EP1K50FI256-2N - 50K-Gate ACEX-1K FPGA 256-BGA | Intel / Altera
부품 번호: EP1K50FI256-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.9 | $23,900.00 |
EP1K50FI256-2N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory blocks (EABs/BRAMs) that the designer can program after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> parallel/serial programmable accelerators. ACEX-1K specifically pairs look-up-table (LUT)-based logic with Embedded Array Blocks (EABs), allowing each EAB to implement RAM, ROM, dual-port RAM, or FIFO without consuming general LUT resources.
Key differentiating features include the EAB-based memory architecture (dual-port RAM and FIFO at up to 40,960 bits), the 360 LABs delivering 2,880 logic elements (10 LEs per LAB), and SameFrame pin-out migration across the 256-pin FineLine BGA family. The die operates from a 2.5 V core supply with separate VCCIO bank voltages, supporting mixed-voltage I/O (LVTTL, LVCMOS, PCI, SSTL). Per the ACEX-1K datasheet family, the device is built on a 0.22 µm SRAM-based process and supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera EPC configuration devices.
Architecturally, each LAB contains 10 LEs, each LE holding a 4-input LUT, a programmable register, a carry chain for arithmetic, and a register chain. The EABs are 4 Kbit blocks (40,960 total / 4 Kbit = 10 EABs typical for this density) usable as single- or dual-port RAM, ROM, or FIFO. The device uses SRAM configuration cells, so it must be configured at every power-up from a serial or parallel configuration PROM.
Typical applications include glue logic replacement, interface bridging (PCI to local bus, UART expansion), digital signal processing front-ends, prototype ASIC validation, and industrial control boards where moderate logic density and embedded memory are needed without the cost of high-density FPGAs.
When designing with this device, ensure the configuration scheme (PS, AS, JTAG) matches the chosen EPC configuration PROM. The 256-ball FineLine BGA is a SameFrame package - designs targeting the EP1K50 family can migrate to EP1K30 (smaller) or EP1K100 (larger) parts with no PCB rework. Watch thermal dissipation: even at modest toggle rates the 0.22 µm process can dissipate 1-2 W in still air; use a minimum 4-layer PCB with an internal ground plane.
This page synthesizes distributor pricing, drop-in alternatives within the ACEX-1K family, and SameFrame PCB-layout guidance not found in the bare datasheet, making it a single source for sourcing, replacement, and design-in decisions.
드롭인 대체품: EP1K50FI256-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K50FI256-2N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Operating Temperature, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K50FI256-2
✅ 드롭인✓ 재고 있음
$23.25 / 개
데이터시트 보기 →EP1K50FI256-2AA
✅ 드롭인✓ 재고 있음
$15.4 / 개
데이터시트 보기 →EP1K100FI256-2N
✅ 드롭인✓ 재고 있음
$55.8 / 개
데이터시트 보기 →EP1K100FI256-2
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP1K100FI484-2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65 / 개
데이터시트 보기 →EP1K50FI256-2N 최대 정격 & 전기적 특성
| Series | ACEX-1K |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 2,880 |
| Number of LABs/CLBs | 360 |
| Total RAM Bits | 40,960 |
| Number of Gates | 50,000 (typical); 199,000 (maximum) |
| Number of I/O Pins | 186 (maximum) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) |
| Operating Frequency (max) | 200 MHz (internal) |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| 패키지 | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.8 mm height |
| 실장 유형 | Surface Mount |
| Configuration Method | SRAM - serial/parallel, JTAG (IEEE 1149.1), EPC configuration PROM |
EP1K50FI256-2N 256-ball fineline bga (fbga), 17 x 17 mm, 1.8 mm height 핀 구성 가이드
EP1K50FI256-2N(256-ball fineline bga (fbga), 17 x 17 mm, 1.8 mm height 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1K50FI256-2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1K50FI256-2N 적합 용도: 6 애플리케이션s: Glue Logic Replacement and Bus Bridging, Industrial Control and Factory Automation, Digital Signal Processing Front-End, ASIC Prototyping and Design Validation, Legacy Communication Interface Bridging, Test and Measurement Instrumentation Front-End.
