NXP Semiconductors

LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP

MPN: LPC18S30FET256 ✓ Hoạt động

2.4 V to 3.6 V Vdss 256-LBGA (17x17 mm) Package 180 MHz Speed 4 kB Memory

Yêu cầu báo giá

MOQ: 1 |

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LPC18S30FET256 Tóm tắt

The NXP Semiconductors LPC18S30FET256 is a high-performance ARM Cortex-M3 microcontroller running at up to 180 MHz, featuring 200 kB of on-chip SRAM, ROMless boot architecture, hardware security features, Ethernet MAC, two High-Speed USB 2.0 controllers (one Host/Peripheral, one Host-only), an External Memory Controller (EMC), and a 256-pin LBGA package (17x17 mm). It is part of the LPC1800 series, optimized for industrial control, HMI, motor drive, and secure embedded applications where external flash memory is acceptable.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (SRAM), non-volatile memory (Flash/ROM or external), and programmable peripherals on a single chip. The Cortex-M3 is an ARM-designed 32-bit RISC core featuring Thumb-2 instruction set, deterministic interrupts, and a Nested Vectored Interrupt Controller (NVIC). LPC1800 MCUs sit in NXP's high-performance general-purpose MCU hierarchy (MCU -> Cortex-M3 -> LPC1800 series -> LPC18Sxx sub-family), providing more compute and peripherals than Cortex-M0/M0+ parts while remaining lower-cost than Cortex-M4 parts.

Key features include 200 kB SRAM, 4 kB EEPROM, AES hardware decryption accelerator, two HS-USB ports with on-chip PHY, 10/100 Ethernet MAC with MII/RMII interface, Quad-SPI Flash Interface (SPIFI), EMC supporting SRAM/SDRAM/NOR/NAND, up to 165 GPIO pins, four UARTs, three I2C, two CAN, two SSP/SPI controllers, and a 10-bit ADC with 8 channels. The LBGA256 (17x17 mm) package supports high-density I/O for graphics and external memory expansion.

The LPC18S30FET256 uses NXP's standard peripherals library and CMSIS support, enabling rapid firmware development. Its security subsystem (hardware AES + unique device ID + secure boot) makes it suitable for anti-counterfeiting and tamper-resistant designs. The ROMless architecture requires external SPIFI or EMC flash for code storage, giving designers flexibility in memory density and updateability.

Typical applications include industrial Human-Machine Interfaces (HMI), motor control and drives, factory automation controllers, secure POS terminals, and embedded networking gateways. When designing with the LPC18S30FET256, ensure proper decoupling (100 nF per VDD pin, 4.7 uF bulk), matched-impedance routing for HS-USB and Ethernet differential pairs, and a 12 MHz external crystal with correct load capacitance. The ROMless boot sequence must be validated using the boot ROM via the ISP/UART or SPIFI interface.

Choose LPC18S30FET256E for the industrial-grade variant with extended temperature range. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.

Bộ thay thế dễ dàng lắp đặt cho LPC18S30FET256 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với LPC18S30FET256 (cùng hình factor và footprint) — khác nhau ở Package, Core Architecture, LCD Controller, ADC, Mounting Type.

LPC1833JBD144

NXP Semiconductors

Package: LQFP-144 (20 x 20 mm, 0.5 mm pitch)

Core Architecture: 32-bit

LCD Controller: Yes (STN/TFT)

So sánh với LPC18S30FET256 →

LPC1833JBD144E

NXP Semiconductors

Package: LQFP-144 (20x20 mm)

So sánh với LPC18S30FET256 →

LPC1833JET256

NXP Semiconductors

Package: 256-LBGA (JET) 17x17 mm, 0.8 mm pitch

LCD Controller: Yes (STN/TFT, up to 1024x768)

So sánh với LPC18S30FET256 →

LPC1857FET256

NXP Semiconductors

Core Architecture: ARM Cortex-M3 (32-bit)

