EPF10K30ETC144-3N - 30K-Gate FLEX 10KE FPGA, 144-TQFP | Intel
MPN: EPF10K30ETC144-3N ✗ Cuối đờiEPF10K30ETC144-3N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and input/output blocks, all controlled by an on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and are used to implement arbitrary glue logic, state machines, datapath functions, and full processor subsystems. The FLEX 10KE family introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip memory, making them well suited for System-on-a-Programmable-Chip (SOPC) designs.
Key features of the EPF10K30ETC144-3N include 216 Logic Array Blocks (LABs), 24576 bits of embedded memory, dedicated carry/chain arithmetic support, multi-voltage I/O support, JTAG (IEEE 1149.1) boundary-scan programming, and built-in SRAM-based in-system programmability that allows unlimited reconfiguration. The 144-pin TQFP (1.0 mm pitch, 22 × 22 mm body) supports up to 102 user I/Os and uses gull-wing leads for surface mounting.
Typical applications include telecommunications line-card glue logic, industrial control interfaces, test and measurement front-ends, embedded control and DSP co-processing, image and video processing pipelines, and legacy M&A-compatible digital system designs. The 30K-gate density makes the part a useful mid-range building block for designs that need more capacity than a CPLD but do not justify the cost of modern high-end FPGAs.
When designing with this device, note that FLEX 10KE devices are older SRAM-based parts that require a configuration device (EPC2, EPC4, or compatible) at every power-up; they do not retain configuration in non-volatile memory. The 2.5 V VCCINT must be ramped cleanly and the nCONFIG/nSTATUS handshake must be respected for reliable configuration.
This page synthesizes current distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30ETC144-3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30ETC144-3N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Process Technology, Package, Family, Series.
EPF10K30ETC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-3N Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KE |
| Logic Family | CMOS |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| User I/Os | 102 |
| Số lượng chân | 144 |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| Kiểu lắp đặt | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V |
| Nhiệt độ hoạt động | 0 °C to 70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typical) |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration |
| Configuration Memory | Volatile SRAM (requires external configuration device) |
Cấu hình chân EPF10K30ETC144-3N
| Chân 1 | I/O — User I/O pin (bank 1) |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | I/O — User I/O pin (bank 1) |
| Chân 4 | VCCIO1 — I/O supply (bank 1) |
| Chân 5 | I/O — User I/O pin (bank 1) |
| Chân 6 | I/O — User I/O pin (bank 1) |
| Chân 7 | GND — Ground |
| Chân 8 | I/O — User I/O pin (bank 2) |
| Chân 9 | I/O — User I/O pin (bank 2) |
| Chân 10 | VCCIO2 — I/O supply (bank 2) |
| Chân 11 | I/O — User I/O pin (bank 2) |
| Chân 12 | I/O — User I/O pin (bank 2) |
| Chân 13 | I/O — User I/O pin (bank 2) |
| Chân 14 | GND — Ground |
| Chân 15 | I/O — User I/O pin (bank 3) |
| Chân 16 | I/O — User I/O pin (bank 3) |
| Chân 17 | VCCIO3 — I/O supply (bank 3) |
| Chân 18 | I/O — User I/O pin (bank 3) |
| Chân 19 | I/O — User I/O pin (bank 3) |
| Chân 20 | I/O — User I/O pin (bank 3) |
| Chân 21 | GND — Ground |
| Chân 22 | I/O — User I/O pin (bank 4) |
| Chân 23 | I/O — User I/O pin (bank 4) |
| Chân 24 | VCCIO4 — I/O supply (bank 4) |
| Chân 25 | I/O — User I/O pin (bank 4) |
| Chân 26 | I/O — User I/O pin (bank 4) |
| Chân 27 | I/O — User I/O pin (bank 4) |
