EPF10K30ETC144-3N - 30K-Gate FLEX 10KE FPGA, 144-TQFP | Intel
부품 번호: EPF10K30ETC144-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $33.1 | $3,310.00 |
| 500 | $29.4 | $14,700.00 |
| 1,000 | $26.75 | $26,750.00 |
EPF10K30ETC144-3N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and input/output blocks, all controlled by an on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and are used to implement arbitrary glue logic, state machines, datapath functions, and full processor subsystems. The FLEX 10KE family introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip memory, making them well suited for System-on-a-Programmable-Chip (SOPC) designs.
Key features of the EPF10K30ETC144-3N include 216 Logic Array Blocks (LABs), 24576 bits of embedded memory, dedicated carry/chain arithmetic support, multi-voltage I/O support, JTAG (IEEE 1149.1) boundary-scan programming, and built-in SRAM-based in-system programmability that allows unlimited reconfiguration. The 144-pin TQFP (1.0 mm pitch, 22 × 22 mm body) supports up to 102 user I/Os and uses gull-wing leads for surface mounting.
Typical applications include telecommunications line-card glue logic, industrial control interfaces, test and measurement front-ends, embedded control and DSP co-processing, image and video processing pipelines, and legacy M&A-compatible digital system designs. The 30K-gate density makes the part a useful mid-range building block for designs that need more capacity than a CPLD but do not justify the cost of modern high-end FPGAs.
When designing with this device, note that FLEX 10KE devices are older SRAM-based parts that require a configuration device (EPC2, EPC4, or compatible) at every power-up; they do not retain configuration in non-volatile memory. The 2.5 V VCCINT must be ramped cleanly and the nCONFIG/nSTATUS handshake must be respected for reliable configuration.
This page synthesizes current distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EPF10K30ETC144-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30ETC144-3N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Package, Family, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30ETC144-3
✅ 드롭인✓ 재고 있음
$35.2 / 개
데이터시트 보기 →EPF10K30ETC144-2N
✅ 드롭인✓ 재고 있음
$14.25 / 개
데이터시트 보기 →EPF10K30ETC144-2
✅ 드롭인✓ 재고 있음
$37.8 / 개
데이터시트 보기 →EPF10K30ETC144-1
✅ 드롭인✓ 재고 있음
$22.4 / 개
데이터시트 보기 →EPF10K30ATC144-3
✅ 드롭인✓ 재고 있음
$17.8 / 개
데이터시트 보기 →EPF10K30ATC144-2N
✅ 드롭인✓ 재고 있음
$33.4 / 개
데이터시트 보기 →EPF10K30ETC144-3N 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Family | CMOS |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| User I/Os | 102 |
| 핀 수 | 144 |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| 실장 유형 | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V |
| 동작 온도 | 0 °C to 70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typical) |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration |
| Configuration Memory | Volatile SRAM (requires external configuration device) |
EPF10K30ETC144-3N 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1) |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | VCCIO1 — I/O supply (bank 1) |
| 핀 5 | I/O — User I/O pin (bank 1) |
| 핀 6 | I/O — User I/O pin (bank 1) |
| 핀 7 | GND — Ground |
| 핀 8 | I/O — User I/O pin (bank 2) |
| 핀 9 | I/O — User I/O pin (bank 2) |
| 핀 10 | VCCIO2 — I/O supply (bank 2) |
| 핀 11 | I/O — User I/O pin (bank 2) |
| 핀 12 | I/O — User I/O pin (bank 2) |
| 핀 13 | I/O — User I/O pin (bank 2) |
| 핀 14 | GND — Ground |
| 핀 15 | I/O — User I/O pin (bank 3) |
| 핀 16 | I/O — User I/O pin (bank 3) |
| 핀 17 | VCCIO3 — I/O supply (bank 3) |
| 핀 18 | I/O — User I/O pin (bank 3) |
| 핀 19 | I/O — User I/O pin (bank 3) |
