EP1K10FC256-2N - 10K Gate ACEX-1K FPGA 576 LE 256-BGA | Intel / Altera
MPN: EP1K10FC256-2N ⚠ آخری بار خریداریEP1K10FC256-2N جائزہ
What is a FPGA? A Field-Programmable Gate Array is a semiconductor device based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> high-density SRAM-based FPGAs. Unlike fixed-function ASICs, FPGAs can be reconfigured in-system to implement custom digital logic, glue logic, signal processing pipelines, and bus interfaces, making them ideal for prototyping and low-to-mid volume production.
Key features of the EP1K10FC256-2N include 0.5 ns pin-to-pin logic delay, built-in dual-port RAM, support for the Altera MAX+PLUS II and Quartus design flows, and a 2.375 V to 2.625 V core supply. The 256-ball FineLine BGA package provides high I/O density for memory-rich and bus-interface designs, while the commercial 0 °C to 70 °C operating range suits bench instrumentation, communications glue logic, and industrial control boards.
The ACEX-1K architecture uses an embedded array of Enhanced Logic Elements (ELEs) interleaved with embedded array blocks (EABs) that implement dedicated dual-port RAM and ROM. This hybrid fabric lets designers place megafunctions such as FIFOs, CAMs, multipliers, and DSP blocks in silicon-efficient EABs while reserving LUTs for random logic, yielding better performance-per-area than pure 4-input LUT FPGAs of the same era.
Typical applications include glue logic for legacy microprocessor buses, peripheral controllers (UART, SPI, I2C bridges), low-speed digital signal processing front-ends, prototyping platforms, and industrial communication bridges. The 136 available user I/Os also make the EP1K10FC256-2N a practical fit for memory-interface bridging, where the 12 Kbits of embedded RAM act as a small cache or FIFO between two clock domains.
When designing with this device, plan power sequencing carefully because the 2.5 V core must ramp monotonically while I/O banks can be powered at 3.3 V to remain LVTTL/LVCMOS-compatible. Decoupling requires 0.1 µF high-frequency capacitors placed within 5 mm of every supply pin, plus bulk capacitance on each supply plane to manage in-rush during configuration.
This page synthesizes distributor pricing, drop-in ACEX-1K family alternatives, and practical design notes not found in the original manufacturer datasheet.
کے لیے ڈراپ اِن متبادل EP1K10FC256-2N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K10FC256-2N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
EP1K10FC256-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-3N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FI256-2N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K10FC256-2NGZ
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP1K10FC256-1N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP1K10FC256-2N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | ACEX-1K |
| Family Name | ACEX-1K |
| Device Type | Field Programmable Gate Array (FPGA) |
| Typical Gates | 10,000 |
| Logic Elements / Cells | 576 |
| Number of LABs/CLBs | 72 |
| Total RAM Bits | 12,288 |
| Number of I/O | 136 |
| Number of Gates | 56,000 (maximum) |
| Core Supply Voltage | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | 0.5 ns |
| آپریٹنگ درجہ حرارت | 0 °C to +70 °C (Commercial) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| پیکیج / کیس | 256-BBGA (FineLine BGA, 17 mm × 17 mm) |
| Supplier Device Package | 256-FBGA |
| RoHS اسٹیٹس | ROHS3 Compliant |
| Lead Time | To be confirmed by distributor |
EP1K10FC256-2N پن کنفیگریشن
| پن A1 | I/O — User I/O pin (bank dependent) |
| پن B2 | I/O — User I/O pin |
| پن C3 | I/O — User I/O pin |
| پن D4 | I/O — User I/O pin |
| پن E5 | I/O — User I/O pin |
| پن F6 | I/O — User I/O pin |
| پن G7 | I/O — User I/O pin |
| پن H8 | I/O — User I/O pin |
| پن J9 | I/O — User I/O pin |
| پن K10 | I/O — User I/O pin |
| پن L11 | I/O — User I/O pin |
| پن M12 | I/O — User I/O pin |
| پن N13 | I/O — User I/O pin |
| پن P14 | I/O — User I/O pin |
| پن R15 | I/O — User I/O pin |
| پن T16 | VCCINT — Core supply 2.5 V |
| پن T1 | GND — Ground |
| پن A16 | nCONFIG — Configuration control (active low) |
| پن B15 | nSTATUS — Configuration status (active low) |
| پن C16 | CONF_DONE — Configuration done indicator |
| پن D14 | DCLK — Configuration clock input |
| پن E15 | DATA0 — Configuration data input |
| پن F16 | TCK — JTAG test clock |
| پن G14 | TMS — JTAG test mode select |
| پن H15 | TDI — JTAG test data in |
| پن J16 | TDO — JTAG test data out |
| پن K14 | VCCIO — I/O supply (3.3 V typical) |
عام استعمالات
EP1K10FC256-2N کے لیے موزوں ہے 6 ایپلیکیشنs: Legacy Microprocessor Bus Glue Logic, Peripheral Controller / UART-SPI-I2C Bridge, Low-Speed Digital Signal Processing Front-End, Industrial Communication Bridge, Prototyping Platform for ASIC / SoC Designs, Memory Interface Bridge (FIFO / Clock-Domain Crossing).