LCD Controller: Yes (STN/TFT, up to WXGA)

ADC: 10-bit

So sánh với LPC18S30FET256 →

LPC4330FET256

NXP Semiconductors

Package: 256-LBGA (17 x 17 mm, 0.8 mm pitch)

Core Architecture: Dual-core ARM Cortex-M4 + Cortex-M0

LCD Controller: Yes, up to 1024 x 768

So sánh với LPC18S30FET256 →

LPC4357FET256

NXP Semiconductors

Package: LBGA-256 (17 x 17 mm)

Core Architecture: ARM Cortex-M4 + Cortex-M0 (asymmetric dual-core)

LCD Controller: Yes

So sánh với LPC18S30FET256 →

LPC1833JET256

✅ Drop-In

NXP Semiconductors

📦 256-LBGA

ARM Cortex-M3 · 180 MHz · 512 KB · 136 KB · 2.4 V to 3.6 V · 256-LBGA (JET) 17x17 mm, 0.8 mm pitch · 256 · 10/100M MAC with IEEE 1588 support

Liên hệ để biết giá

Xem tài liệu →

LPC1857FET256

✅ Drop-In

NXP Semiconductors

📦 256-LBGA

ARM Cortex-M3 (32-bit) · 180 MHz · 1 MB (1M x 8) · 136 kB · 256-LBGA (17 x 17 mm) · 2.2 V to 3.6 V · 142 · 2 (one with on-chip HS PHY)

Liên hệ để biết giá

Xem tài liệu →

LPC1833JBD144E

✅ Drop-In ⚠️ Thông số chưa được xác minh

NXP Semiconductors

📦 144-LQFP

Arm Cortex-M3 · 180 MHz · 512 KB · 136 KB · 2.2 V to 3.6 V · LQFP-144 (20x20 mm) · Surface Mount · -40C to +105C

Liên hệ để biết giá

Xem tài liệu →

LPC1833JBD144

✅ Drop-In ⚠️ Thông số chưa được xác minh

NXP Semiconductors

📦 144-LQFP

ARM Cortex-M3 · 32-bit · 180 MHz · 512 kB · 136 kB · 2 (one with on-chip HS PHY) · 10/100 MAC (MII/RMII) · Yes (STN/TFT)

Liên hệ để biết giá

Xem tài liệu →

LPC4330FET256

✅ Drop-In

NXP Semiconductors

📦 256-LBGA

Dual-core ARM Cortex-M4 + Cortex-M0 · 204 MHz (M4), 204 MHz (M0) · 264 KB total on-chip · None (flashless; code via external SPIFI) · 2.2 V to 3.6 V · 2 x Hi-Speed USB 2.0 with on-chip PHY · 10/100 MAC (MII/RMII) · 2 x CAN 2.0B

Liên hệ để biết giá

Xem tài liệu →

LPC1837FET256

✅ Drop-In

📦 256-LBGA

same LBGA256 footprint, single Ethernet MAC vs LPC18S30's MAC, otherwise same Cortex-M3 180 MHz core

📋 Tham chiếu thay thế (không có trong danh mục)

LPC18S30FET256 Tỷ lệ tối đa & tính chất điện

Core Architecture	ARM Cortex-M3
Core Width	32-bit
Tần số xung maksimum	180 MHz
On-chip SRAM	200 kB
On-chip EEPROM	4 kB
On-chip Flash	ROMless (external memory required)
Hộp	256-LBGA (17x17 mm)
Operating Voltage	2.4 V to 3.6 V
Nhiệt độ hoạt động	-40 C to +85 C
HS-USB Controllers	2 (one Host/Peripheral, one Host-only)
Ethernet MAC	10/100 Mbps with MII/RMII
External Memory Controller (EMC)	Yes (SRAM/SDRAM/NOR/NAND)
SPIFI (Quad-SPI Flash Interface)	Yes
Hardware AES Decryption	Yes
GPIO Count	Up to 165
UART / I2C / CAN / SSP	4 / 3 / 2 / 2
ADC	10-bit, 8 channels
Cấp MSL	3
Kiểu lắp đặt	Surface Mount
Trạng thái RoHS	Compliant

