EP1K50FI256-2N - 50K-Gate ACEX-1K FPGA 256-BGA | Intel / Altera
MPN: EP1K50FI256-2N ✗ اختتامِ زندگیEP1K50FI256-2N جائزہ
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory blocks (EABs/BRAMs) that the designer can program after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> parallel/serial programmable accelerators. ACEX-1K specifically pairs look-up-table (LUT)-based logic with Embedded Array Blocks (EABs), allowing each EAB to implement RAM, ROM, dual-port RAM, or FIFO without consuming general LUT resources.
Key differentiating features include the EAB-based memory architecture (dual-port RAM and FIFO at up to 40,960 bits), the 360 LABs delivering 2,880 logic elements (10 LEs per LAB), and SameFrame pin-out migration across the 256-pin FineLine BGA family. The die operates from a 2.5 V core supply with separate VCCIO bank voltages, supporting mixed-voltage I/O (LVTTL, LVCMOS, PCI, SSTL). Per the ACEX-1K datasheet family, the device is built on a 0.22 µm SRAM-based process and supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera EPC configuration devices.
Architecturally, each LAB contains 10 LEs, each LE holding a 4-input LUT, a programmable register, a carry chain for arithmetic, and a register chain. The EABs are 4 Kbit blocks (40,960 total / 4 Kbit = 10 EABs typical for this density) usable as single- or dual-port RAM, ROM, or FIFO. The device uses SRAM configuration cells, so it must be configured at every power-up from a serial or parallel configuration PROM.
Typical applications include glue logic replacement, interface bridging (PCI to local bus, UART expansion), digital signal processing front-ends, prototype ASIC validation, and industrial control boards where moderate logic density and embedded memory are needed without the cost of high-density FPGAs.
When designing with this device, ensure the configuration scheme (PS, AS, JTAG) matches the chosen EPC configuration PROM. The 256-ball FineLine BGA is a SameFrame package - designs targeting the EP1K50 family can migrate to EP1K30 (smaller) or EP1K100 (larger) parts with no PCB rework. Watch thermal dissipation: even at modest toggle rates the 0.22 µm process can dissipate 1-2 W in still air; use a minimum 4-layer PCB with an internal ground plane.
This page synthesizes distributor pricing, drop-in alternatives within the ACEX-1K family, and SameFrame PCB-layout guidance not found in the bare datasheet, making it a single source for sourcing, replacement, and design-in decisions.
کے لیے ڈراپ اِن متبادل EP1K50FI256-2N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K50FI256-2N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Package, Speed Grade, Operating Temperature, Configuration Method.
EP1K50FI256-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FI256-2AA
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FI256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FI256-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FI484-2N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FI256-2N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | ACEX-1K |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 2,880 |
| Number of LABs/CLBs | 360 |
| Total RAM Bits | 40,960 |
| Number of Gates | 50,000 (typical); 199,000 (maximum) |
| Number of I/O Pins | 186 (maximum) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) |
| Operating Frequency (max) | 200 MHz (internal) |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| پیکیج | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.8 mm height |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Configuration Method | SRAM - serial/parallel, JTAG (IEEE 1149.1), EPC configuration PROM |
EP1K50FI256-2N 256-ball fineline bga (fbga), 17 x 17 mm, 1.8 mm height پن کنفیگریشن گائیڈ
EP1K50FI256-2N (256-ball fineline bga (fbga), 17 x 17 mm, 1.8 mm height پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP1K50FI256-2N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP1K50FI256-2N کے لیے موزوں ہے 6 ایپلیکیشنs: Glue Logic Replacement and Bus Bridging, Industrial Control and Factory Automation, Digital Signal Processing Front-End, ASIC Prototyping and Design Validation, Legacy Communication Interface Bridging, Test and Measurement Instrumentation Front-End.
