EP20K1000CF672I8N - APEX 20KC FPGA 1M Gates 672-FBGA | Intel
MPN: EP20K1000CF672I8N ⚠ آخری بار خریداریEP20K1000CF672I8N جائزہ
An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement custom digital circuits through a configurable array of logic elements, embedded memory blocks, and high-speed I/O, all wired together by a programmable interconnect. Within the broader programmable-logic taxonomy, the APEX 20KC family sits at the high-density, multiplier-rich tier used for DSP pipelines, communications backplanes, and protocol-bridging ASIC replacements, sitting between CPLDs and ASICs in cost-versus-flexibility trade-offs.
Key features of the EP20K1000CF672I8N include up to 301.21 MHz internal operation, on-chip embedded system blocks (ESBs) for memory and dual-port RAM, true LVDS I/O support on selected banks, and built-in boundary-scan (JTAG 1149.1) for in-system configuration and test. Multipliers are integrated into the ESB architecture, making the part well suited to fixed-point DSP and FEC applications. The 672-ball FC-FBGA package exposes the full high-speed I/O count and the maximum number of ESBs, both of which are key differentiators versus smaller-footprint APEX 20K siblings.
Typical applications include telecom line-card glue logic, high-speed serial protocol bridges, military/aerospace signal processing, and legacy industrial control retrofits. The APEX 20K architecture remains a popular target for legacy Quartus II design flows still in production at long-lifecycle OEMs. Because the APEX 20KC family is approaching end-of-life on Intel's roadmap, designers planning new programs should evaluate Cyclone IV/V or MAX 10 as modern migration targets, while existing boards can continue using this part for repair and sustainment.
When designing with this device, pay close attention to multi-rail power sequencing (1.8 V VCCINT and 3.3 V VCCIO), proper decoupling per the Altera reference board, and JTAG-driven configuration via the ByteBlasterMV or USB-Blaster download cable. This page synthesizes distributor pricing, drop-in alternatives within the APEX 20K family, and practical design notes not found in the original datasheet.
کے لیے ڈراپ اِن متبادل EP20K1000CF672I8N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP20K1000CF672I8N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
EP20K1000CF672C8N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672I7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672I8
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672C9N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672C9ES
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672C8
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K1000CF672I8N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX 20KC |
| Series | EP20K1000C |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Maximum Internal Frequency | 301.21 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (LVTTL/LVCMOS) |
| Number of Pins / Balls | 672 |
| Package Type | FC-FBGA (Flip-Chip FineLine BGA) |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) |
| Speed Grade | I8 (industrial) |
| آپریٹنگ درجہ حرارت | -40 °C to +100 °C (industrial) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Interface | JTAG 1149.1 (ByteBlasterMV / USB-Blaster) |
EP20K1000CF672I8N fc-fbga (flip-chip fineline bga) پن کنفیگریشن گائیڈ
EP20K1000CF672I8N (fc-fbga (flip-chip fineline bga) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP20K1000CF672I8N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP20K1000CF672I8N کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line-Card Glue Logic, DSP Pipeline / FEC Offload, Legacy Industrial Control Retrofit, High-Speed Protocol Bridge / Bus Converter, Military / Aerospace Signal Processing, ASIC Prototyping and Logic Emulation.
Telecom Line-Card Glue Logic
The EP20K1000CF672I8N's 38,400 logic elements and high I/O count make it ideal for telecom line-card glue logic that bridges network processors to framer ASICs. With 1.8 V VCCINT and 3.3 V VCCIO banks supporting LVTTL/LVCMOS, it interfaces directly to legacy TDM framers and UTOPIA / POS-PHY buses without external level shifters. The 301.21 MHz internal Fmax in the I8 speed grade comfortably handles STS-1 / E1 clock recovery and packet-classification state machines, while embedded system blocks (ESBs) deliver on-chip dual-port RAM for descriptor rings.
تجویز کردہ
DSP Pipeline / FEC Offload
The APEX 20KC architecture embeds multipliers inside the ESBs, allowing the EP20K1000CF672I8N to implement fixed-point DSP pipelines such as Viterbi, Reed-Solomon, and turbo decoders for FEC offload. With 1M system gates and embedded multiplier blocks, the device sustains hundreds of MAC operations per clock cycle at the 301.21 MHz internal Fmax. Industrial temperature rating makes it suitable for outdoor base-station baseband cards, while the FC-FBGA-672 package exposes enough high-speed I/O to stream parallel data into the fabric.
تجویز کردہ
Legacy Industrial Control Retrofit
Many long-lifecycle industrial control platforms still ship boards originally designed around the APEX 20K family, and the EP20K1000CF672I8N remains the supported industrial-temperature FPGA for sustaining these systems. The 1.8 V core plus 3.3 V I/O scheme matches the legacy power-tree of PLCs, motor controllers, and SCADA I/O cards, and the JTAG 1149.1 interface lets field engineers reconfigure via a USB-Blaster without removing the board. Using an FPGA here extends the production life of installed machinery by decades without board respins.