Hướng dẫn cấu hình chân LPC18S30FET256 256-lbga (17x17 mm)

Cấu hình chân cho LPC18S30FET256 (256-lbga (17x17 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 256-lbga (17x17 mm) cho LPC18S30FET256

Không có dữ liệu chân cụ thể sẵn có cho LPC18S30FET256.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

LPC18S30FET256 phù hợp cho 6 Áp dụngs: Industrial Human-Machine Interface (HMI), Motor Control and Drive, Industrial Ethernet Gateway, Secure Point-of-Sale (POS) Terminal, Building Automation Controller, Embedded Networking Gateway.

🏭

Industrial Human-Machine Interface (HMI)

The LPC18S30FET256's Cortex-M3 core at 180 MHz, 200 kB SRAM, and large LBGA256 GPIO count make it well suited to drive TFT LCD panels with resistive or capacitive touch in industrial HMIs. The SPIFI interface streams pixel data directly from external Quad-SPI flash while the EMC attaches SDRAM for framebuffers. Hardware AES secures GUI assets against cloning, and the wide operating temperature range (-40 to +85 C) tolerates factory-floor environments.

Được đề xuất

🏭

Motor Control and Drive

The LPC18S30FET256's Cortex-M3 core delivers the deterministic interrupt response required for field-oriented control (FOC) of three-phase motors. The 10-bit ADC and PWM timers handle current sensing and switching signals; the 256-pin LBGA exposes enough GPIO for multi-axis drives. The 200 kB SRAM stores control loops without external memory pressure, while hardware AES protects proprietary motor-control firmware from reverse engineering in competitive markets.

Được đề xuất

FAN7392 · onsemi IRS2113PBF · Infineon ISO5851DWR · Texas Instruments

🌐

Industrial Ethernet Gateway

The integrated 10/100 Ethernet MAC with MII/RMII and two HS-USB controllers let the LPC18S30FET256 bridge industrial fieldbuses (PROFINET, EtherNet/IP) to USB peripherals or storage. Its 180 MHz performance handles TCP/IP stacks and real-time protocol processing, while the 200 kB SRAM accommodates multi-protocol buffering. Security features protect against unauthorised fieldbus access, important for OT/IT convergence in Industry 4.0 deployments.

Được đề xuất

LAN8742A-CZ-TR · Microchip Technology KSZ9031RNXIA · Microchip Technology ISO7762FDWR · Texas Instruments

💳

Secure Point-of-Sale (POS) Terminal

Hardware AES decryption, secure boot, and a unique device ID make the LPC18S30FET256 a strong foundation for PCI-compliant POS terminals where firmware integrity is regulatory. Two HS-USB ports support payment peripherals (PIN pads, contactless readers) without external PHYs. The Cortex-M3 at 180 MHz processes EMV transactions in real time, while the LBGA256 footprint accommodates keypad matrix, printer interface, and Ethernet connectivity in compact form factors.

Được đề xuất

MAX31855 (Peripheral interface companion) ISO1540BDR (Bidirectional I2C isolator) ISO7761DBQ · Texas Instruments

🧩

Building Automation Controller

The LPC18S30FET256's combination of Ethernet, two CAN buses, multiple UARTs, and security hardware fits building-automation gateways that bridge BACnet, Modbus, and KNX networks. The wide operating temperature range supports rooftop and basement installations, while the Cortex-M3 at 180 MHz handles concurrent protocol stacks. Hardware AES protects tenant privacy data transmitted over cloud uplinks.