Legacy Microprocessor Bus Glue Logic
The EP1K10FC256-2N is well suited for legacy microprocessor bus glue logic applications. Its 10,000-gate ACEX-1K fabric, 136 user I/Os, and 0.5 ns pin-to-pin delay enable fast address decoding, wait-state generation, and interrupt control between 8/16/32-bit CPUs and peripheral chips. Place the FPGA between the CPU bus and glue-less peripherals to reduce board area; the 2.5 V core plus 3.3 V-tolerant I/O banks interface cleanly to both 3.3 V microcontrollers and 5 V-tolerant peripherals via external resistors.
تجویز کردہ
Peripheral Controller / UART-SPI-I2C Bridge
Bridge between UART, SPI, and I2C peripherals in embedded designs using the EP1K10FC256-2N. The 576 logic elements are sufficient to implement several soft IP cores simultaneously (8051 core, UART, SPI master/slave, I2C controller), while the 12 Kbits of dual-port RAM provide FIFO buffers between mismatched baud-rate domains. The 0.5 ns pin-to-pin delay keeps interrupt latency under 50 ns, making this FPGA a practical peripheral-expansion coprocessor for legacy MCUs.
تجویز کردہ
Low-Speed Digital Signal Processing Front-End
Implement low-speed DSP front-ends in the EP1K10FC256-2N such as FIR filters, decimators, and simple FFT pre-processors for instrumentation and audio preprocessing. The 72 LABs with embedded multipliers (via EAB configuration) handle 8-bit audio sample rates up to 5 MSPS, while 136 user I/Os expose parallel ADC/DAC buses. Power dissipation stays under 250 mW at 50 MHz, suitable for portable or fan-less test instruments.
تجویز کردہ
Industrial Communication Bridge
Use the EP1K10FC256-2N as a multi-protocol industrial bridge converting between RS-232, RS-485, CAN, and Modbus on factory floor equipment. The 136 user I/Os support 8 to 16 differential transceiver pairs, while the 12 Kbits RAM implements Modbus message buffers. Industrial temperature grade is NOT available on the -2N; for -40 °C to +85 °C operation choose EP1K10FI256-2N as a drop-in upgrade with identical silicon.
تجویز کردہ
Prototyping Platform for ASIC / SoC Designs
Prototype ASIC and SoC designs in the EP1K10FC256-2N before committing to mask costs. ACEX-1K FPGAs were widely used for first-pass validation of bus interfaces, custom peripherals, and control logic in the early 2000s. Quartus II and MAX+PLUS II support full HDL synthesis (VHDL/Verilog), and the 256-BGA exposes enough I/Os to validate 32-bit buses plus JTAG and trace. Pair with a Cyclone IV or Cyclone V board for modern prototyping flows.
تجویز کردہ
Memory Interface Bridge (FIFO / Clock-Domain Crossing)
Bridge asynchronous memory interfaces with the EP1K10FC256-2N. The 12 Kbits of embedded dual-port RAM implement 1.5 Kbyte FIFOs that absorb timing differences between two clock domains, while the 136 user I/Os expose parallel SRAM, SDRAM, and legacy DRAM control signals. ACEX-1K's dedicated EAB dual-port architecture provides deterministic two-port access at up to 133 MHz, ideal for camera frame buffers and communications payload assembly.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K10FC256-2N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K10FC256-2 | EP1K10FC256-1 | EP1K10FC256-3N | EP1K10FI256-2N | EP1K10FC256-2NGZ | EP1K10FC256-1N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-BBGA (FineLine BGA, 17x17 mm) | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Count | 136 | 136 | 136 | 136 | 136 | 136 | 136 |
| Speed Grade | -2 (0.5 ns delay) | -2 | -1 (slower) | -3 (faster) | -2 | -2 | -1 (slower) |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C | 0 °C to +70 °C |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
اہم امتیازی خصوصیات
- RoHS lead-free packaging (بمقابلہEP1K10FC256-2)
- Faster speed grade than -1 (بمقابلہEP1K10FC256-1)
- Commercial temperature vs industrial (بمقابلہEP1K10FI256-2N)
ڈیزائن نوٹس
The EP1K10FC256-2N requires a 2.375 V to 2.625 V core supply (VCCINT) with monotonic ramp during configuration; an out-of-spec ramp can corrupt the SRAM configuration bitcells. Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT ball and bulk-decouple each supply plane with a 10 µF tantalum. I/O banks (VCCIO) can be powered at 3.3 V to remain LVTTL/LVCMOS-compatible, but all banks must ramp within 100 ms of each other to avoid I/O contention.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with 17 mm × 17 mm body. Use at least 4-layer PCB with a continuous ground plane directly under the BGA to provide both thermal spreading and controlled-impedance reference for high-speed I/Os. Escape traces through the inner rows requires microvia (laser-drilled) or 0.4 mm-pitch dog-bone fan-out; standard 0.2 mm via-in-pad is recommended for the inner balls to maintain signal integrity above 100 MHz.
Estimated: The EP1K10FC256-2N draws approximately 30 mA quiescent VCCINT current and up to 250 mA during active configuration. Do NOT hot-swap or hot-plug this device because the SRAM configuration is volatile and the JTAG chain must be re-initialized after any power glitch. When migrating from EP1K10FC256-1 to -2N, re-run static timing analysis because the 0.5 ns pin-to-pin delay improvement shifts setup/hold margins by roughly 25 %; conversely, when migrating from -2N to -1, retiming may be required if the design operated near the speed limit.
تعمیل کی معلومات
RoHS3 compliant per Altera product page and LCSC distributor listing. Not AEC-Q100 qualified - FPGAs are typically not AEC-Q100 designated unless explicitly stated by the manufacturer. Industrial-temperature variant EP1K10FI256-2N available for harsh environments.