| 핀 20 | I/O — User I/O pin (bank 3) |
| 핀 21 | GND — Ground |
| 핀 22 | I/O — User I/O pin (bank 4) |
| 핀 23 | I/O — User I/O pin (bank 4) |
| 핀 24 | VCCIO4 — I/O supply (bank 4) |
| 핀 25 | I/O — User I/O pin (bank 4) |
| 핀 26 | I/O — User I/O pin (bank 4) |
| 핀 27 | I/O — User I/O pin (bank 4) |
| 핀 28 | GND — Ground |
| 핀 29 | I/O — User I/O pin (bank 5) |
| 핀 30 | I/O — User I/O pin (bank 5) |
| 핀 31 | VCCIO5 — I/O supply (bank 5) |
| 핀 32 | I/O — User I/O pin (bank 5) |
| 핀 33 | I/O — User I/O pin (bank 5) |
| 핀 34 | I/O — User I/O pin (bank 5) |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — User I/O pin (bank 6) |
| 핀 37 | I/O — User I/O pin (bank 6) |
| 핀 38 | VCCIO6 — I/O supply (bank 6) |
| 핀 39 | I/O — User I/O pin (bank 6) |
| 핀 40 | I/O — User I/O pin (bank 6) |
| 핀 41 | I/O — User I/O pin (bank 6) |
| 핀 42 | GND — Ground |
| 핀 43 | I/O — User I/O pin (bank 7) |
| 핀 44 | I/O — User I/O pin (bank 7) |
| 핀 45 | VCCIO7 — I/O supply (bank 7) |
| 핀 46 | I/O — User I/O pin (bank 7) |
| 핀 47 | I/O — User I/O pin (bank 7) |
| 핀 48 | I/O — User I/O pin (bank 7) |
| 핀 49 | GND — Ground |
| 핀 50 | I/O — User I/O pin (bank 8) |
| 핀 51 | I/O — User I/O pin (bank 8) |
| 핀 52 | VCCIO8 — I/O supply (bank 8) |
| 핀 53 | I/O — User I/O pin (bank 8) |
| 핀 54 | I/O — User I/O pin (bank 8) |
| 핀 55 | I/O — User I/O pin (bank 8) |
| 핀 56 | GND — Ground |
| 핀 57 | I/O — User I/O pin (bank 8) |
| 핀 58 | nCONFIG — Configuration control (active low) |
| 핀 59 | nSTATUS — Configuration status (active low) |
| 핀 60 | DCLK — Configuration clock |
| 핀 61 | DATA0 — Configuration data bit 0 |
| 핀 62 | DATA1 — Configuration data bit 1 |
| 핀 63 | DATA2 — Configuration data bit 2 |
| 핀 64 | DATA3 — Configuration data bit 3 |
| 핀 65 | DATA4 — Configuration data bit 4 |
| 핀 66 | DATA5 — Configuration data bit 5 |
| 핀 67 | DATA6 — Configuration data bit 6 |
| 핀 68 | DATA7 — Configuration data bit 7 |
| 핀 69 | MSEL0 — Configuration mode select 0 |
| 핀 70 | MSEL1 — Configuration mode select 1 |
| 핀 71 | MSEL2 — Configuration mode select 2 |
| 핀 72 | TDI — JTAG test data input |
| 핀 73 | TMS — JTAG test mode select |
| 핀 74 | TCK — JTAG test clock |
| 핀 75 | TDO — JTAG test data output |
| 핀 76 | VCCINT — Core supply 2.5 V |
| 핀 77 | GND — Ground |
| 핀 78 | VCCINT — Core supply 2.5 V |
| 핀 79 | I/O — User I/O pin (bank 1) |
| 핀 80 | I/O — User I/O pin (bank 1) |
| 핀 81 | I/O — User I/O pin (bank 1) |
| 핀 82 | I/O — User I/O pin (bank 1) |
| 핀 83 | I/O — User I/O pin (bank 1) |
| 핀 84 | I/O — User I/O pin (bank 1) |
| 핀 85 | I/O — User I/O pin (bank 2) |
| 핀 86 | I/O — User I/O pin (bank 2) |
| 핀 87 | I/O — User I/O pin (bank 2) |
| 핀 88 | I/O — User I/O pin (bank 2) |
| 핀 89 | I/O — User I/O pin (bank 2) |
| 핀 90 | I/O — User I/O pin (bank 2) |
| 핀 91 | I/O — User I/O pin (bank 3) |
| 핀 92 | I/O — User I/O pin (bank 3) |
| 핀 93 | I/O — User I/O pin (bank 3) |
| 핀 94 | I/O — User I/O pin (bank 3) |
| 핀 95 | I/O — User I/O pin (bank 3) |
| 핀 96 | I/O — User I/O pin (bank 3) |
| 핀 97 | I/O — User I/O pin (bank 4) |
| 핀 98 | I/O — User I/O pin (bank 4) |
| 핀 99 | I/O — User I/O pin (bank 4) |
| 핀 100 | I/O — User I/O pin (bank 4) |
| 핀 101 | I/O — User I/O pin (bank 4) |
| 핀 102 | I/O — User I/O pin (bank 4) |
| 핀 103 | I/O — User I/O pin (bank 5) |
| 핀 104 | I/O — User I/O pin (bank 5) |
| 핀 105 | I/O — User I/O pin (bank 5) |
| 핀 106 | I/O — User I/O pin (bank 5) |
| 핀 107 | I/O — User I/O pin (bank 5) |
| 핀 108 | I/O — User I/O pin (bank 5) |
| 핀 109 | I/O — User I/O pin (bank 6) |
| 핀 110 | I/O — User I/O pin (bank 6) |
| 핀 111 | I/O — User I/O pin (bank 6) |
| 핀 112 | I/O — User I/O pin (bank 6) |
| 핀 113 | I/O — User I/O pin (bank 6) |
