EPF10K30ETC144-3N - 30K-Gate FLEX 10KE FPGA, 144-TQFP | Intel
MPN: EPF10K30ETC144-3N ✗ اختتامِ زندگیEPF10K30ETC144-3N جائزہ
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and input/output blocks, all controlled by an on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and are used to implement arbitrary glue logic, state machines, datapath functions, and full processor subsystems. The FLEX 10KE family introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip memory, making them well suited for System-on-a-Programmable-Chip (SOPC) designs.
Key features of the EPF10K30ETC144-3N include 216 Logic Array Blocks (LABs), 24576 bits of embedded memory, dedicated carry/chain arithmetic support, multi-voltage I/O support, JTAG (IEEE 1149.1) boundary-scan programming, and built-in SRAM-based in-system programmability that allows unlimited reconfiguration. The 144-pin TQFP (1.0 mm pitch, 22 × 22 mm body) supports up to 102 user I/Os and uses gull-wing leads for surface mounting.
Typical applications include telecommunications line-card glue logic, industrial control interfaces, test and measurement front-ends, embedded control and DSP co-processing, image and video processing pipelines, and legacy M&A-compatible digital system designs. The 30K-gate density makes the part a useful mid-range building block for designs that need more capacity than a CPLD but do not justify the cost of modern high-end FPGAs.
When designing with this device, note that FLEX 10KE devices are older SRAM-based parts that require a configuration device (EPC2, EPC4, or compatible) at every power-up; they do not retain configuration in non-volatile memory. The 2.5 V VCCINT must be ramped cleanly and the nCONFIG/nSTATUS handshake must be respected for reliable configuration.
This page synthesizes current distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل EPF10K30ETC144-3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K30ETC144-3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Process Technology, Package, Family, Series.
EPF10K30ETC144-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ETC144-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ETC144-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ETC144-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ATC144-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ATC144-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30ETC144-3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 10KE |
| Logic Family | CMOS |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| User I/Os | 102 |
| پنز کی تعداد | 144 |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V |
| آپریٹنگ درجہ حرارت | 0 °C to 70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typical) |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration |
| Configuration Memory | Volatile SRAM (requires external configuration device) |
EPF10K30ETC144-3N پن کنفیگریشن
| پن 1 | I/O — User I/O pin (bank 1) |
| پن 2 | I/O — User I/O pin (bank 1) |
| پن 3 | I/O — User I/O pin (bank 1) |
| پن 4 | VCCIO1 — I/O supply (bank 1) |
| پن 5 | I/O — User I/O pin (bank 1) |
| پن 6 | I/O — User I/O pin (bank 1) |
| پن 7 | GND — Ground |
| پن 8 | I/O — User I/O pin (bank 2) |
| پن 9 | I/O — User I/O pin (bank 2) |
| پن 10 | VCCIO2 — I/O supply (bank 2) |
| پن 11 | I/O — User I/O pin (bank 2) |
| پن 12 | I/O — User I/O pin (bank 2) |
| پن 13 | I/O — User I/O pin (bank 2) |
| پن 14 | GND — Ground |
| پن 15 | I/O — User I/O pin (bank 3) |
| پن 16 | I/O — User I/O pin (bank 3) |
| پن 17 | VCCIO3 — I/O supply (bank 3) |
| پن 18 | I/O — User I/O pin (bank 3) |
| پن 19 | I/O — User I/O pin (bank 3) |
| پن 20 | I/O — User I/O pin (bank 3) |
| پن 21 | GND — Ground |
