EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
MPN: EP3SL200H780I3N ✗ اختتامِ زندگیEP3SL200H780I3N جائزہ
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short.
Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs.
Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment.
Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required.
When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.
کے لیے ڈراپ اِن متبادل EP3SL200H780I3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP3SL200H780I3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, Operating Temperature, Family, Mounting Type.
EP3SL200H780I3
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL200H780C2N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL200H780C3N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL200H780C4N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP3SL200H780C4LN
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL200H780C4L
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260H780I3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260H780I3
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL200H780I3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Stratix III L |
| Logic Elements | 200,000 |
| RAM Bits | 10,901,504 |
| User I/O | 488 |
| پیکیج | 780-BBGA, FCBGA |
| Package Pin Count | 780 |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 0.9 V |
| Technology | CMOS, 40 nm |
| Process Node | 40 nm |
| Number of Terminals | 780 |
| Case / Package Code | BGA-780 |
| RoHS اسٹیٹس | Compliant |
| Lead-Free | Yes |
EP3SL200H780I3N bga-780 پن کنفیگریشن گائیڈ
EP3SL200H780I3N (bga-780 پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP3SL200H780I3N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP3SL200H780I3N کے لیے موزوں ہے 6 ایپلیکیشنs: High-Speed Networking Line Cards, ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Performance DSP Pipelines, Video Broadcast and Image Processing, Industrial Automation and Motor Control.
High-Speed Networking Line Cards
The EP3SL200H780I3N's 200,000 logic elements and 488 user I/Os make it ideal for high-end networking line cards that process multiple gigabit Ethernet streams simultaneously. Its 10,901,504 bits of embedded RAM buffer packet headers and lookup tables, while dedicated on-chip multipliers accelerate hash and CRC computations. Compared with a fixed-function network processor, this FPGA lets OEMs customize forwarding tables and protocol handling without silicon redesign. A typical design places the device between PHY transceivers and the host CPU, processing 10 Gbps class traffic in real time.
تجویز کردہ
ASIC Prototyping and Emulation
Designers use the EP3SL200H780H780I3N to emulate large ASIC designs before tape-out, partitioning the ASIC across multiple FPGAs when needed. The 200K logic elements, abundant 10 Mb of embedded RAM, and 488 I/Os allow a single device to absorb substantial portions of a typical SoC, including CPU cores, memory controllers, and custom accelerators. Quartus Prime synthesis maps RTL directly, and the FCBGA-780 footprint supports high-speed signal integrity for ASIC-validation use cases.
تجویز کردہ
Telecom Baseband Processing
In 3G/4G baseband units the EP3SL200H780I3N performs channel coding, modulation, and digital up-conversion across multiple carriers. The 200,000 logic elements implement turbo and LDPC decoders, while the 10,901,504 bits of embedded RAM store soft-bit buffers. The industrial temperature grade (-40C to +100C) supports outdoor or uncontrolled-cabinet installations. Combined with multi-gigabit transceivers, the device can interface directly with RF front-ends and baseband ADC/DAC converters.
تجویز کردہ
High-Performance DSP Pipelines
The EP3SL200H780I3N's dedicated DSP blocks and on-chip memory deliver multi-GigaMAC DSP throughput for radar, sonar, software-defined radio, and medical imaging. The 488 I/Os connect to multi-channel ADCs and DACs, while 10,901,504 bits of RAM act as a fast sample buffer between FFT stages. Designers exploit the Stratix III ALM architecture to implement parallel filter banks, achieving latency orders of magnitude lower than DSP processor alternatives.
تجویز کردہ
Video Broadcast and Image Processing
Broadcast studios deploy the EP3SL200H780I3N for real-time 4K video processing, format conversion, and multi-stream overlay. Its 200,000 logic elements handle motion estimation and deinterlacing pipelines, while 10 Mb embedded RAM provides line and macro-block buffers. The 488 I/Os interface to SDI, HDMI, and DisplayPort bridges. Industrial temperature grade supports broadcast-truck installations where ambient temperatures vary widely.
تجویز کردہ
Industrial Automation and Motor Control
In high-axis-count industrial automation systems the EP3SL200H780I3N orchestrates precision multi-axis motion control, deterministic EtherCAT or PROFINET communication, and high-resolution encoder feedback processing. The 488 I/Os support hundreds of opto-isolated digital inputs and PWM outputs, while DSP blocks execute field-oriented control (FOC) loops with sub-microsecond period. Industrial temperature rating and abundant logic make it a single-chip PLC alternative for complex machines.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP3SL200H780I3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP3SL200H780I3 | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780C4N | EP3SE260H780I3N |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV E |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | -3 | -3 | -2 | -3 | -4 (faster) | -3 |
| RoHS / Lead-Free | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
اہم امتیازی خصوصیات
- Highest-density Stratix III L member with 200K LE (بمقابلہEP3SL200H780C2N)
- Same-package upgrade path to Stratix IV (بمقابلہEP3SE260H780I3N)
- Industrial-grade option in the H780 family (بمقابلہEP3SL200H780C4N)
ڈیزائن نوٹس
The EP3SL200H780I3N can dissipate 5-15 W under typical workloads and up to ~25 W during configuration bursts. The FCBGA-780 package requires a thermal pad with a 4-6 W/(m*K) thermal interface material, plus at least four thermal vias under the lid array to ground/power planes. Designers should follow Intel's Stratix III Thermal Management application note and validate junction temperature in-system using the on-die temperature-sensing diode.
Route all 488 user I/Os on the top layers with reference to a continuous ground/power plane. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS and transceiver pairs. Use Intel's pin-out files and the Quartus Prime Fitter report to break out high-utilization I/O banks; bank-VCCIO must be supplied from a low-noise regulator within 50 mm of the BGA balls.
Do not assume a Stratix III to Stratix IV board swap is pin-to-pin transparent. Despite the same 780-FCBGA package, I/O bank assignments, transceiver placement, and configuration-pin mapping differ, so existing firmware and Quartus II projects require re-compilation against the Stratix IV device library. Always run the Quartus I/O Assignment Analysis before committing the layout.
تعمیل کی معلومات
RoHS compliant per the 'N' suffix in part number. Reach and conflict-minerals status inherited from Intel's Stratix III family declarations. AEC-Q100 not applicable for FPGA ICs. Halogen-free status not explicitly stated in the provided data.