Glue Logic Replacement and Bus Bridging
The EP1K50FI256-2N is well suited to replace discrete 74-series glue logic on legacy industrial boards, consolidating address decoding, chip-select generation, and bus arbitration into a single programmable device. Its 2,880 logic elements, 360 LABs, and 186 I/O pins provide ample capacity for multi-bridge designs (e.g., PCI to local bus, ISA to memory-mapped I/O), while the 2.5 V core with separate VCCIO banks allows direct interfacing to 3.3 V and 5 V peripherals. Compared to a CPLD-only solution, the EP1K50 adds EAB-based dual-port RAM (40,960 bits) for small FIFO buffers, eliminating an external SRAM chip. Place the device on a 4-layer PCB with an unbroken ground plane and use the Altera EPC configuration PROM for PS-mode boot to minimize board area.
추천
Industrial Control and Factory Automation
In industrial control cabinets, the EP1K50FI256-2N handles encoder decoding, PWM generation, stepper/digital I/O scanning, and Modbus/Profibus protocol bridging. The 2.5 V core and LVTTL/LVCMOS-compatible I/O support direct connection to 24 V opto-isolated inputs through external level shifters, while 186 user I/O pins provide generous fan-out for multi-axis motion control. The 0.22 µm process and industrial temperature range make the part a robust workhorse for PLC backplanes. Compared to MCU-only solutions, the FPGA's parallel logic execution eliminates instruction-cycle jitter for deterministic control loops. For higher-density industrial designs, migrate to the EP1K100 or to a Cyclone IV/EP4CE part while preserving the 256-FBGA SameFrame footprint.
추천
Digital Signal Processing Front-End
The EP1K50FI256-2N's EAB-based memory and 200 MHz internal frequency make it a practical DSP front-end for FIR filters, FFT pre-processors, and image-processing pipelines at moderate sample rates. Each EAB can implement a 4-Kbit ROM coefficient table or dual-port RAM data buffer, allowing the 40,960 total RAM bits to be split between data and coefficient memory without consuming general LUT resources. The 2,880 LEs provide enough logic for a 16-tap FIR or an 8-point radix-2 FFT at video-line rates. Use the Quartus II or MAX+PLUS II Megafunction Library for DSP cores; for new designs, migrate to Cyclone IV EP4CE6 or later for native DSP blocks and lower power.
추천
ASIC Prototyping and Design Validation
Engineers use the EP1K50FI256-2N as an ASIC prototyping vehicle for mid-complexity ASIC designs (50K-200K gates), taking advantage of its in-system SRAM programmability to iterate RTL quickly without fabrication cost. The 186 I/O pins provide ample off-chip connectivity for emulating ASIC pin-outs, while JTAG-based reconfiguration supports fast design spins. The SameFrame 256-FBGA package allows design teams to swap EP1K30 (smaller), EP1K50 (this part), and EP1K100 (larger) on the same PCB during validation. Compared to ASIC fabrication, ACEX-1K offers a turnaround time measured in minutes. For modern prototyping, migrate to a Cyclone IV or Cyclone V dev kit.
추천
Legacy Communication Interface Bridging
The EP1K50FI256-2N excels at bridging legacy telecom and datacom interfaces (UART, SPI, I2C, parallel bus, HDLC) to modern processors or backplanes. Its 2,880 LEs and EAB RAM allow multi-channel UART engines, HDLC framer/deframer blocks, and DMA controllers to coexist on a single chip. The 200 MHz internal frequency comfortably supports multi-megabaud serial streams, and the 256-FBGA package fits 1U line-card designs with high I/O fan-out. Compared to ASSP bridges, the FPGA allows field-upgradable protocol stacks. For new designs, Intel recommends migrating to Cyclone IV EP4CE6 or EP4CE10 for active lifecycle support and lower power.
