NXP Semiconductors

LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP

MPN: LPC18S30FET256 ✓ Aktif

2.4 V to 3.6 V Vdss 256-LBGA (17x17 mm) Package 180 MHz Speed 4 kB Memory

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LPC18S30FET256 Genel Bakış

The NXP Semiconductors LPC18S30FET256 is a high-performance ARM Cortex-M3 microcontroller running at up to 180 MHz, featuring 200 kB of on-chip SRAM, ROMless boot architecture, hardware security features, Ethernet MAC, two High-Speed USB 2.0 controllers (one Host/Peripheral, one Host-only), an External Memory Controller (EMC), and a 256-pin LBGA package (17x17 mm). It is part of the LPC1800 series, optimized for industrial control, HMI, motor drive, and secure embedded applications where external flash memory is acceptable.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (SRAM), non-volatile memory (Flash/ROM or external), and programmable peripherals on a single chip. The Cortex-M3 is an ARM-designed 32-bit RISC core featuring Thumb-2 instruction set, deterministic interrupts, and a Nested Vectored Interrupt Controller (NVIC). LPC1800 MCUs sit in NXP's high-performance general-purpose MCU hierarchy (MCU -> Cortex-M3 -> LPC1800 series -> LPC18Sxx sub-family), providing more compute and peripherals than Cortex-M0/M0+ parts while remaining lower-cost than Cortex-M4 parts.

Key features include 200 kB SRAM, 4 kB EEPROM, AES hardware decryption accelerator, two HS-USB ports with on-chip PHY, 10/100 Ethernet MAC with MII/RMII interface, Quad-SPI Flash Interface (SPIFI), EMC supporting SRAM/SDRAM/NOR/NAND, up to 165 GPIO pins, four UARTs, three I2C, two CAN, two SSP/SPI controllers, and a 10-bit ADC with 8 channels. The LBGA256 (17x17 mm) package supports high-density I/O for graphics and external memory expansion.

The LPC18S30FET256 uses NXP's standard peripherals library and CMSIS support, enabling rapid firmware development. Its security subsystem (hardware AES + unique device ID + secure boot) makes it suitable for anti-counterfeiting and tamper-resistant designs. The ROMless architecture requires external SPIFI or EMC flash for code storage, giving designers flexibility in memory density and updateability.

Typical applications include industrial Human-Machine Interfaces (HMI), motor control and drives, factory automation controllers, secure POS terminals, and embedded networking gateways. When designing with the LPC18S30FET256, ensure proper decoupling (100 nF per VDD pin, 4.7 uF bulk), matched-impedance routing for HS-USB and Ethernet differential pairs, and a 12 MHz external crystal with correct load capacitance. The ROMless boot sequence must be validated using the boot ROM via the ISP/UART or SPIFI interface.

Choose LPC18S30FET256E for the industrial-grade variant with extended temperature range. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.

Drop-in alternatifler için LPC18S30FET256 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.

Bu Serideki Variantlar

Yedek parça uyumlu olan aynı serideki modeller LPC18S30FET256 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Core Architecture, LCD Controller, ADC, Mounting Type.

LPC1833JBD144

NXP Semiconductors

Package: LQFP-144 (20 x 20 mm, 0.5 mm pitch)

Core Architecture: 32-bit

LCD Controller: Yes (STN/TFT)