EP20K1000CF672I8N - APEX 20KC FPGA 1M Gates 672-FBGA | Intel
MPN: EP20K1000CF672I8N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $222.1 | $111,050.00 |
| 1,000 | $198.4 | $198,400.00 |
Drop-in alternatives for EP20K1000CF672I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1000CF672C8N
✅ Drop-In✓ In Stock
$178.4 / Unit
View Datasheet →EP20K1000CF672I7
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K1000CF672I8
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP20K1000CF672C9N
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP20K1000CF672C9ES
✅ Drop-In✓ In Stock
$385 / Unit
View Datasheet →EP20K1000CF672C8
✅ Drop-In✓ In Stock
$245.09 / Unit
View Datasheet →EP20K1000CF672I8N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Series | EP20K1000C |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Maximum Internal Frequency | 301.21 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (LVTTL/LVCMOS) |
| Number of Pins / Balls | 672 |
| Package Type | FC-FBGA (Flip-Chip FineLine BGA) |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) |
| Speed Grade | I8 (industrial) |
| Operating Temperature | -40 °C to +100 °C (industrial) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Interface | JTAG 1149.1 (ByteBlasterMV / USB-Blaster) |
EP20K1000CF672I8N fc-fbga (flip-chip fineline bga) Pin Configuration Guide
Complete pinout information for EP20K1000CF672I8N (fc-fbga (flip-chip fineline bga) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672I8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672I8N is suitable for 6 applications: Telecom Line-Card Glue Logic, DSP Pipeline / FEC Offload, Legacy Industrial Control Retrofit, High-Speed Protocol Bridge / Bus Converter, Military / Aerospace Signal Processing, ASIC Prototyping and Logic Emulation.
Telecom Line-Card Glue Logic
The EP20K1000CF672I8N's 38,400 logic elements and high I/O count make it ideal for telecom line-card glue logic that bridges network processors to framer ASICs. With 1.8 V VCCINT and 3.3 V VCCIO banks supporting LVTTL/LVCMOS, it interfaces directly to legacy TDM framers and UTOPIA / POS-PHY buses without external level shifters. The 301.21 MHz internal Fmax in the I8 speed grade comfortably handles STS-1 / E1 clock recovery and packet-classification state machines, while embedded system blocks (ESBs) deliver on-chip dual-port RAM for descriptor rings.
Recommended
DSP Pipeline / FEC Offload
The APEX 20KC architecture embeds multipliers inside the ESBs, allowing the EP20K1000CF672I8N to implement fixed-point DSP pipelines such as Viterbi, Reed-Solomon, and turbo decoders for FEC offload. With 1M system gates and embedded multiplier blocks, the device sustains hundreds of MAC operations per clock cycle at the 301.21 MHz internal Fmax. Industrial temperature rating makes it suitable for outdoor base-station baseband cards, while the FC-FBGA-672 package exposes enough high-speed I/O to stream parallel data into the fabric.
Recommended
Legacy Industrial Control Retrofit
Many long-lifecycle industrial control platforms still ship boards originally designed around the APEX 20K family, and the EP20K1000CF672I8N remains the supported industrial-temperature FPGA for sustaining these systems. The 1.8 V core plus 3.3 V I/O scheme matches the legacy power-tree of PLCs, motor controllers, and SCADA I/O cards, and the JTAG 1149.1 interface lets field engineers reconfigure via a USB-Blaster without removing the board. Using an FPGA here extends the production life of installed machinery by decades without board respins.
Recommended
High-Speed Protocol Bridge / Bus Converter
The EP20K1000CF672I8N is widely used as a protocol bridge between proprietary backplanes (VME, cPCI, PMC) and modern serial interfaces, leveraging its mix of 3.3 V LVCMOS and LVDS-capable I/O banks. The 672-ball FC-FBGA package exposes the maximum number of user I/O in the family, sufficient to bridge wide parallel buses (up to 64-bit) while also running serializer-deserializer glue logic in the fabric. Its 1.8 V core and 0.15 µm process keep power dissipation manageable in fan-cooled chassis.