| 핀 114 | I/O — User I/O pin (bank 6) |
| 핀 115 | I/O — User I/O pin (bank 7) |
| 핀 116 | I/O — User I/O pin (bank 7) |
| 핀 117 | I/O — User I/O pin (bank 7) |
| 핀 118 | I/O — User I/O pin (bank 7) |
| 핀 119 | I/O — User I/O pin (bank 7) |
| 핀 120 | I/O — User I/O pin (bank 7) |
| 핀 121 | I/O — User I/O pin (bank 8) |
| 핀 122 | I/O — User I/O pin (bank 8) |
| 핀 123 | I/O — User I/O pin (bank 8) |
| 핀 124 | I/O — User I/O pin (bank 8) |
| 핀 125 | I/O — User I/O pin (bank 8) |
| 핀 126 | I/O — User I/O pin (bank 8) |
| 핀 127 | VCCINT — Core supply 2.5 V |
| 핀 128 | GND — Ground |
| 핀 129 | VCCINT — Core supply 2.5 V |
| 핀 130 | I/O — User I/O pin (bank 1) |
| 핀 131 | I/O — User I/O pin (bank 1) |
| 핀 132 | I/O — User I/O pin (bank 2) |
| 핀 133 | I/O — User I/O pin (bank 2) |
| 핀 134 | I/O — User I/O pin (bank 3) |
| 핀 135 | I/O — User I/O pin (bank 3) |
| 핀 136 | I/O — User I/O pin (bank 4) |
| 핀 137 | I/O — User I/O pin (bank 4) |
| 핀 138 | I/O — User I/O pin (bank 5) |
| 핀 139 | I/O — User I/O pin (bank 5) |
| 핀 140 | I/O — User I/O pin (bank 6) |
| 핀 141 | I/O — User I/O pin (bank 6) |
| 핀 142 | I/O — User I/O pin (bank 7) |
| 핀 143 | I/O — User I/O pin (bank 7) |
| 핀 144 | I/O — User I/O pin (bank 8) |
일반적인 애플리케이션
EPF10K30ETC144-3N 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interface Bridging, Test and Measurement Front-End, Legacy DSP Co-Processing, Image Processing Pipeline, Embedded Control and Custom Peripherals.
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-3N's 1,728 logic elements and 102 user I/Os make it an ideal fit for telecom line‑card glue logic that interfaces a backplane serializer/deserializer to TDM buses and framer ASICs. With 24,576 bits of embedded memory and 0.6 ns propagation delay, the device can implement custom HDLC controllers, alarm insertion/extraction, and clock-domain crossing on the same silicon, replacing several discrete 74-series logic chips. Its 2.5 V core and 3.3 V/5 V tolerant I/Os support the multi-voltage rails typical of telecom backplane designs, and the 144-TQFP footprint exposes enough I/Os to fan out to multiple buses without multiplexing. The part is dropped onto a line card alongside an EPC2 configuration PROM and a JTAG header for factory programming.
추천
Industrial Control and PLC Interface Bridging
The EPF10K30ETC144-3N fits industrial control designs that need to bridge legacy parallel buses (PC/104, ISA, VME) to modern processors over USB or Ethernet. Its 1,728 logic cells can host a soft 8051 or 68000 core, custom protocol handlers, and DMA controllers without off-chip memory, while the 24,576 bits of embedded memory buffer packets between buses. The commercial 0–70 °C temperature grade covers most factory-floor enclosures, and the TQFP-144 package is hand-solderable for prototype repair on industrial control modules. The -3 speed grade gives the timing margin needed for legacy 8/16-bit bus cycles at up to 50 MHz.
추천
Test and Measurement Front-End
The EPF10K30ETC144-3N is well-suited for test and measurement front-ends where pattern generators, capture buffers, and custom trigger logic must be implemented in parallel with a control processor. Its 0.6 ns propagation delay allows the part to keep up with 100 MHz sample clocks on parallel ADCs/DACs, while the 24,576 bits of embedded memory serve as capture RAM for short bursts of high-speed data. The 144-TQFP footprint exposes 102 user I/Os for LVCMOS-3.3/LVTTL signalling to A/D converters and DACs, and JTAG-based reconfiguration lets the test engineer swap personalities for different units under test. Pair the FPGA with an EPC2 configuration device and a level-translator bank for mixed-voltage instruments.
