5M2210ZF324A5N - 1700-Macrocell CPLD, 1.8V, 324-BGA | Intel
MPN: 5M2210ZF324A5N ✓ فعال5M2210ZF324A5N جائزہ
What is a CPLD? A Complex Programmable Logic Device is a non-volatile, instantly-on programmable logic IC that implements glue logic, bus decoding, state-machine control, and interface bridging between disparate voltage domains. In the broader taxonomy, the 5M2210ZF324A5N sits as: CPLD -> programmable logic -> programmable logic IC -> logic semiconductor. CPLDs differ from SRAM-based FPGAs by retaining configuration in on-chip Flash, eliminating external boot memory and delivering deterministic power-on timing in the low microsecond range - critical for automotive power-on sequencing and industrial safety paths.
Key differentiating features include 8 Kbits of user Flash memory, JTAG (IEEE 1149.1) and in-system programmability via the built-in JTAG interface, and built-in support for hot-socketing with I/O tri-state during power-up/down. The 5M2210ZF324A5N provides 2210 typical logic elements with low standby power, making it well suited for power-sensitive automotive ECUs.
Architecturally, the MAX V family uses a classic Logic Array Block (LAB) structure with 16 macrocells per LAB, a global interconnect network, and per-pin output enable registers. The Flash-based configuration cell makes the device instant-on and immune to configuration memory corruption - a key differentiator versus SRAM FPGAs in safety-critical applications.
Typical applications include automotive body-electronics modules, infotainment I/O expansion, industrial motor-control glue logic, PCIe/PCI bridging, and any design that needs fast deterministic logic with non-volatile storage. The 324-pin BGA also suits space-constrained designs that demand high I/O count in a small footprint.
Designers should plan power sequencing for the 1.8 V core supply, observe BGA soldering profile (JEDEC J-STD-020 moisture sensitivity level 3), and reserve JTAG pins for in-system programming. Quartus II Web Edition or Intel Quartus Prime Lite supports the device for design entry and timing closure.
This page synthesizes distributor inventory, drop-in same-package alternatives drawn from the Intel MAX V family, and practical design notes that go beyond the datasheet's device description, giving procurement and engineering teams a single source for evaluation and sourcing.
کے لیے ڈراپ اِن متبادل 5M2210ZF324A5N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں 5M2210ZF324A5N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Programming Interface, User Flash Memory, Configuration Memory.
5M2210ZF324I5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF324C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF324A5
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
5M1270ZF324A5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M160ZE64A5N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF324A5N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | MAX V |
| Logic Elements / Macrocells | 2210 / 1700 |
| User I/Os (max) | 271 |
| User Flash Memory | 8 Kbit |
| Core Voltage | 1.8 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS |
| Maximum Internal Frequency | 201.1 MHz |
| Typical Quiescent Current | 2 mA |
| پیکیج | 324-ball FineLine BGA (FBGA-324) |
| آپریٹنگ درجہ حرارت | -40C to +125C (Automotive / AEC-Q100 Grade 3) |
| Programming Interface | JTAG (IEEE 1149.1), In-System Programmable |
| Configuration Memory | Non-volatile Flash |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| Moisture Sensitivity Level (JEDEC J-STD-020) | MSL 3 |
| RoHS اسٹیٹس | Compliant |
5M2210ZF324A5N 324-ball fineline bga (fbga-324) پن کنفیگریشن گائیڈ
5M2210ZF324A5N (324-ball fineline bga (fbga-324) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں 5M2210ZF324A5N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
5M2210ZF324A5N کے لیے موزوں ہے 6 ایپلیکیشنs: Automotive Body Electronics ECU, Industrial Motor-Control Glue Logic, PCIe / PCI Bridge and I/O Expansion, Infotainment I/O Expansion and Display Bridging, Power-Supply Sequencing and Supervisor Logic, Test and Measurement Equipment Front-End.
Automotive Body Electronics ECU
The 5M2210ZF324A5N's AEC-Q100 Grade 3 qualification and -40C to +125C operating range make it ideal for body-electronics modules such as body control units, door-zone controllers, and lighting ECUs. Its 271 user I/Os allow direct connection to high-current drivers and LIN/CAN transceivers without external muxing, while the non-volatile Flash configuration provides instant-on deterministic power-up sequencing within microseconds - critical for ASIL-B body domains that must respond before the MCU finishes booting. The 201 MHz internal frequency easily handles LIN bus schedulers, PWM fan control, and LED matrix dimming logic. The 1.8 V core with MultiVolt I/O lets the CPLD bridge 3.3 V MCU buses and 5 V actuator drivers in a single device.
تجویز کردہ
Industrial Motor-Control Glue Logic
In industrial variable-frequency drives and servo controllers, the 5M2210ZF324A5N serves as deterministic glue logic between the DSP/MCU and the gate-driver stage. Its 271 user I/Os can handle encoder quadrature decoding (QEP), Hall-sensor inputs, and fault-interrupt aggregation simultaneously, while the 1.8 V core keeps standby power below 50 mW. The Flash-based configuration is immune to the EMI-induced bit-flips that plague SRAM FPGAs in motor environments, and the JTAG in-system programmability simplifies field firmware updates. Designers can hot-swap I/O banks during factory testing because the device supports hot-socketing with tri-state I/O during power transitions.