تجویز کردہ
High-Speed Protocol Bridge / Bus Converter
The EP20K1000CF672I8N is widely used as a protocol bridge between proprietary backplanes (VME, cPCI, PMC) and modern serial interfaces, leveraging its mix of 3.3 V LVCMOS and LVDS-capable I/O banks. The 672-ball FC-FBGA package exposes the maximum number of user I/O in the family, sufficient to bridge wide parallel buses (up to 64-bit) while also running serializer-deserializer glue logic in the fabric. Its 1.8 V core and 0.15 µm process keep power dissipation manageable in fan-cooled chassis.
تجویز کردہ
Military / Aerospace Signal Processing
The industrial temperature grade and high logic density make the EP20K1000CF672I8N a popular choice for military and aerospace signal-processing payloads where the platform outlives multiple silicon generations. With 38,400 logic elements and ESB memory, the device can implement radar pre-processors, IR / EO sensor interfaces, and encrypted communication front-ends while fitting into a ruggedized FC-FBGA-672 footprint suitable for conduction-cooled VPX cards. Sustained availability through last-time-buy channels keeps legacy aerospace platforms deployable.
تجویز کردہ
ASIC Prototyping and Logic Emulation
With 1,000,000 system gates, the EP20K1000CF672I8N serves as a cost-effective ASIC prototyping and logic-emulation vehicle in early silicon-validation flows. Quartus II design entry and JTAG-driven configuration allow rapid design iteration, while the FC-FBGA-672 footprint fits standard ASIC-emulation adapter boards. The 301.21 MHz I8 speed grade gives designers confidence that real-time ASIC verification can complete before committing to mask sets, even on multi-million-gate designs split across multiple FPGAs.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP20K1000CF672I8N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP20K1000CF672C8N | EP20K1000CF672I7 | EP20K1000CF672I8 | EP20K1000CF672C9N | EP20K1000CF672C9ES | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Speed Grade | I8 | C8 | I7 (slower) | I8 | C9 (faster) | C9 (faster) | C8 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| RoHS / Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix) | Yes (N suffix) | No (ES marking) | No (no N suffix) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 301.21 MHz | 301.21 MHz | <301.21 MHz (slower) | 301.21 MHz | >301.21 MHz (faster) | >301.21 MHz (faster) | 301.21 MHz |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) | Yes | Yes | Yes | Yes | Yes | Yes |
اہم امتیازی خصوصیات
- Industrial temperature rating with same die as commercial variant (بمقابلہEP20K1000CF672C8N)
- Highest speed grade in industrial temperature tier (بمقابلہEP20K1000CF672I7)
- RoHS lead-free ball finish (بمقابلہEP20K1000CF672I8)
ڈیزائن نوٹس
The EP20K1000CF672I8N requires a tightly regulated 1.8 V VCCINT rail and a separate 3.3 V VCCIO rail with proper sequencing (VCCINT must ramp before or simultaneously with VCCIO). According to Intel's APEX 20K reference design, place at least eight 0.1 µF X7R decoupling capacitors plus four 100 µF bulk capacitors within the BGA footprint; a ferrite bead between VCCINT and the buck converter output is recommended to filter switching ripple that would otherwise couple into PLL supplies.
Estimated: at full logic utilization the EP20K1000CF672I8N draws up to 3 A on VCCINT, dissipating ~5.4 W inside the FC-FBGA-672 package (typical θJA ~12 C/W on a JEDEC 4-layer test board with adequate via stitching). On real boards with restricted airflow, pair the part with a heatsink or thermal pad and confirm junction temperature stays below 100 °C. Industrial-temperature operation assumes ambient up to +100 °C with derating, so conduct margin tests under worst-case load.
The 672-ball FC-FBGA package demands a 1.0 mm pitch BGA land pattern with microvia stack-ups on the top layers; inner rows of balls must escape through staggered microvias to inner signal layers. According to Altera's APEX 20K design guidelines, keep at least four signal layers for break-out, maintain 50 Ω controlled impedance on LVDS pairs, and stitch a full ground pour under the BGA with at least eight thermal vias directly under the die to spread heat.
Do not confuse the EP20K1000CF672I8N with the EP20K1000CB652C7NJ or EP20K1000CF33I8N - these share the same family but use a 652-ball BGA and a 33-mm BGA respectively, and they are NOT pin-compatible with the 672-ball FC-FBGA-672 footprint. Always double-check the ball-map before laying out the PCB, especially when migrating between -CB and -CF suffixes. JTAG configuration requires the nCONFIG pin to be pulled high after POR; leaving it floating can prevent configuration from starting.
تعمیل کی معلومات
RoHS compliant per N suffix in Intel / Altera part numbering. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in verified web data.