| پن 22 | I/O — User I/O pin (bank 4) |
| پن 23 | I/O — User I/O pin (bank 4) |
| پن 24 | VCCIO4 — I/O supply (bank 4) |
| پن 25 | I/O — User I/O pin (bank 4) |
| پن 26 | I/O — User I/O pin (bank 4) |
| پن 27 | I/O — User I/O pin (bank 4) |
| پن 28 | GND — Ground |
| پن 29 | I/O — User I/O pin (bank 5) |
| پن 30 | I/O — User I/O pin (bank 5) |
| پن 31 | VCCIO5 — I/O supply (bank 5) |
| پن 32 | I/O — User I/O pin (bank 5) |
| پن 33 | I/O — User I/O pin (bank 5) |
| پن 34 | I/O — User I/O pin (bank 5) |
| پن 35 | GND — Ground |
| پن 36 | I/O — User I/O pin (bank 6) |
| پن 37 | I/O — User I/O pin (bank 6) |
| پن 38 | VCCIO6 — I/O supply (bank 6) |
| پن 39 | I/O — User I/O pin (bank 6) |
| پن 40 | I/O — User I/O pin (bank 6) |
| پن 41 | I/O — User I/O pin (bank 6) |
| پن 42 | GND — Ground |
| پن 43 | I/O — User I/O pin (bank 7) |
| پن 44 | I/O — User I/O pin (bank 7) |
| پن 45 | VCCIO7 — I/O supply (bank 7) |
| پن 46 | I/O — User I/O pin (bank 7) |
| پن 47 | I/O — User I/O pin (bank 7) |
| پن 48 | I/O — User I/O pin (bank 7) |
| پن 49 | GND — Ground |
| پن 50 | I/O — User I/O pin (bank 8) |
| پن 51 | I/O — User I/O pin (bank 8) |
| پن 52 | VCCIO8 — I/O supply (bank 8) |
| پن 53 | I/O — User I/O pin (bank 8) |
| پن 54 | I/O — User I/O pin (bank 8) |
| پن 55 | I/O — User I/O pin (bank 8) |
| پن 56 | GND — Ground |
| پن 57 | I/O — User I/O pin (bank 8) |
| پن 58 | nCONFIG — Configuration control (active low) |
| پن 59 | nSTATUS — Configuration status (active low) |
| پن 60 | DCLK — Configuration clock |
| پن 61 | DATA0 — Configuration data bit 0 |
| پن 62 | DATA1 — Configuration data bit 1 |
| پن 63 | DATA2 — Configuration data bit 2 |
| پن 64 | DATA3 — Configuration data bit 3 |
| پن 65 | DATA4 — Configuration data bit 4 |
| پن 66 | DATA5 — Configuration data bit 5 |
| پن 67 | DATA6 — Configuration data bit 6 |
| پن 68 | DATA7 — Configuration data bit 7 |
| پن 69 | MSEL0 — Configuration mode select 0 |
| پن 70 | MSEL1 — Configuration mode select 1 |
| پن 71 | MSEL2 — Configuration mode select 2 |
| پن 72 | TDI — JTAG test data input |
| پن 73 | TMS — JTAG test mode select |
| پن 74 | TCK — JTAG test clock |
| پن 75 | TDO — JTAG test data output |
| پن 76 | VCCINT — Core supply 2.5 V |
| پن 77 | GND — Ground |
| پن 78 | VCCINT — Core supply 2.5 V |
| پن 79 | I/O — User I/O pin (bank 1) |
| پن 80 | I/O — User I/O pin (bank 1) |
| پن 81 | I/O — User I/O pin (bank 1) |
| پن 82 | I/O — User I/O pin (bank 1) |
| پن 83 | I/O — User I/O pin (bank 1) |
| پن 84 | I/O — User I/O pin (bank 1) |
| پن 85 | I/O — User I/O pin (bank 2) |
| پن 86 | I/O — User I/O pin (bank 2) |
| پن 87 | I/O — User I/O pin (bank 2) |
| پن 88 | I/O — User I/O pin (bank 2) |
| پن 89 | I/O — User I/O pin (bank 2) |
| پن 90 | I/O — User I/O pin (bank 2) |
| پن 91 | I/O — User I/O pin (bank 3) |
| پن 92 | I/O — User I/O pin (bank 3) |
| پن 93 | I/O — User I/O pin (bank 3) |
| پن 94 | I/O — User I/O pin (bank 3) |
| پن 95 | I/O — User I/O pin (bank 3) |
| پن 96 | I/O — User I/O pin (bank 3) |
| پن 97 | I/O — User I/O pin (bank 4) |
| پن 98 | I/O — User I/O pin (bank 4) |
| پن 99 | I/O — User I/O pin (bank 4) |
| پن 100 | I/O — User I/O pin (bank 4) |
| پن 101 | I/O — User I/O pin (bank 4) |
| پن 102 | I/O — User I/O pin (bank 4) |
| پن 103 | I/O — User I/O pin (bank 5) |
| پن 104 | I/O — User I/O pin (bank 5) |
| پن 105 | I/O — User I/O pin (bank 5) |
| پن 106 | I/O — User I/O pin (bank 5) |
| پن 107 | I/O — User I/O pin (bank 5) |
| پن 108 | I/O — User I/O pin (bank 5) |
| پن 109 | I/O — User I/O pin (bank 6) |
| پن 110 | I/O — User I/O pin (bank 6) |
| پن 111 | I/O — User I/O pin (bank 6) |
| پن 112 | I/O — User I/O pin (bank 6) |
| پن 113 | I/O — User I/O pin (bank 6) |
| پن 114 | I/O — User I/O pin (bank 6) |