추천
Test and Measurement Instrumentation Front-End
In bench-top test equipment (logic analyzers, protocol exercisers, custom digitizers), the EP1K50FI256-2N provides trigger logic, pattern generation, and time-stamping at low cost. The 40,960 bits of EAB RAM allow sample buffers and lookup-table-based waveform synthesis, while the 186 I/O pins can directly drive LVTTL probe pods. The 200 MHz internal clock supports up to 100 MHz external sample rates in pipelined designs. Compared to dedicated test-ASICs, the FPGA offers reconfigurable test sequences in the field. For higher-speed or higher-density test gear, migrate to Cyclone IV or Cyclone V with transceivers, but preserve the 256-FBGA SameFrame mechanical outline if a mechanical retrofit is desired.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K50FI256-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K50FI256-2 | EP1K50FI256-2AA | EP1K100FI256-2N | EP1K100FI256-2 |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same (SameFrame) | 256-ball FineLine BGA - same (SameFrame) |
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 2,880 | 2,880 (same) | 2,880 (same) | 4,992 (+73%) | 4,992 (+73%) |
| Number of LABs/CLBs | 360 | 360 (same) | 360 (same) | 624 (+73%) | 624 (+73%) |
| Total RAM Bits | 40,960 | 40,960 (same) | 40,960 (same) | 49,920 (+22%) | 49,920 (+22%) |
| Maximum User I/O | 186 | 186 (same) | 186 (same) | 186 (same) | 186 (same) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Max Internal Frequency | 200 MHz | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- EAB-based embedded memory architecture (vs EP1K100FI256-2N)
- SameFrame pin-compatible upgrade path (vs EP1K30FI256-2N)
- Mid-density 50K-gate sweet spot (vs EP1K100FI256-2N)
설계 노트
Estimated: the EP1K50FI256-2N core draws approximately 100-300 mA from the 2.5 V rail at full toggle activity, with additional VCCIO bank current proportional to I/O switching. Total power dissipation in a typical 50% toggle-rate design is roughly 1-2 W. Use a low-ESR 100 µF bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling on each VCC pin. Per the ACEX-1K datasheet, VCCIO must be ramped before or simultaneously with VCCINT; reverse sequencing can trigger high inrush current through the I/O cells. Place a power-OK reset supervisor to hold nCONFIG low until both rails are stable.
Use a 4-layer PCB with a continuous internal ground plane directly beneath the 256-FBGA footprint. The 1.0 mm ball pitch requires laser-drilled microvias or via-in-pad for signal escape; the Altera ACEX-1K hardware reference manual recommends 0.2 mm (8 mil) trace width and 0.2 mm via diameter. Provide at least 8 thermal vias in a 3x3 array under the die-shadow region of the package to conduct heat from the BGA balls to the internal ground plane. Match trace lengths within ±50 mil for clock and global signals; use series damping resistors on high-edge-rate outputs to reduce overshoot on the LVTTL/PCI I/O banks.
Common pitfalls: (1) the EP1K50FI256-2N is SRAM-based, so it loses configuration on power-down - always pair it with an Altera EPC1, EPC2, or EPC16 configuration PROM in PS or JTAG mode; (2) the 256-FBGA FineLine BGA is a SameFrame package shared with the EP1K30 and EP1K100, but the unused I/O pins differ - always refer to the ACEX-1K SameFrame pinout table when migrating densities; (3) MSL3 moisture sensitivity requires pre-bake and reflow profile per J-STD-020 to avoid package cracking; (4) counterfeit parts are common in the secondary market - verify lot/date code against the Altera/Intel traceability database before high-volume production use.
규정 준수 정보
The 'N' suffix on EP1K50FI256-2N historically indicates a lead-free terminal finish, but full RoHS/REACH compliance status is not available in the verified web data and should be confirmed against the lot-specific CoC. AEC-Q100 is not applicable for FPGAs - the part is not automotive-qualified.
