EP20K1000CF672I8N - APEX 20KC FPGA 1M Gates 672-FBGA | Intel
부품 번호: EP20K1000CF672I8N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $222.1 | $111,050.00 |
| 1,000 | $198.4 | $198,400.00 |
EP20K1000CF672I8N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement custom digital circuits through a configurable array of logic elements, embedded memory blocks, and high-speed I/O, all wired together by a programmable interconnect. Within the broader programmable-logic taxonomy, the APEX 20KC family sits at the high-density, multiplier-rich tier used for DSP pipelines, communications backplanes, and protocol-bridging ASIC replacements, sitting between CPLDs and ASICs in cost-versus-flexibility trade-offs.
Key features of the EP20K1000CF672I8N include up to 301.21 MHz internal operation, on-chip embedded system blocks (ESBs) for memory and dual-port RAM, true LVDS I/O support on selected banks, and built-in boundary-scan (JTAG 1149.1) for in-system configuration and test. Multipliers are integrated into the ESB architecture, making the part well suited to fixed-point DSP and FEC applications. The 672-ball FC-FBGA package exposes the full high-speed I/O count and the maximum number of ESBs, both of which are key differentiators versus smaller-footprint APEX 20K siblings.
Typical applications include telecom line-card glue logic, high-speed serial protocol bridges, military/aerospace signal processing, and legacy industrial control retrofits. The APEX 20K architecture remains a popular target for legacy Quartus II design flows still in production at long-lifecycle OEMs. Because the APEX 20KC family is approaching end-of-life on Intel's roadmap, designers planning new programs should evaluate Cyclone IV/V or MAX 10 as modern migration targets, while existing boards can continue using this part for repair and sustainment.
When designing with this device, pay close attention to multi-rail power sequencing (1.8 V VCCINT and 3.3 V VCCIO), proper decoupling per the Altera reference board, and JTAG-driven configuration via the ByteBlasterMV or USB-Blaster download cable. This page synthesizes distributor pricing, drop-in alternatives within the APEX 20K family, and practical design notes not found in the original datasheet.
드롭인 대체품: EP20K1000CF672I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1000CF672I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1000CF672C8N
✅ 드롭인✓ 재고 있음
$178.4 / 개
데이터시트 보기 →EP20K1000CF672I7
✅ 드롭인✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K1000CF672I8
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K1000CF672C9N
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K1000CF672C9ES
✅ 드롭인✓ 재고 있음
$385 / 개
데이터시트 보기 →EP20K1000CF672C8
✅ 드롭인✓ 재고 있음
$245.09 / 개
데이터시트 보기 →EP20K1000CF672I8N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Series | EP20K1000C |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Maximum Internal Frequency | 301.21 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (LVTTL/LVCMOS) |
| Number of Pins / Balls | 672 |
| Package Type | FC-FBGA (Flip-Chip FineLine BGA) |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) |
| Speed Grade | I8 (industrial) |
| 동작 온도 | -40 °C to +100 °C (industrial) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Interface | JTAG 1149.1 (ByteBlasterMV / USB-Blaster) |
EP20K1000CF672I8N fc-fbga (flip-chip fineline bga) 핀 구성 가이드
EP20K1000CF672I8N(fc-fbga (flip-chip fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1000CF672I8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1000CF672I8N 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, DSP Pipeline / FEC Offload, Legacy Industrial Control Retrofit, High-Speed Protocol Bridge / Bus Converter, Military / Aerospace Signal Processing, ASIC Prototyping and Logic Emulation.
Telecom Line-Card Glue Logic
The EP20K1000CF672I8N's 38,400 logic elements and high I/O count make it ideal for telecom line-card glue logic that bridges network processors to framer ASICs. With 1.8 V VCCINT and 3.3 V VCCIO banks supporting LVTTL/LVCMOS, it interfaces directly to legacy TDM framers and UTOPIA / POS-PHY buses without external level shifters. The 301.21 MHz internal Fmax in the I8 speed grade comfortably handles STS-1 / E1 clock recovery and packet-classification state machines, while embedded system blocks (ESBs) deliver on-chip dual-port RAM for descriptor rings.
추천
DSP Pipeline / FEC Offload
The APEX 20KC architecture embeds multipliers inside the ESBs, allowing the EP20K1000CF672I8N to implement fixed-point DSP pipelines such as Viterbi, Reed-Solomon, and turbo decoders for FEC offload. With 1M system gates and embedded multiplier blocks, the device sustains hundreds of MAC operations per clock cycle at the 301.21 MHz internal Fmax. Industrial temperature rating makes it suitable for outdoor base-station baseband cards, while the FC-FBGA-672 package exposes enough high-speed I/O to stream parallel data into the fabric.