Recommended
Military / Aerospace Signal Processing
The industrial temperature grade and high logic density make the EP20K1000CF672I8N a popular choice for military and aerospace signal-processing payloads where the platform outlives multiple silicon generations. With 38,400 logic elements and ESB memory, the device can implement radar pre-processors, IR / EO sensor interfaces, and encrypted communication front-ends while fitting into a ruggedized FC-FBGA-672 footprint suitable for conduction-cooled VPX cards. Sustained availability through last-time-buy channels keeps legacy aerospace platforms deployable.
Recommended
ASIC Prototyping and Logic Emulation
With 1,000,000 system gates, the EP20K1000CF672I8N serves as a cost-effective ASIC prototyping and logic-emulation vehicle in early silicon-validation flows. Quartus II design entry and JTAG-driven configuration allow rapid design iteration, while the FC-FBGA-672 footprint fits standard ASIC-emulation adapter boards. The 301.21 MHz I8 speed grade gives designers confidence that real-time ASIC verification can complete before committing to mask sets, even on multi-million-gate designs split across multiple FPGAs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C8N | EP20K1000CF672I7 | EP20K1000CF672I8 | EP20K1000CF672C9N | EP20K1000CF672C9ES | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Speed Grade | I8 | C8 | I7 (slower) | I8 | C9 (faster) | C9 (faster) | C8 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| RoHS / Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix) | Yes (N suffix) | No (ES marking) | No (no N suffix) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 301.21 MHz | 301.21 MHz | <301.21 MHz (slower) | 301.21 MHz | >301.21 MHz (faster) | >301.21 MHz (faster) | 301.21 MHz |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature rating with same die as commercial variant (vs EP20K1000CF672C8N)
- Highest speed grade in industrial temperature tier (vs EP20K1000CF672I7)
- RoHS lead-free ball finish (vs EP20K1000CF672I8)
Design Notes
The EP20K1000CF672I8N requires a tightly regulated 1.8 V VCCINT rail and a separate 3.3 V VCCIO rail with proper sequencing (VCCINT must ramp before or simultaneously with VCCIO). According to Intel's APEX 20K reference design, place at least eight 0.1 µF X7R decoupling capacitors plus four 100 µF bulk capacitors within the BGA footprint; a ferrite bead between VCCINT and the buck converter output is recommended to filter switching ripple that would otherwise couple into PLL supplies.
Estimated: at full logic utilization the EP20K1000CF672I8N draws up to 3 A on VCCINT, dissipating ~5.4 W inside the FC-FBGA-672 package (typical θJA ~12 C/W on a JEDEC 4-layer test board with adequate via stitching). On real boards with restricted airflow, pair the part with a heatsink or thermal pad and confirm junction temperature stays below 100 °C. Industrial-temperature operation assumes ambient up to +100 °C with derating, so conduct margin tests under worst-case load.
The 672-ball FC-FBGA package demands a 1.0 mm pitch BGA land pattern with microvia stack-ups on the top layers; inner rows of balls must escape through staggered microvias to inner signal layers. According to Altera's APEX 20K design guidelines, keep at least four signal layers for break-out, maintain 50 Ω controlled impedance on LVDS pairs, and stitch a full ground pour under the BGA with at least eight thermal vias directly under the die to spread heat.
Do not confuse the EP20K1000CF672I8N with the EP20K1000CB652C7NJ or EP20K1000CF33I8N - these share the same family but use a 652-ball BGA and a 33-mm BGA respectively, and they are NOT pin-compatible with the 672-ball FC-FBGA-672 footprint. Always double-check the ball-map before laying out the PCB, especially when migrating between -CB and -CF suffixes. JTAG configuration requires the nCONFIG pin to be pulled high after POR; leaving it floating can prevent configuration from starting.
Compliance Information
RoHS compliant per N suffix in Intel / Altera part numbering. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in verified web data.