Được đề xuất

SN65HVD75DR (3.3V CAN transceiver) ISO7761DW · Texas Instruments KSZ8895MQXI · Microchip Technology

🌐

Embedded Networking Gateway

For routers, protocol converters, and IoT aggregation nodes, the LPC18S30FET256 supplies 10/100 Ethernet plus dual High-Speed USB with on-chip PHY to avoid external components. The 200 kB SRAM supports multi-connection TCP/IP stacks, while SPIFI allows firmware updates over the air. Hardware AES secures VPN and TLS tunnels at line-rate, and the LBGA256 exposes all peripheral interfaces simultaneously for full gateway functionality.

Được đề xuất

KSZ8999I · Microchip Technology LAN7800-I/VSX · Microchip Technology ISO7041FDBQR · Texas Instruments

Tóm tắt các sản phẩm được đề xuất

What is the maximum clock frequency of the LPC18S30FET256?

The LPC18S30FET256 runs the ARM Cortex-M3 core at up to 180 MHz. According to the NXP product page, the device is part of the LPC1800 high-performance series. Designers should configure the system PLL using the standard NXP PLL setup routine to ensure stable operation at full speed and use a 12 MHz external crystal as the reference source.

How much SRAM does the LPC18S30FET256 have and does it include flash?

The LPC18S30FET256 includes 200 kB of on-chip SRAM and 4 kB of EEPROM, but it is ROMless, meaning no internal flash. Code must be stored in an external memory accessed via the SPIFI (Quad-SPI Flash Interface) or EMC (External Memory Controller). This ROMless design gives flexibility to choose flash density for each product variant.

Does the LPC18S30FET256 have Ethernet and USB support?

Yes. The LPC18S30FET256 integrates a 10/100 Mbps Ethernet MAC with MII and RMII interfaces and two High-Speed USB 2.0 controllers with on-chip PHY. According to NXP, the HS-USB ports support Host, Peripheral, and OTG roles, eliminating the need for external USB PHYs and saving both BOM cost and PCB area in connected designs.

What security features are built into the LPC18S30FET256?

The LPC18S30FET256 includes hardware AES decryption, a unique device serial number, secure boot ROM, and a memory protection unit. According to the NXP product brief, these features support anti-counterfeiting, firmware integrity verification, and tamper-resistant designs in industrial and POS applications. The 'S' suffix in the part number designates this enhanced security variant.

What package does the LPC18S30FET256 use?

The LPC18S30FET256 ships in a 256-pin Low-Profile BGA (LBGA256) measuring 17x17 mm with 1.0 mm pitch. This large BGA provides up to 165 GPIO pins plus dedicated peripheral interfaces, suitable for designs requiring extensive external memory or graphics connectivity. PCB layout requires laser-via microvia stack-ups or via-in-pad technology.

Where can I download the LPC18S30FET256 datasheet PDF?

The official LPC18S30FET256 datasheet PDF is hosted on the NXP product page at https://www.nxp.com/part/LPC18S30FET256. The datasheet (approximately 151 pages per Alldatasheet metadata) covers pinout, electrical characteristics, peripherals, memory map, and bootloader configuration. Distributors like DigiKey and Mouser also link to the same PDF from their product pages.

What is the operating temperature range of the LPC18S30FET256?

The LPC18S30FET256 operates from -40 C to +85 C, suitable for industrial applications. For an extended-temperature variant, the LPC18S30FET256E suffix designates the same die with industrial screening. Automotive-grade AEC-Q100 qualification is not available for this part; for automotive designs, consider NXP's S32K or LPC17xx automotive variants instead.

What is the difference between LPC18S30FET256 and LPC18S30FET256E?

Both parts use the same die and LBGA256 package; the 'E' suffix indicates an enhanced temperature range or process revision. According to Mouser listing, the LPC18S30FET256E is the standard active variant with current availability. The LPC18S30FET256 (without E) typically indicates the base catalog part. Confirm thermal grade with NXP for your application before sourcing.

What is the price of the LPC18S30FET256 and where can I buy it?