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Legacy Industrial Control Retrofit
Many long-lifecycle industrial control platforms still ship boards originally designed around the APEX 20K family, and the EP20K1000CF672I8N remains the supported industrial-temperature FPGA for sustaining these systems. The 1.8 V core plus 3.3 V I/O scheme matches the legacy power-tree of PLCs, motor controllers, and SCADA I/O cards, and the JTAG 1149.1 interface lets field engineers reconfigure via a USB-Blaster without removing the board. Using an FPGA here extends the production life of installed machinery by decades without board respins.
추천
High-Speed Protocol Bridge / Bus Converter
The EP20K1000CF672I8N is widely used as a protocol bridge between proprietary backplanes (VME, cPCI, PMC) and modern serial interfaces, leveraging its mix of 3.3 V LVCMOS and LVDS-capable I/O banks. The 672-ball FC-FBGA package exposes the maximum number of user I/O in the family, sufficient to bridge wide parallel buses (up to 64-bit) while also running serializer-deserializer glue logic in the fabric. Its 1.8 V core and 0.15 µm process keep power dissipation manageable in fan-cooled chassis.
추천
Military / Aerospace Signal Processing
The industrial temperature grade and high logic density make the EP20K1000CF672I8N a popular choice for military and aerospace signal-processing payloads where the platform outlives multiple silicon generations. With 38,400 logic elements and ESB memory, the device can implement radar pre-processors, IR / EO sensor interfaces, and encrypted communication front-ends while fitting into a ruggedized FC-FBGA-672 footprint suitable for conduction-cooled VPX cards. Sustained availability through last-time-buy channels keeps legacy aerospace platforms deployable.
추천
ASIC Prototyping and Logic Emulation
With 1,000,000 system gates, the EP20K1000CF672I8N serves as a cost-effective ASIC prototyping and logic-emulation vehicle in early silicon-validation flows. Quartus II design entry and JTAG-driven configuration allow rapid design iteration, while the FC-FBGA-672 footprint fits standard ASIC-emulation adapter boards. The 301.21 MHz I8 speed grade gives designers confidence that real-time ASIC verification can complete before committing to mask sets, even on multi-million-gate designs split across multiple FPGAs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K1000CF672I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1000CF672C8N | EP20K1000CF672I7 | EP20K1000CF672I8 | EP20K1000CF672C9N | EP20K1000CF672C9ES | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 | FC-FBGA-672 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Speed Grade | I8 | C8 | I7 (slower) | I8 | C9 (faster) | C9 (faster) | C8 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| RoHS / Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix) | Yes (N suffix) | No (ES marking) | No (no N suffix) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 301.21 MHz | 301.21 MHz | <301.21 MHz (slower) | 301.21 MHz | >301.21 MHz (faster) | >301.21 MHz (faster) | 301.21 MHz |
| Embedded System Blocks (ESBs) | Yes (memory + multipliers) | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Industrial temperature rating with same die as commercial variant (vs EP20K1000CF672C8N)
- Highest speed grade in industrial temperature tier (vs EP20K1000CF672I7)
- RoHS lead-free ball finish (vs EP20K1000CF672I8)
설계 노트
The EP20K1000CF672I8N requires a tightly regulated 1.8 V VCCINT rail and a separate 3.3 V VCCIO rail with proper sequencing (VCCINT must ramp before or simultaneously with VCCIO). According to Intel's APEX 20K reference design, place at least eight 0.1 µF X7R decoupling capacitors plus four 100 µF bulk capacitors within the BGA footprint; a ferrite bead between VCCINT and the buck converter output is recommended to filter switching ripple that would otherwise couple into PLL supplies.
Estimated: at full logic utilization the EP20K1000CF672I8N draws up to 3 A on VCCINT, dissipating ~5.4 W inside the FC-FBGA-672 package (typical θJA ~12 C/W on a JEDEC 4-layer test board with adequate via stitching). On real boards with restricted airflow, pair the part with a heatsink or thermal pad and confirm junction temperature stays below 100 °C. Industrial-temperature operation assumes ambient up to +100 °C with derating, so conduct margin tests under worst-case load.
The 672-ball FC-FBGA package demands a 1.0 mm pitch BGA land pattern with microvia stack-ups on the top layers; inner rows of balls must escape through staggered microvias to inner signal layers. According to Altera's APEX 20K design guidelines, keep at least four signal layers for break-out, maintain 50 Ω controlled impedance on LVDS pairs, and stitch a full ground pour under the BGA with at least eight thermal vias directly under the die to spread heat.
Do not confuse the EP20K1000CF672I8N with the EP20K1000CB652C7NJ or EP20K1000CF33I8N - these share the same family but use a 652-ball BGA and a 33-mm BGA respectively, and they are NOT pin-compatible with the 672-ball FC-FBGA-672 footprint. Always double-check the ball-map before laying out the PCB, especially when migrating between -CB and -CF suffixes. JTAG configuration requires the nCONFIG pin to be pulled high after POR; leaving it floating can prevent configuration from starting.
규정 준수 정보
RoHS compliant per N suffix in Intel / Altera part numbering. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in verified web data.
