EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
N.º da peça: EP3SL200H780I3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8546.04 | $8.546,04 |
| 10 | $8350 | $83.500,00 |
| 100 | $7900 | $790.000,00 |
| 500 | $7500 | $3.750.000,00 |
| 1.000 | $7200 | $7.200.000,00 |
EP3SL200H780I3N Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short.
Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs.
Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment.
Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required.
When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.
Alternativas drop-in para EP3SL200H780I3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL200H780I3N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Family, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SL200H780I3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7980 / unidade
Ver ficha técnica →EP3SL200H780C2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6050 / unidade
Ver ficha técnica →EP3SL200H780C3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4995 / unidade
Ver ficha técnica →EP3SL200H780C4N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3SL200H780C4LN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1145 / unidade
Ver ficha técnica →EP3SL200H780C4L
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6459.35 / unidade
Ver ficha técnica →EP3SE260H780I3N
✅ Drop-In✓ Em estoque
$3295 / unidade
Ver ficha técnica →EP3SE260H780I3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1410 / unidade
Ver ficha técnica →EP3SL200H780I3N Classificações máximas e características elétricas
| Family | Stratix III L |
| Logic Elements | 200,000 |
| RAM Bits | 10,901,504 |
| User I/O | 488 |
| Encapsulamento | 780-BBGA, FCBGA |
| Package Pin Count | 780 |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 0.9 V |
| Technology | CMOS, 40 nm |
| Process Node | 40 nm |
| Number of Terminals | 780 |
| Case / Package Code | BGA-780 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do EP3SL200H780I3N bga-780
Configuração de pinos para EP3SL200H780I3N (pacote bga-780). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SL200H780I3N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SL200H780I3N é adequado para 6 aplicaçãos: High-Speed Networking Line Cards, ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Performance DSP Pipelines, Video Broadcast and Image Processing, Industrial Automation and Motor Control.
High-Speed Networking Line Cards
The EP3SL200H780I3N's 200,000 logic elements and 488 user I/Os make it ideal for high-end networking line cards that process multiple gigabit Ethernet streams simultaneously. Its 10,901,504 bits of embedded RAM buffer packet headers and lookup tables, while dedicated on-chip multipliers accelerate hash and CRC computations. Compared with a fixed-function network processor, this FPGA lets OEMs customize forwarding tables and protocol handling without silicon redesign. A typical design places the device between PHY transceivers and the host CPU, processing 10 Gbps class traffic in real time.
Recomendado
ASIC Prototyping and Emulation
Designers use the EP3SL200H780H780I3N to emulate large ASIC designs before tape-out, partitioning the ASIC across multiple FPGAs when needed. The 200K logic elements, abundant 10 Mb of embedded RAM, and 488 I/Os allow a single device to absorb substantial portions of a typical SoC, including CPU cores, memory controllers, and custom accelerators. Quartus Prime synthesis maps RTL directly, and the FCBGA-780 footprint supports high-speed signal integrity for ASIC-validation use cases.
Recomendado
Telecom Baseband Processing
In 3G/4G baseband units the EP3SL200H780I3N performs channel coding, modulation, and digital up-conversion across multiple carriers. The 200,000 logic elements implement turbo and LDPC decoders, while the 10,901,504 bits of embedded RAM store soft-bit buffers. The industrial temperature grade (-40C to +100C) supports outdoor or uncontrolled-cabinet installations. Combined with multi-gigabit transceivers, the device can interface directly with RF front-ends and baseband ADC/DAC converters.
Recomendado
High-Performance DSP Pipelines
The EP3SL200H780I3N's dedicated DSP blocks and on-chip memory deliver multi-GigaMAC DSP throughput for radar, sonar, software-defined radio, and medical imaging. The 488 I/Os connect to multi-channel ADCs and DACs, while 10,901,504 bits of RAM act as a fast sample buffer between FFT stages. Designers exploit the Stratix III ALM architecture to implement parallel filter banks, achieving latency orders of magnitude lower than DSP processor alternatives.
Recomendado
Video Broadcast and Image Processing
Broadcast studios deploy the EP3SL200H780I3N for real-time 4K video processing, format conversion, and multi-stream overlay. Its 200,000 logic elements handle motion estimation and deinterlacing pipelines, while 10 Mb embedded RAM provides line and macro-block buffers. The 488 I/Os interface to SDI, HDMI, and DisplayPort bridges. Industrial temperature grade supports broadcast-truck installations where ambient temperatures vary widely.
Recomendado
Industrial Automation and Motor Control
In high-axis-count industrial automation systems the EP3SL200H780I3N orchestrates precision multi-axis motion control, deterministic EtherCAT or PROFINET communication, and high-resolution encoder feedback processing. The 488 I/Os support hundreds of opto-isolated digital inputs and PWM outputs, while DSP blocks execute field-oriented control (FOC) loops with sub-microsecond period. Industrial temperature rating and abundant logic make it a single-chip PLC alternative for complex machines.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL200H780I3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SL200H780I3 | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780C4N | EP3SE260H780I3N |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV E |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | -3 | -3 | -2 | -3 | -4 (faster) | -3 |
| RoHS / Lead-Free | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Principais diferenciais
- Highest-density Stratix III L member with 200K LE (vs EP3SL200H780C2N)
- Same-package upgrade path to Stratix IV (vs EP3SE260H780I3N)
- Industrial-grade option in the H780 family (vs EP3SL200H780C4N)
Notas de projeto
The EP3SL200H780I3N can dissipate 5-15 W under typical workloads and up to ~25 W during configuration bursts. The FCBGA-780 package requires a thermal pad with a 4-6 W/(m*K) thermal interface material, plus at least four thermal vias under the lid array to ground/power planes. Designers should follow Intel's Stratix III Thermal Management application note and validate junction temperature in-system using the on-die temperature-sensing diode.
Route all 488 user I/Os on the top layers with reference to a continuous ground/power plane. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS and transceiver pairs. Use Intel's pin-out files and the Quartus Prime Fitter report to break out high-utilization I/O banks; bank-VCCIO must be supplied from a low-noise regulator within 50 mm of the BGA balls.
Do not assume a Stratix III to Stratix IV board swap is pin-to-pin transparent. Despite the same 780-FCBGA package, I/O bank assignments, transceiver placement, and configuration-pin mapping differ, so existing firmware and Quartus II projects require re-compilation against the Stratix IV device library. Always run the Quartus I/O Assignment Analysis before committing the layout.
Informações de conformidade
RoHS compliant per the 'N' suffix in part number. Reach and conflict-minerals status inherited from Intel's Stratix III family declarations. AEC-Q100 not applicable for FPGA ICs. Halogen-free status not explicitly stated in the provided data.