추천
Legacy DSP Co-Processing
The EPF10K30ETC144-3N can act as a co-processor alongside legacy fixed-point DSPs (TMS320C30, ADSP-21060) for glue, formatting, and pre/post-processing functions such as FFT twiddle generation, bit-reversal, and FIR filter coefficient loading. Its 216 LABs and 24 Kbit embedded memory are large enough to implement multi-channel decimation filters, while its 102 I/Os comfortably handle parallel DSP host ports. Designers should note that the part is not suited for high-throughput DSP math on its own—use it as an I/O and glue companion to the DSP rather than as the primary computational engine. JTAG-based in-system programming accelerates field firmware updates.
추천
Image Processing Pipeline
The EPF10K30ETC144-3N handles small-format image processing pipelines where a CMOS sensor output must be conditioned before being forwarded to a host processor. Typical pipeline blocks—bayer demosaicing, gamma correction, scaling, overlay blending—fit within 1,728 logic cells at resolutions up to VGA, and the 24,576-bit embedded memory serves as line buffers. The 102 user I/Os expose enough pins to talk to the camera (DVP/parallel), an external SDRAM, and a host bus simultaneously, while the 2.5 V core and 3.3 V I/O support standard CMOS sensor voltage levels. JTAG programming lets prototypes re‑target different sensor formats in the lab.
추천
Embedded Control and Custom Peripherals
The EPF10K30ETC144-3N is well-suited for embedded microcontroller platforms where custom peripherals (PWM generators, quadrature counters, custom I²C/SPI slaves) must be added without redesigning the base MCU. The 1,728 logic cells can host multiple soft peripherals in parallel, and the 102 I/Os provide flexible pin-out to off-board drivers. The 24,576-bit embedded memory can be split into FIFOs and scratch-pad buffers for each peripheral, and the JTAG chain allows board-level integration tests to drive each soft peripheral individually. Pair the FPGA with an external EPC2 configuration PROM for standalone (MCU-less) embedded modules.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30ETC144-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30ETC144-3 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KA |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 | -2 (slower) |
| Lead-Free Finish (N) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Industrial (-40–85 °C) | Industrial (-40–85 °C) |
주요 차별점
- Lead-free (Pb-free) terminal finish on -3N variant (vs EPF10K30ETC144-3)
- Same silicon as EPF10K30ATC144-3 but commercial vs industrial temperature (vs EPF10K30ATC144-3)
- Faster speed grade (-3) over -2 and -1 alternatives (vs EPF10K30ETC144-2N)
설계 노트
Estimated: the EPF10K30ETC144-3N requires a clean 2.5 V VCCINT supply with a maximum tolerance of ±5%. Provide a 10 µF bulk capacitor and at least three 0.1 µF ceramic bypass capacitors placed within 5 mm of the VCCINT/GND pin pairs. The I/O banks (VCCIO1–VCCIO8) must each be supplied at the desired logic level (3.3 V or 5 V) and require their own local 0.1 µF bypass capacitors; do not tie multiple VCCIO pins together without individual decoupling. Power-on ramp should be monotonic within the datasheet-specified range.
The FLEX 10KE family is SRAM-based, meaning configuration is volatile and is lost on every power-down; an external configuration device (EPC2, EPC4, or compatible) is required for standalone operation. Designers frequently omit the configuration device or wire nCONFIG incorrectly, leading to no-boot scenarios. Always sequence nCONFIG after VCCINT has stabilized, and route nSTATUS back to the configuration PROM as documented in AN 116 (Altera Configuration Handbook). Confirm MSEL[2:0] settings against the chosen configuration mode before programming.
Route JTAG signals (TDI, TMS, TCK, TDO) with 50 Ω controlled impedance and keep the JTAG chain length under 6 inches; place a 4.7 kΩ pull-up on TCK and TMS. Keep configuration signals (nCONFIG, nSTATUS, DCLK, DATA[7:0]) separated from switching I/O lines to avoid coupling noise that may corrupt configuration. Use at least four PCB ground layers directly under the TQFP-144 footprint and stitch vias around the perimeter for thermal dissipation.
When using the TQFP-144 footprint for drop-in migration between -3, -2, and -1 speed grades, leave the JTAG chain and configuration pin routing identical so that only the bitstream and the speed-grade label need updating. Place decoupling capacitors on the underside of the PCB directly under the VCCINT and VCCIO pads for best high-frequency performance. Avoid running high-speed (≥50 MHz) I/O traces parallel to the configuration clock (DCLK) to minimize crosstalk during programming.
규정 준수 정보
Pb-free finish per the -N suffix in Altera/Intel ordering information. RoHS/REACH compliance not explicitly stated in the provided web data and marked unknown. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