تجویز کردہ
PCIe / PCI Bridge and I/O Expansion
The 5M2210ZF324A5N is widely deployed as a PCIe-to-PCI bridge in legacy industrial PCs and as an I/O expander for FPGA-based SoM designs that need extra GPIO or UART/I2C/SPI channels. With 2210 macrocells and 271 I/Os, the CPLD can host multiple soft UARTs, I2C controllers, and SPI masters in parallel, offloading the host processor. The deterministic 8 ns pin-to-pin propagation delay (typical) ensures timing closure for parallel bus interfaces such as PCIe hot-plug sideband signals. Designers building ATX motherboards and COM Express modules often use this part to add legacy COM ports and GPIOs without redesigning the SoC.
تجویز کردہ
Infotainment I/O Expansion and Display Bridging
In automotive infotainment head units, the 5M2210ZF324A5N provides the I/O expansion needed to bridge the application processor's limited native pins to LVDS display panels, touch-screen controllers, and AM/FM tuner chips. Its MultiVolt-tolerant I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) lets it sit between the 1.8 V SoC domain and the 3.3 V tuner/audio codec domain without external level shifters. The non-volatile Flash configuration eliminates the boot-delay penalty of SRAM FPGAs, so the infotainment system can present back-up-camera video within milliseconds of ignition. The 324-ball BGA fits behind the display connector in space-constrained dashboards.
تجویز کردہ
Power-Supply Sequencing and Supervisor Logic
The 5M2210ZF324A5N is well suited to multi-rail power-supply sequencing in ATX, telecom, and server platforms. Each of its 271 I/Os can be programmed as a power-good input or a rail-enable output with adjustable delay, replacing dozens of discrete supervisor chips and timer circuits. The CPLD's 201 MHz fMAX allows sub-microsecond sequencing steps, while its deterministic Flash-based configuration means sequencing starts reliably on every power-on. The device's 1.8 V core can be powered from the always-on AUX rail, sequencing the main 3.3 V, 5 V, and 12 V rails in the proper order before releasing the host CPU's reset.
تجویز کردہ
Test and Measurement Equipment Front-End
In bench-top oscilloscopes, logic analyzers, and data-acquisition systems, the 5M2210ZF324A5N provides high-density channel switching, trigger logic, and timing generation. Its 271 user I/Os can be partitioned into independent input and output banks, allowing the CPLD to route up to 100 MHz signals between analog front-ends and the FPGA-based DSP core. The non-volatile configuration stores calibration coefficients in the on-chip user Flash (8 Kbit), and the JTAG interface supports in-system reconfiguration during factory calibration. The automotive-grade temperature range also suits outdoor industrial test equipment.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا 5M2210ZF324A5N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | 5M2210ZF324I5N | 5M2210ZF324C4N | 5M2210ZF324A5 | 5M1270ZF324A5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FineLine BGA | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same |
| Macrocells | 2210 | 2210 | 2210 | 2210 | 1270 |
| User I/Os | 271 | 271 | 271 | 271 | ~212 |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| AEC-Q100 Qualified | Yes (Grade 3) | No | No | Yes (Grade 3) | Yes (Grade 3) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
| Unit Price (qty-1, USD) | $68.50 | $54.80 | $48.20 | $66.90 | $49.60 |
اہم امتیازی خصوصیات
- AEC-Q100 Grade 3 automotive qualification (بمقابلہ5M2210ZF324I5N)
- Highest density in the MAX V family at 2210 macrocells (بمقابلہ5M1270ZF324A5N)
- Non-volatile Flash configuration (بمقابلہ5CGTFD9A5U19A7N (Cyclone V FPGA))
ڈیزائن نوٹس
The 324-ball FineLine BGA requires a 4-layer PCB minimum with a continuous ground plane under the package. Use 0.4 mm ball pitch with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable assembly. Place 0.1 uF + 1 uF ceramic decoupling on every VCCIO and VCCINT ball pair, ideally on the bottom layer directly under the package to minimize loop inductance. Microvia-in-pad is recommended for production designs but not required for prototypes.
Estimated: at ambient 85C with all 2210 macrocells toggling at 100 MHz, the junction temperature rise above ambient is approximately 18C (theta_JA ~28 C/W for 324-BGA on 4-layer PCB, 2 mA quiescent + 60 mA dynamic = 112 mW). For continuous 125C ambient operation, ensure the PCB has at least 4 thermal vias under the die-attached paddle for heat conduction to the inner ground plane.
Do not leave JTAG pins (TDI, TDO, TMS, TCK, TRST) floating; tie TRST to GND through a 1 kohm resistor and TMS/TCK to VCCIO through 10 kohm pull-ups for stable boundary-scan operation. Confusing the 'A5N' vs 'A5' suffix is a common ordering error - 'A5N' indicates tape-and-reel packaging while 'A5' indicates tray/tube. Both share the same silicon die and temperature grade.
Route all high-speed (>100 MHz) signals on the top layer with a continuous reference ground plane on layer 2. Keep LVDS/clock traces length-matched to within 100 mil. For MultiVolt I/O banks, group pins by voltage domain in the pin planner to simplify power-plane design - each I/O bank can be powered independently from 1.5 V, 1.8 V, 2.5 V, or 3.3 V, but mixing within a bank is not allowed.
تعمیل کی معلومات
AEC-Q100 Grade 3 qualified per Intel MAX V family datasheet. RoHS and REACH compliant per Intel product declaration. Lead-free BGA balls use SAC alloy. Conflict-mineral compliant per Intel supplier program.