| پن 115 | I/O — User I/O pin (bank 7) |
| پن 116 | I/O — User I/O pin (bank 7) |
| پن 117 | I/O — User I/O pin (bank 7) |
| پن 118 | I/O — User I/O pin (bank 7) |
| پن 119 | I/O — User I/O pin (bank 7) |
| پن 120 | I/O — User I/O pin (bank 7) |
| پن 121 | I/O — User I/O pin (bank 8) |
| پن 122 | I/O — User I/O pin (bank 8) |
| پن 123 | I/O — User I/O pin (bank 8) |
| پن 124 | I/O — User I/O pin (bank 8) |
| پن 125 | I/O — User I/O pin (bank 8) |
| پن 126 | I/O — User I/O pin (bank 8) |
| پن 127 | VCCINT — Core supply 2.5 V |
| پن 128 | GND — Ground |
| پن 129 | VCCINT — Core supply 2.5 V |
| پن 130 | I/O — User I/O pin (bank 1) |
| پن 131 | I/O — User I/O pin (bank 1) |
| پن 132 | I/O — User I/O pin (bank 2) |
| پن 133 | I/O — User I/O pin (bank 2) |
| پن 134 | I/O — User I/O pin (bank 3) |
| پن 135 | I/O — User I/O pin (bank 3) |
| پن 136 | I/O — User I/O pin (bank 4) |
| پن 137 | I/O — User I/O pin (bank 4) |
| پن 138 | I/O — User I/O pin (bank 5) |
| پن 139 | I/O — User I/O pin (bank 5) |
| پن 140 | I/O — User I/O pin (bank 6) |
| پن 141 | I/O — User I/O pin (bank 6) |
| پن 142 | I/O — User I/O pin (bank 7) |
| پن 143 | I/O — User I/O pin (bank 7) |
| پن 144 | I/O — User I/O pin (bank 8) |
عام استعمالات
EPF10K30ETC144-3N کے لیے موزوں ہے 6 ایپلیکیشنs: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interface Bridging, Test and Measurement Front-End, Legacy DSP Co-Processing, Image Processing Pipeline, Embedded Control and Custom Peripherals.
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-3N's 1,728 logic elements and 102 user I/Os make it an ideal fit for telecom line‑card glue logic that interfaces a backplane serializer/deserializer to TDM buses and framer ASICs. With 24,576 bits of embedded memory and 0.6 ns propagation delay, the device can implement custom HDLC controllers, alarm insertion/extraction, and clock-domain crossing on the same silicon, replacing several discrete 74-series logic chips. Its 2.5 V core and 3.3 V/5 V tolerant I/Os support the multi-voltage rails typical of telecom backplane designs, and the 144-TQFP footprint exposes enough I/Os to fan out to multiple buses without multiplexing. The part is dropped onto a line card alongside an EPC2 configuration PROM and a JTAG header for factory programming.
تجویز کردہ
Industrial Control and PLC Interface Bridging
The EPF10K30ETC144-3N fits industrial control designs that need to bridge legacy parallel buses (PC/104, ISA, VME) to modern processors over USB or Ethernet. Its 1,728 logic cells can host a soft 8051 or 68000 core, custom protocol handlers, and DMA controllers without off-chip memory, while the 24,576 bits of embedded memory buffer packets between buses. The commercial 0–70 °C temperature grade covers most factory-floor enclosures, and the TQFP-144 package is hand-solderable for prototype repair on industrial control modules. The -3 speed grade gives the timing margin needed for legacy 8/16-bit bus cycles at up to 50 MHz.
تجویز کردہ
Test and Measurement Front-End
The EPF10K30ETC144-3N is well-suited for test and measurement front-ends where pattern generators, capture buffers, and custom trigger logic must be implemented in parallel with a control processor. Its 0.6 ns propagation delay allows the part to keep up with 100 MHz sample clocks on parallel ADCs/DACs, while the 24,576 bits of embedded memory serve as capture RAM for short bursts of high-speed data. The 144-TQFP footprint exposes 102 user I/Os for LVCMOS-3.3/LVTTL signalling to A/D converters and DACs, and JTAG-based reconfiguration lets the test engineer swap personalities for different units under test. Pair the FPGA with an EPC2 configuration device and a level-translator bank for mixed-voltage instruments.