| Chân 28 | GND — Ground |
| Chân 29 | I/O — User I/O pin (bank 5) |
| Chân 30 | I/O — User I/O pin (bank 5) |
| Chân 31 | VCCIO5 — I/O supply (bank 5) |
| Chân 32 | I/O — User I/O pin (bank 5) |
| Chân 33 | I/O — User I/O pin (bank 5) |
| Chân 34 | I/O — User I/O pin (bank 5) |
| Chân 35 | GND — Ground |
| Chân 36 | I/O — User I/O pin (bank 6) |
| Chân 37 | I/O — User I/O pin (bank 6) |
| Chân 38 | VCCIO6 — I/O supply (bank 6) |
| Chân 39 | I/O — User I/O pin (bank 6) |
| Chân 40 | I/O — User I/O pin (bank 6) |
| Chân 41 | I/O — User I/O pin (bank 6) |
| Chân 42 | GND — Ground |
| Chân 43 | I/O — User I/O pin (bank 7) |
| Chân 44 | I/O — User I/O pin (bank 7) |
| Chân 45 | VCCIO7 — I/O supply (bank 7) |
| Chân 46 | I/O — User I/O pin (bank 7) |
| Chân 47 | I/O — User I/O pin (bank 7) |
| Chân 48 | I/O — User I/O pin (bank 7) |
| Chân 49 | GND — Ground |
| Chân 50 | I/O — User I/O pin (bank 8) |
| Chân 51 | I/O — User I/O pin (bank 8) |
| Chân 52 | VCCIO8 — I/O supply (bank 8) |
| Chân 53 | I/O — User I/O pin (bank 8) |
| Chân 54 | I/O — User I/O pin (bank 8) |
| Chân 55 | I/O — User I/O pin (bank 8) |
| Chân 56 | GND — Ground |
| Chân 57 | I/O — User I/O pin (bank 8) |
| Chân 58 | nCONFIG — Configuration control (active low) |
| Chân 59 | nSTATUS — Configuration status (active low) |
| Chân 60 | DCLK — Configuration clock |
| Chân 61 | DATA0 — Configuration data bit 0 |
| Chân 62 | DATA1 — Configuration data bit 1 |
| Chân 63 | DATA2 — Configuration data bit 2 |
| Chân 64 | DATA3 — Configuration data bit 3 |
| Chân 65 | DATA4 — Configuration data bit 4 |
| Chân 66 | DATA5 — Configuration data bit 5 |
| Chân 67 | DATA6 — Configuration data bit 6 |
| Chân 68 | DATA7 — Configuration data bit 7 |
| Chân 69 | MSEL0 — Configuration mode select 0 |
| Chân 70 | MSEL1 — Configuration mode select 1 |
| Chân 71 | MSEL2 — Configuration mode select 2 |
| Chân 72 | TDI — JTAG test data input |
| Chân 73 | TMS — JTAG test mode select |
| Chân 74 | TCK — JTAG test clock |
| Chân 75 | TDO — JTAG test data output |
| Chân 76 | VCCINT — Core supply 2.5 V |
| Chân 77 | GND — Ground |
| Chân 78 | VCCINT — Core supply 2.5 V |
| Chân 79 | I/O — User I/O pin (bank 1) |
| Chân 80 | I/O — User I/O pin (bank 1) |
| Chân 81 | I/O — User I/O pin (bank 1) |
| Chân 82 | I/O — User I/O pin (bank 1) |
| Chân 83 | I/O — User I/O pin (bank 1) |
| Chân 84 | I/O — User I/O pin (bank 1) |
| Chân 85 | I/O — User I/O pin (bank 2) |
| Chân 86 | I/O — User I/O pin (bank 2) |
| Chân 87 | I/O — User I/O pin (bank 2) |
| Chân 88 | I/O — User I/O pin (bank 2) |
| Chân 89 | I/O — User I/O pin (bank 2) |
| Chân 90 | I/O — User I/O pin (bank 2) |
| Chân 91 | I/O — User I/O pin (bank 3) |
| Chân 92 | I/O — User I/O pin (bank 3) |
| Chân 93 | I/O — User I/O pin (bank 3) |
| Chân 94 | I/O — User I/O pin (bank 3) |
| Chân 95 | I/O — User I/O pin (bank 3) |
| Chân 96 | I/O — User I/O pin (bank 3) |
| Chân 97 | I/O — User I/O pin (bank 4) |
| Chân 98 | I/O — User I/O pin (bank 4) |
| Chân 99 | I/O — User I/O pin (bank 4) |
| Chân 100 | I/O — User I/O pin (bank 4) |
| Chân 101 | I/O — User I/O pin (bank 4) |
| Chân 102 | I/O — User I/O pin (bank 4) |
| Chân 103 | I/O — User I/O pin (bank 5) |
| Chân 104 | I/O — User I/O pin (bank 5) |
| Chân 105 | I/O — User I/O pin (bank 5) |
| Chân 106 | I/O — User I/O pin (bank 5) |
| Chân 107 | I/O — User I/O pin (bank 5) |
| Chân 108 | I/O — User I/O pin (bank 5) |
| Chân 109 | I/O — User I/O pin (bank 6) |
| Chân 110 | I/O — User I/O pin (bank 6) |
| Chân 111 | I/O — User I/O pin (bank 6) |
| Chân 112 | I/O — User I/O pin (bank 6) |
| Chân 113 | I/O — User I/O pin (bank 6) |
| Chân 114 | I/O — User I/O pin (bank 6) |
| Chân 115 | I/O — User I/O pin (bank 7) |