As of 2026-10-08, the LPC18S30FET256 lists around $14.50 at qty 1, falling to approximately $9.30 at 1000 pieces based on distributor pricing snapshots. Authorised distributors include DigiKey, Mouser, and IC-Components. Lead time for stock parts is typically 2-4 weeks; for production volumes, contact NXP authorised distributors directly for quotes.

Is the LPC18S30FET256 in stock and what is the lead time?

According to distributor listings as of 2026-10-08, the LPC18S30FET256 is generally available with same-day shipping from major distributors like DigiKey for limited quantities. Lead times for production volumes of 1000+ pieces typically run 4-8 weeks. Nevsemi and IC-Components also stock the part for online ordering; for larger commitments, NXP authorised distributors provide the shortest reliable lead time.

What is the best drop-in replacement for the LPC18S30FET256?

The closest drop-in replacement for the LPC18S30FET256 in the same LBGA256 package from NXP is the LPC1833FET256 (without the 'S' security features), sharing 200 kB SRAM and most peripheral IP. From the broader LPC1800 family, LPC1857FET256 and LPC1837FET256 share the LBGA256 footprint but differ in USB configuration or Ethernet MAC count - confirm pin-compatibility before substitution.

LPC18S30FET256 vs LPC4330FET256 - which is better for my application?

The LPC18S30FET256 uses a single Cortex-M3 core at 180 MHz; the LPC4330FET256 adds a Cortex-M4 coprocessor at 204 MHz alongside Cortex-M0. For pure M3 applications with security needs, the LPC18S30 is more cost-effective. For DSP or floating-point workloads, the LPC4330 (same LBGA256 package) is the upgrade path. Both share the same peripheral IP and memory map, simplifying migration.

When should I choose the LPC18S30FET256 over the LPC1768?

Choose the LPC18S30FET256 when you need Cortex-M3 at 180 MHz, hardware AES security, two HS-USB ports, and Ethernet MAC in a single device. The LPC1768 (Cortex-M3 at 100 MHz) is appropriate when lower cost and a smaller LQFP package suffice. The LPC18S30's LBGA256 supports much higher GPIO count and external memory bandwidth, making it better for HMI and motor control.

Can an STM32F427VIT6 replace the LPC18S30FET256?

The STMicroelectronics STM32F427VIT6 (Cortex-M4 at 180 MHz, 100-pin LQFP) is NOT a drop-in replacement for the LPC18S30FET256 because the package and pinout differ significantly. For functional substitution in firmware, the STM32F427 family can replicate most peripherals but requires PCB redesign and driver porting. For a same-package alternative, prefer the LPC1857FET256 or LPC4330FET256 from NXP.

What are the key specifications of the LPC18S30FET256 that engineers should know?

Engineers should know: Cortex-M3 at 180 MHz, 200 kB SRAM, 4 kB EEPROM, ROMless (external flash via SPIFI/EMC), LBGA256 (17x17 mm), 2.4-3.6 V supply, hardware AES, 10/100 Ethernet, two HS-USB with on-chip PHY, 165 GPIO, four UARTs, three I2C, two CAN, two SSP, and a 10-bit ADC. According to NXP documentation, the boot ROM supports ISP via UART and SPIFI for in-field firmware updates.

Dữ liệu tham khảo kỹ thuật cho LPC18S30FET256 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the LPC18S30FET256 when you need a 180 MHz Cortex-M3 MCU with 200 kB SRAM, hardware AES security, two HS-USB ports, and 10/100 Ethernet in a single LBGA256 package. It is the right fit for secure industrial HMI, POS terminals, motor control, and connected gateways in the -40 to +85 C range. Choose the LPC1833JET256 if you do not need the AES security block to save cost. Choose the LPC1857FET256 if you also need an external ULPI high-speed PHY or LCD interface. Choose the LPC4330FET256 if you need DSP performance, floating-point, or a dual-core architecture - it shares the same LBGA256 footprint for easy migration. Avoid using this part for new designs requiring AEC-Q100 automotive qualification; for that, use NXP's S32K family.

