Intel

EP20K1000CF672I8 - APEX 20KC FPGA, 1M Gates, 672-FBGA | Intel

MPN: EP20K1000CF672I8 ✗ اختتامِ زندگی

1.71 V to 1.89 V (1.8 V nominal) Vdss LVTTL, LVCMOS, PCI, SSTL, HSTL Rds(on) 672-pin FC-FBGA (FineLine BGA) Package 301.21 MHz Speed SRAM-based (volatile) Memory

قیمت کی درخواست کریں

MOQ: 1 |

ڈیٹا شیٹ دیکھیں (PDF) متبادل دیکھیں

مقدار

EP20K1000CF672I8 جائزہ

The Intel (formerly Altera) EP20K1000CF672I8 is a high-density APEX 20KC family FPGA delivering 1,000,000 system gates and 38,400 logic elements in a 672-pin FineLine BGA package. Built on a 0.15 µm CMOS process, it operates from a 1.71 V to 1.89 V core supply (1.8 V nominal) and supports up to 508 user I/O plus 4 dedicated inputs, giving designers ample pins for high-bandwidth parallel interfaces.

An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between PALs/CPLDs (low-density, non-volatile, fixed interconnect) and ASICs (high-density, fixed-function, high NRE). The APEX 20KC family belongs to Intel's high-density SRAM-based programmable logic hierarchy: FPGA → programmable logic device → PLD → semiconductor. Because APEX 20KC cells are SRAM-backed, the device is re-programmable in-system and supports the MultiCore interconnect with embedded array blocks (EABs) for on-chip memory and constant storage.

Key features include 1M system gates, 38,400 logic elements, embedded array blocks (EABs) for true dual-port RAM and FIFO, four phase-locked loops (PLLs) for clock management, and LVTTL/LVCMOS/PCI/SSTL/HSTL I/O standards. Internal performance supports designs up to 301.21 MHz, and the 672-ball FineLine BGA package uses a 1.00 mm ball pitch suited for high-density, multi-layer PCB layouts. The industrial temperature grade (-40 °C to +85 °C) and 8 ns pin-to-pin logic delay further broaden its applicability.

Architecturally, the EP20K1000CF672I8 combines a fine-grained logic element fabric with coarse-grained EABs, allowing efficient implementation of wide datapath functions, FIFOs, and DSP-style multipliers without consuming excessive logic. The MultiCore interconnect provides predictable routing delays, which is essential for closing timing on multi-megahertz designs. Four PLLs support clock multiplication, division, and phase shifting, enabling multiple clock domains within a single device.

Typical applications include telecommunications backplane glue logic, PCI/PCI-X bridge and bus-interface controllers, high-speed parallel DSP pre-processing, industrial motion control and vision processing, and replacement of multiple CPLDs and gate arrays with a single reconfigurable part. The 508 I/O count makes the EP20K1000CF672I8 well suited for legacy 32-bit/64-bit bus aggregation that would otherwise require several discrete components.

When designing with this device, ensure all configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK) are pulled to the correct logic levels before power-up, and provide a stable 1.8 V supply with adequate bulk decoupling because SRAM-based FPGAs draw large inrush currents during configuration. Plan for JTAG (IEEE 1149.1) boundary-scan access to simplify board test.

کے لیے ڈراپ اِن متبادل EP20K1000CF672I8 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP20K1000CF672I8 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Speed Grade, Process Technology, Configuration Interface.

EP20K1000CF672C7

Intel

Operating Temperature: 0 °C to +85 °C (commercial, C suffix)

Package: 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch)

Speed Grade: C7 (fastest)