Intel

EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel

MPN: EP3SL200H780I3N ✗ Son Kullanım Zamanı

0.9 V Vdss 780-BBGA, FCBGA Package

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EP3SL200H780I3N Genel Bakış

The Intel (formerly Altera) EP3SL200H780I3N is a high-density, low-power Stratix III L FPGA delivering 200,000 logic elements, 10,901,504 RAM bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Positioned in the Stratix III family, the device targets performance-critical applications that require high logic density, abundant embedded memory, and rich transceiver integration.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short.

Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs.

Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment.

Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required.

When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.

Drop-in alternatifler için EP3SL200H780I3N — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.

Bu Serideki Variantlar

Yedek parça uyumlu olan aynı serideki modeller EP3SL200H780I3N (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Operating Temperature, Family, Mounting Type.

EP3SE260H780I3

Intel

Package: 780-Ball FC-HFBGA / FCBGA

Family: Stratix III E