EP1K10FC256-3 - ACEX 1K FPGA, 10K Gates, 256-BGA | Intel
MPN: EP1K10FC256-3 ✗ اختتامِ زندگیEP1K10FC256-3 جائزہ
A FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density of gate arrays with the flexibility of user-programmable interconnect, enabling designers to implement custom digital logic, glue logic, glue-less interfaces, state machines, and arithmetic pipelines on a single chip. Within the broader taxonomy of integrated circuits, an FPGA sits between standard logic ICs (fixed function) and ASICs (application-specific) - offering hardware-level parallelism and re-programmability without NRE costs.
Key features of the EP1K10FC256-3 include 72 logic array blocks (LABs), dual-port EAB (Embedded Array Block) memory, in-system programmability via IEEE 1149.1 JTAG, MultiVolt I/O support for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and a -3 speed grade. The device supports 12,288 bits of embedded RAM distributed across EAB blocks, enabling efficient on-chip buffering for FIFOs, lookup tables, and small data paths without consuming general-purpose logic.
The ACEX 1K architecture combines logic elements (LEs) with embedded array blocks (EABs), where each EAB provides up to 4 Kbits of RAM that can be configured as synchronous SRAM, ROM, or specialized logic functions such as multipliers and megafunctions. The -3 speed grade designates a mid-tier performance bin, balancing timing margin against cost for glue logic, bus bridging, and low-to-mid complexity state machines rather than high-speed DSP or SERDES workloads.
Typical applications include bus-interface bridging between microcontrollers and peripherals, glue logic replacement in telecom and industrial control equipment, low-density control and signal processing in test and measurement, and prototyping platforms for ASIC verification. Its dual-port EAB structure also makes it well suited to small FIFO buffers and lookup-table-based waveform synthesis.
When designing with this part, pay attention to the 256-ball FBGA land pattern, the 2.5 V VCCINT/VCCIO rail requirements, and the JTAG chain integration with any boundary-scan test infrastructure. Engineers migrating from the original ACEX 1K family should also evaluate the Cyclone-series successors for new designs, while keeping the EP1K10FC256-3 as a long-term production component for legacy boards.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل EP1K10FC256-3 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K10FC256-3 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Process Technology, Speed Grade, Configuration Method.
EP1K10FC256-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-3 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | ACEX 1K |
| Logic Elements | 576 |
| Typical Gates | 10,000 |
| Maximum User I/Os | 136 |
| Embedded RAM Bits | 12,288 |
| Logic Array Blocks (LABs) | 72 |
| Embedded Array Blocks (EABs) | 3 |
| Core Voltage | 2.5 V |
| Speed Grade | -3 |
| پیکیج | 256-BGA (FBGA) |
| Pin/Ball Count | 256 |
| آپریٹنگ درجہ حرارت | 0°C to +70°C (Commercial) |
| Process Technology | 0.18 µm SRAM |
| Programming Interface | IEEE 1149.1 JTAG, in-system programmable |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5.0 V |
| ماؤنٹنگ ٹائپ | Surface Mount |
EP1K10FC256-3 پن کنفیگریشن
| پن A1 | I/O — User I/O (bank 1) |
| پن A2 | I/O — User I/O (bank 1) |
| پن B1 | I/O — User I/O (bank 1) |
| پن B2 | GND — Ground |
| پن C1 | VCCIO1 — I/O bank 1 supply (2.5/3.3/5.0 V) |
| پن C2 | TDI — JTAG test data in |
| پن D1 | TMS — JTAG test mode select |
| پن D2 | TCK — JTAG test clock |
| پن E1 | nCONFIG — Configuration control (active low) |
| پن E2 | VCCINT — Core supply 2.5 V |
| پن F1 | nSTATUS — Configuration status (active low) |
| پن F2 | CONF_DONE — Configuration done |
| پن G1 | TDO — JTAG test data out |
| پن G2 | GND — Ground |
| پن H1 | I/O — User I/O (bank 2) |
| پن H2 | I/O — User I/O (bank 2) |
عام استعمالات
EP1K10FC256-3 کے لیے موزوں ہے 6 ایپلیکیشنs: Bus Interface Bridging, Industrial Control and Glue Logic, ASIC Prototyping Platform, Test and Measurement Equipment, Telecom and Datacom Line Cards, Educational and Development Boards.
Bus Interface Bridging
The EP1K10FC256-3 fits bus-bridging between microcontrollers, DSPs, and peripherals by combining 576 logic elements and 12,288 bits of embedded dual-port RAM in a single 256-FBGA device. Its MultiVolt I/O supports direct interfacing to 5.0 V, 3.3 V, and 2.5 V rails, eliminating external level shifters. Typical designs use 3-4 EABs as FIFO buffers for protocol translation (e.g., UART↔SPI or PCI-to-ISA bridges), with the remaining LEs implementing handshake state machines. The 136 user I/Os comfortably accommodate 16-32-bit bus widths plus chip selects and interrupts. Engineers benefit from in-system JTAG programmability, which simplifies iterative glue-logic bring-up versus hand-routing discrete 74-series logic.
تجویز کردہ
Industrial Control and Glue Logic
In industrial PLCs, motor controllers, and instrumentation front-ends, the EP1K10FC256-3 replaces dozens of 74-series logic ICs with one programmable device. The 72 LABs comfortably implement encoder-decoder state machines, PWM generation, and quadrature decoding. Its 0.18 µm process and 2.5 V core deliver moderate power consumption for 24/7 industrial environments. The 256-FBGA package suits compact controller boards where board area is at a premium. Designs requiring deterministic timing below 50 ns benefit from the -3 speed grade. For new industrial platforms, designers should evaluate the Cyclone-series for active lifecycle and longer-term support.
