Parallel, etc.).
Uyumluluk Bilgisi
RoHS status, lead-free finish, and halogen-free status were not confirmed by the verified web data; manufacturer datasheet predates many of these disclosures. Cross-reference the device marking or contact Altera/Intel for an authoritative certificate of conformance before consumer-market deployment.