So sánh với các sản phẩm thay thế

Tham số	Sản phẩm này	LPC1833JET256	LPC1857FET256	LPC4330FET256	LPC1837FET256
Package	256-LBGA (17x17 mm)	256-LBGA (17x17 mm) - same	256-LBGA (17x17 mm) - same	256-LBGA (17x17 mm) - same	256-LBGA (17x17 mm) - same
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Core Architecture	Cortex-M3 (single)	Cortex-M3 (single)	Cortex-M3 (single)	Cortex-M4 + Cortex-M0 (dual)	Cortex-M3 (single)
Maximum Clock Frequency	180 MHz	180 MHz	180 MHz	204 MHz (M4)	180 MHz
On-chip SRAM	200 kB	200 kB	200 kB	264 kB	200 kB
Hardware AES	Yes	No	Yes	Yes	No
Ethernet MAC	10/100 Mbps	10/100 Mbps	10/100 Mbps	10/100 Mbps	10/100 Mbps (single MAC)
HS-USB Controllers	2 (Host/Peripheral + Host)	2 (Host/Peripheral + Host)	2 + ULPI (external PHY)	2 (Host/Peripheral + Host)	2 (Host/Peripheral + Host)

Bảo phân biệt quan trọng

Built-in hardware AES security subsystem (vsLPC1833JET256)
Dual-core upgrade path with same footprint (vsLPC4330FET256)
Single Ethernet MAC simplifies software stack (vsLPC1837FET256)

Ghi chú thiết kế

Estimated: total power dissipation at 180 MHz active, 3.3 V, all peripherals enabled is approximately 300-450 mW. The LBGA256 package requires a minimum 4-layer PCB with continuous ground plane and 100 nF ceramic decoupling on every VDD/VDDA pin pair, plus 4.7 uF bulk caps per supply rail. Power sequencing must follow NXP's recommended order (3.3 V analog before 3.3 V digital) to avoid latch-up. For battery-backed designs, retain VBAT to preserve the RTC domain.

The 256-LBGA at 1.0 mm pitch requires either microvia (laser-drilled) stack-up or via-in-pad technology for reliable assembly. Route HS-USB differential pairs (D+/D-) with 90 ohm differential impedance and Ethernet MII/RMII traces with 50 ohm single-ended impedance, keeping pair length matching within 150 mil. Place the 12 MHz crystal within 5 mm of XTAL1/XTAL2 pins and isolate it from switching signals with a guard ring tied to analog ground.

The LPC18S30FET256 is ROMless: it boots from external SPIFI flash, EMC NOR flash, or ISP over UART0. An unpopulated SPIFI flash or missing boot configuration will halt the part at reset. Verify boot source pins (PIO0_6 / PIO0_7 / PIO0_8 / PIO5_4) match your memory layout before PCB fab. Also, the AES peripheral requires key storage in a dedicated OTP region - burn keys once and lock the region to prevent accidental erasure.

Thông tin tuân thủ

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Không chì

Yes

Không halogen

Unknown

Khoáng vật xung đột

Compliant

RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified; for automotive applications use S32K or LPC17xx automotive variants.

Dữ liệu được xác minh vào: 2026-10-08 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Nguồn: Manufacturer Product Page, Manufacturer Product Page, Distributor, Distributor, Manufacturer Datasheet

Tìm kiếm liên quan

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Các bộ phận và thuật ngữ liên quan

NXP Semiconductors LPC18S30FET256 LPC1833JET256 LPC1857FET256 LPC4330FET256 LPC1837FET256 LPC18S30FET256E ARM Cortex-M3 Cortex-M4 Cortex-M0 Thumb-2 instruction set MCU microcontroller ROMless architecture 256-LBGA BGA package family SPIFI External Memory Controller EMC AES HS-USB 10/100 Ethernet MAC RMII AEC-Q100 RoHS REACH industrial HMI POS terminal motor control building automation