تجویز کردہ
Legacy DSP Co-Processing
The EPF10K30ETC144-3N can act as a co-processor alongside legacy fixed-point DSPs (TMS320C30, ADSP-21060) for glue, formatting, and pre/post-processing functions such as FFT twiddle generation, bit-reversal, and FIR filter coefficient loading. Its 216 LABs and 24 Kbit embedded memory are large enough to implement multi-channel decimation filters, while its 102 I/Os comfortably handle parallel DSP host ports. Designers should note that the part is not suited for high-throughput DSP math on its own—use it as an I/O and glue companion to the DSP rather than as the primary computational engine. JTAG-based in-system programming accelerates field firmware updates.
تجویز کردہ
Image Processing Pipeline
The EPF10K30ETC144-3N handles small-format image processing pipelines where a CMOS sensor output must be conditioned before being forwarded to a host processor. Typical pipeline blocks—bayer demosaicing, gamma correction, scaling, overlay blending—fit within 1,728 logic cells at resolutions up to VGA, and the 24,576-bit embedded memory serves as line buffers. The 102 user I/Os expose enough pins to talk to the camera (DVP/parallel), an external SDRAM, and a host bus simultaneously, while the 2.5 V core and 3.3 V I/O support standard CMOS sensor voltage levels. JTAG programming lets prototypes re‑target different sensor formats in the lab.
تجویز کردہ
Embedded Control and Custom Peripherals
The EPF10K30ETC144-3N is well-suited for embedded microcontroller platforms where custom peripherals (PWM generators, quadrature counters, custom I²C/SPI slaves) must be added without redesigning the base MCU. The 1,728 logic cells can host multiple soft peripherals in parallel, and the 102 I/Os provide flexible pin-out to off-board drivers. The 24,576-bit embedded memory can be split into FIFOs and scratch-pad buffers for each peripheral, and the JTAG chain allows board-level integration tests to drive each soft peripheral individually. Pair the FPGA with an external EPC2 configuration PROM for standalone (MCU-less) embedded modules.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K30ETC144-3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K30ETC144-3 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KA |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 | -2 (slower) |
| Lead-Free Finish (N) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Industrial (-40–85 °C) | Industrial (-40–85 °C) |
اہم امتیازی خصوصیات
- Lead-free (Pb-free) terminal finish on -3N variant (بمقابلہEPF10K30ETC144-3)
- Same silicon as EPF10K30ATC144-3 but commercial vs industrial temperature (بمقابلہEPF10K30ATC144-3)
- Faster speed grade (-3) over -2 and -1 alternatives (بمقابلہEPF10K30ETC144-2N)
ڈیزائن نوٹس
Estimated: the EPF10K30ETC144-3N requires a clean 2.5 V VCCINT supply with a maximum tolerance of ±5%. Provide a 10 µF bulk capacitor and at least three 0.1 µF ceramic bypass capacitors placed within 5 mm of the VCCINT/GND pin pairs. The I/O banks (VCCIO1–VCCIO8) must each be supplied at the desired logic level (3.3 V or 5 V) and require their own local 0.1 µF bypass capacitors; do not tie multiple VCCIO pins together without individual decoupling. Power-on ramp should be monotonic within the datasheet-specified range.
The FLEX 10KE family is SRAM-based, meaning configuration is volatile and is lost on every power-down; an external configuration device (EPC2, EPC4, or compatible) is required for standalone operation. Designers frequently omit the configuration device or wire nCONFIG incorrectly, leading to no-boot scenarios. Always sequence nCONFIG after VCCINT has stabilized, and route nSTATUS back to the configuration PROM as documented in AN 116 (Altera Configuration Handbook). Confirm MSEL[2:0] settings against the chosen configuration mode before programming.
Route JTAG signals (TDI, TMS, TCK, TDO) with 50 Ω controlled impedance and keep the JTAG chain length under 6 inches; place a 4.7 kΩ pull-up on TCK and TMS. Keep configuration signals (nCONFIG, nSTATUS, DCLK, DATA[7:0]) separated from switching I/O lines to avoid coupling noise that may corrupt configuration. Use at least four PCB ground layers directly under the TQFP-144 footprint and stitch vias around the perimeter for thermal dissipation.
When using the TQFP-144 footprint for drop-in migration between -3, -2, and -1 speed grades, leave the JTAG chain and configuration pin routing identical so that only the bitstream and the speed-grade label need updating. Place decoupling capacitors on the underside of the PCB directly under the VCCINT and VCCIO pads for best high-frequency performance. Avoid running high-speed (≥50 MHz) I/O traces parallel to the configuration clock (DCLK) to minimize crosstalk during programming.
تعمیل کی معلومات
Pb-free finish per the -N suffix in Altera/Intel ordering information. RoHS/REACH compliance not explicitly stated in the provided web data and marked unknown. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