تجویز کردہ
ASIC Prototyping Platform
ASIC verification teams use the EP1K10FC256-3 as a fast-prototyping target for control-plane RTL blocks prior to mask tape-out. The 576 logic elements and 12,288 bits of dual-port RAM allow one or two IP blocks (e.g., a register file plus DMA engine) to be validated at near-ASIC clock rates. In-system JTAG programming enables rapid iteration: a new bitstream downloads in seconds versus multi-week ASIC re-spins. The MultiVolt I/O allows direct connection to surrounding ASIC-validation test chips at 2.5/3.3/5.0 V. Engineers often pair multiple EP1K10FC256-3 devices on a single prototyping board to mimic larger ASICs.
تجویز کردہ
Test and Measurement Equipment
The EP1K10FC256-3 powers custom logic in low-to-mid complexity test gear such as protocol analyzers, signal generators, and data-acquisition front-ends. Its EAB blocks serve as waveform lookup tables (storing sine, ramp, or arbitrary stimulus patterns), while LEs implement counters, sequencers, and trigger logic. The 136 user I/Os accommodate parallel digital stimulus buses plus trigger inputs/outputs. Designers benefit from reconfigurability: a single board can host multiple instrument personalities via different bitstreams. For new T&M products, the Cyclone-series is recommended, but the EP1K10FC256-3 remains a stable option for long-life test platforms.
تجویز کردہ
Telecom and Datacom Line Cards
In legacy telecom and datacom line cards (T1/E1 framers, low-density cross-connects, fan-out buffers), the EP1K10FC256-3 implements framing, alarm processing, and clock-recovery glue logic around discrete PHY devices. The 2.5 V core with 3.3 V I/O directly interfaces to classic telecom ASICs. The 12,288-bit embedded RAM hosts small elastic stores and pattern-matching buffers. The 256-FBGA package fits the compact 6-8 layer PCBs typical of line-card designs. Service providers still maintaining installed bases rely on the EP1K10FC256-3 for spares and incremental upgrades before migrating to modern FPGAs.
تجویز کردہ
Educational and Development Boards
Universities and FPGA training labs value the EP1K10FC256-3 for teaching digital design, RTL synthesis, and JTAG-based debugging on a real, JTAG-programmable silicon platform. Its 576 logic elements are large enough for meaningful projects (UART, VGA controller, simple RISC core) yet small enough to map cleanly onto a single semester's assignments. The 256-FBGA package is challenging for hand-soldering, so development boards with pre-routed land patterns are typical. Instructors can demonstrate timing closure trade-offs across -1/-2/-3 speed grades using drop-in variants on identical boards.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K10FC256-3 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K10FC256-3N | EP1K10FC256-2 | EP1K10FC256-2N | EP1K10FC256-1 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same |
| Family / Die | ACEX 1K (576 LEs) | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die |
| Speed Grade | -3 | -3 (same) | -2 (faster) | -2 (faster) | -1 (slower) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| Maximum User I/Os | 136 | 136 | 136 | 136 | 136 |
| Ball Finish / RoHS | SnPb / Non-RoHS | Pb-free / RoHS | SnPb / Non-RoHS | Pb-free / RoHS | SnPb / Non-RoHS |
اہم امتیازی خصوصیات
- RoHS-compliant drop-in alternative available without footprint change (بمقابلہEP1K10FC256-3N)
- Faster speed-grade drop-in upgrade path (بمقابلہEP1K10FC256-2)
- Dual-port embedded RAM for FIFO and lookup-table designs (بمقابلہDiscrete 74-series glue logic)
ڈیزائن نوٹس
The 256-FBGA package uses a fine-pitch ball grid that typically requires via-in-pad or dog-bone fan-out on a 4-6 layer PCB. Per the ACEX 1K datasheet, all VCCINT and VCCIO pins must have a 0.1 µF decoupling capacitor placed within 100 mils of each pin, with bulk 10-47 µF tantalum or ceramic capacitors on each supply rail. Place a ground pour directly under the BGA to provide low-impedance return paths for simultaneous-switching outputs.
The EP1K10FC256-3 requires a 2.5 V VCCINT core and one or more VCCIO supplies (2.5/3.3/5.0 V MultiVolt) for the I/O banks. Estimated: with all 136 I/Os switching at 50 MHz and 50% toggle rate, peak supply current can exceed 500 mA on VCCINT - use a switching regulator with at least 1 A rating plus 2-stage LC filtering to meet simultaneous-switching-noise (SSN) budgets of ±5% on VCCINT.
MultiVolt I/O allows mixed-voltage interfacing, but each I/O bank must be powered from a single VCCIO rail. Mixing 5 V and 3.3 V inputs on the same bank is not supported. For long-trace or high-speed (>50 MHz) outputs, use 22-33 Ω series termination near the FPGA pin to dampen reflections; for LVTTL/LVCMOS receivers on the far end, place the resistor within 200 mils of the FPGA output.
Do not confuse the EP1K10FC256-3 (SnPb ball finish, non-RoHS) with the EP1K10FC256-3N (Pb-free, RoHS-compliant) - both share the same 256-FBGA footprint but require different reflow profiles and may be flagged by component-placement systems enforcing material compliance. Also note that the ACEX 1K family is NRND; new designs should evaluate Cyclone-series successors, but the EP1K10FC256-3 remains in service for long-life industrial platforms.
تعمیل کی معلومات
EP1K10FC256-3 is non-RoHS due to SnPb ball finish. Use EP1K10FC256-3N for RoHS-compliant assembly. REACH compliance declared via Intel/Altera material declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified.