Glue Logic Replacement and Bus Bridging
The EP1K50FI256-2N is well suited to replace discrete 74-series glue logic on legacy industrial boards, consolidating address decoding, chip-select generation, and bus arbitration into a single programmable device. Its 2,880 logic elements, 360 LABs, and 186 I/O pins provide ample capacity for multi-bridge designs (e.g., PCI to local bus, ISA to memory-mapped I/O), while the 2.5 V core with separate VCCIO banks allows direct interfacing to 3.3 V and 5 V peripherals. Compared to a CPLD-only solution, the EP1K50 adds EAB-based dual-port RAM (40,960 bits) for small FIFO buffers, eliminating an external SRAM chip. Place the device on a 4-layer PCB with an unbroken ground plane and use the Altera EPC configuration PROM for PS-mode boot to minimize board area.
تجویز کردہ
Industrial Control and Factory Automation
In industrial control cabinets, the EP1K50FI256-2N handles encoder decoding, PWM generation, stepper/digital I/O scanning, and Modbus/Profibus protocol bridging. The 2.5 V core and LVTTL/LVCMOS-compatible I/O support direct connection to 24 V opto-isolated inputs through external level shifters, while 186 user I/O pins provide generous fan-out for multi-axis motion control. The 0.22 µm process and industrial temperature range make the part a robust workhorse for PLC backplanes. Compared to MCU-only solutions, the FPGA's parallel logic execution eliminates instruction-cycle jitter for deterministic control loops. For higher-density industrial designs, migrate to the EP1K100 or to a Cyclone IV/EP4CE part while preserving the 256-FBGA SameFrame footprint.
تجویز کردہ
Digital Signal Processing Front-End
The EP1K50FI256-2N's EAB-based memory and 200 MHz internal frequency make it a practical DSP front-end for FIR filters, FFT pre-processors, and image-processing pipelines at moderate sample rates. Each EAB can implement a 4-Kbit ROM coefficient table or dual-port RAM data buffer, allowing the 40,960 total RAM bits to be split between data and coefficient memory without consuming general LUT resources. The 2,880 LEs provide enough logic for a 16-tap FIR or an 8-point radix-2 FFT at video-line rates. Use the Quartus II or MAX+PLUS II Megafunction Library for DSP cores; for new designs, migrate to Cyclone IV EP4CE6 or later for native DSP blocks and lower power.
تجویز کردہ
ASIC Prototyping and Design Validation
Engineers use the EP1K50FI256-2N as an ASIC prototyping vehicle for mid-complexity ASIC designs (50K-200K gates), taking advantage of its in-system SRAM programmability to iterate RTL quickly without fabrication cost. The 186 I/O pins provide ample off-chip connectivity for emulating ASIC pin-outs, while JTAG-based reconfiguration supports fast design spins. The SameFrame 256-FBGA package allows design teams to swap EP1K30 (smaller), EP1K50 (this part), and EP1K100 (larger) on the same PCB during validation. Compared to ASIC fabrication, ACEX-1K offers a turnaround time measured in minutes. For modern prototyping, migrate to a Cyclone IV or Cyclone V dev kit.
تجویز کردہ
Legacy Communication Interface Bridging
The EP1K50FI256-2N excels at bridging legacy telecom and datacom interfaces (UART, SPI, I2C, parallel bus, HDLC) to modern processors or backplanes. Its 2,880 LEs and EAB RAM allow multi-channel UART engines, HDLC framer/deframer blocks, and DMA controllers to coexist on a single chip. The 200 MHz internal frequency comfortably supports multi-megabaud serial streams, and the 256-FBGA package fits 1U line-card designs with high I/O fan-out. Compared to ASSP bridges, the FPGA allows field-upgradable protocol stacks. For new designs, Intel recommends migrating to Cyclone IV EP4CE6 or EP4CE10 for active lifecycle support and lower power.
تجویز کردہ
Test and Measurement Instrumentation Front-End
In bench-top test equipment (logic analyzers, protocol exercisers, custom digitizers), the EP1K50FI256-2N provides trigger logic, pattern generation, and time-stamping at low cost. The 40,960 bits of EAB RAM allow sample buffers and lookup-table-based waveform synthesis, while the 186 I/O pins can directly drive LVTTL probe pods. The 200 MHz internal clock supports up to 100 MHz external sample rates in pipelined designs. Compared to dedicated test-ASICs, the FPGA offers reconfigurable test sequences in the field. For higher-speed or higher-density test gear, migrate to Cyclone IV or Cyclone V with transceivers, but preserve the 256-FBGA SameFrame mechanical outline if a mechanical retrofit is desired.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K50FI256-2N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K50FI256-2 | EP1K50FI256-2AA | EP1K100FI256-2N | EP1K100FI256-2 |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same (SameFrame) | 256-ball FineLine BGA - same (SameFrame) |
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 2,880 | 2,880 (same) | 2,880 (same) | 4,992 (+73%) | 4,992 (+73%) |
| Number of LABs/CLBs | 360 | 360 (same) | 360 (same) | 624 (+73%) | 624 (+73%) |
| Total RAM Bits | 40,960 | 40,960 (same) | 40,960 (same) | 49,920 (+22%) | 49,920 (+22%) |
| Maximum User I/O | 186 | 186 (same) | 186 (same) | 186 (same) | 186 (same) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Max Internal Frequency | 200 MHz | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- EAB-based embedded memory architecture (بمقابلہEP1K100FI256-2N)
- SameFrame pin-compatible upgrade path (بمقابلہEP1K30FI256-2N)
- Mid-density 50K-gate sweet spot (بمقابلہEP1K100FI256-2N)
ڈیزائن نوٹس
Estimated: the EP1K50FI256-2N core draws approximately 100-300 mA from the 2.5 V rail at full toggle activity, with additional VCCIO bank current proportional to I/O switching. Total power dissipation in a typical 50% toggle-rate design is roughly 1-2 W. Use a low-ESR 100 µF bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling on each VCC pin. Per the ACEX-1K datasheet, VCCIO must be ramped before or simultaneously with VCCINT; reverse sequencing can trigger high inrush current through the I/O cells. Place a power-OK reset supervisor to hold nCONFIG low until both rails are stable.
Use a 4-layer PCB with a continuous internal ground plane directly beneath the 256-FBGA footprint. The 1.0 mm ball pitch requires laser-drilled microvias or via-in-pad for signal escape; the Altera ACEX-1K hardware reference manual recommends 0.2 mm (8 mil) trace width and 0.2 mm via diameter. Provide at least 8 thermal vias in a 3x3 array under the die-shadow region of the package to conduct heat from the BGA balls to the internal ground plane. Match trace lengths within ±50 mil for clock and global signals; use series damping resistors on high-edge-rate outputs to reduce overshoot on the LVTTL/PCI I/O banks.
Common pitfalls: (1) the EP1K50FI256-2N is SRAM-based, so it loses configuration on power-down - always pair it with an Altera EPC1, EPC2, or EPC16 configuration PROM in PS or JTAG mode; (2) the 256-FBGA FineLine BGA is a SameFrame package shared with the EP1K30 and EP1K100, but the unused I/O pins differ - always refer to the ACEX-1K SameFrame pinout table when migrating densities; (3) MSL3 moisture sensitivity requires pre-bake and reflow profile per J-STD-020 to avoid package cracking; (4) counterfeit parts are common in the secondary market - verify lot/date code against the Altera/Intel traceability database before high-volume production use.
تعمیل کی معلومات
The 'N' suffix on EP1K50FI256-2N historically indicates a lead-free terminal finish, but full RoHS/REACH compliance status is not available in the verified web data and should be confirmed against the lot-specific CoC. AEC-Q100 is not applicable for FPGAs - the part is not automotive-qualified.