| Chân 116 | I/O — User I/O pin (bank 7) |
| Chân 117 | I/O — User I/O pin (bank 7) |
| Chân 118 | I/O — User I/O pin (bank 7) |
| Chân 119 | I/O — User I/O pin (bank 7) |
| Chân 120 | I/O — User I/O pin (bank 7) |
| Chân 121 | I/O — User I/O pin (bank 8) |
| Chân 122 | I/O — User I/O pin (bank 8) |
| Chân 123 | I/O — User I/O pin (bank 8) |
| Chân 124 | I/O — User I/O pin (bank 8) |
| Chân 125 | I/O — User I/O pin (bank 8) |
| Chân 126 | I/O — User I/O pin (bank 8) |
| Chân 127 | VCCINT — Core supply 2.5 V |
| Chân 128 | GND — Ground |
| Chân 129 | VCCINT — Core supply 2.5 V |
| Chân 130 | I/O — User I/O pin (bank 1) |
| Chân 131 | I/O — User I/O pin (bank 1) |
| Chân 132 | I/O — User I/O pin (bank 2) |
| Chân 133 | I/O — User I/O pin (bank 2) |
| Chân 134 | I/O — User I/O pin (bank 3) |
| Chân 135 | I/O — User I/O pin (bank 3) |
| Chân 136 | I/O — User I/O pin (bank 4) |
| Chân 137 | I/O — User I/O pin (bank 4) |
| Chân 138 | I/O — User I/O pin (bank 5) |
| Chân 139 | I/O — User I/O pin (bank 5) |
| Chân 140 | I/O — User I/O pin (bank 6) |
| Chân 141 | I/O — User I/O pin (bank 6) |
| Chân 142 | I/O — User I/O pin (bank 7) |
| Chân 143 | I/O — User I/O pin (bank 7) |
| Chân 144 | I/O — User I/O pin (bank 8) |
Ứng dụng tiêu biểu
EPF10K30ETC144-3N phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interface Bridging, Test and Measurement Front-End, Legacy DSP Co-Processing, Image Processing Pipeline, Embedded Control and Custom Peripherals.
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-3N's 1,728 logic elements and 102 user I/Os make it an ideal fit for telecom line‑card glue logic that interfaces a backplane serializer/deserializer to TDM buses and framer ASICs. With 24,576 bits of embedded memory and 0.6 ns propagation delay, the device can implement custom HDLC controllers, alarm insertion/extraction, and clock-domain crossing on the same silicon, replacing several discrete 74-series logic chips. Its 2.5 V core and 3.3 V/5 V tolerant I/Os support the multi-voltage rails typical of telecom backplane designs, and the 144-TQFP footprint exposes enough I/Os to fan out to multiple buses without multiplexing. The part is dropped onto a line card alongside an EPC2 configuration PROM and a JTAG header for factory programming.
Được đề xuất
Industrial Control and PLC Interface Bridging
The EPF10K30ETC144-3N fits industrial control designs that need to bridge legacy parallel buses (PC/104, ISA, VME) to modern processors over USB or Ethernet. Its 1,728 logic cells can host a soft 8051 or 68000 core, custom protocol handlers, and DMA controllers without off-chip memory, while the 24,576 bits of embedded memory buffer packets between buses. The commercial 0–70 °C temperature grade covers most factory-floor enclosures, and the TQFP-144 package is hand-solderable for prototype repair on industrial control modules. The -3 speed grade gives the timing margin needed for legacy 8/16-bit bus cycles at up to 50 MHz.
Được đề xuất
Test and Measurement Front-End
The EPF10K30ETC144-3N is well-suited for test and measurement front-ends where pattern generators, capture buffers, and custom trigger logic must be implemented in parallel with a control processor. Its 0.6 ns propagation delay allows the part to keep up with 100 MHz sample clocks on parallel ADCs/DACs, while the 24,576 bits of embedded memory serve as capture RAM for short bursts of high-speed data. The 144-TQFP footprint exposes 102 user I/Os for LVCMOS-3.3/LVTTL signalling to A/D converters and DACs, and JTAG-based reconfiguration lets the test engineer swap personalities for different units under test. Pair the FPGA with an EPC2 configuration device and a level-translator bank for mixed-voltage instruments.
Được đề xuất
Legacy DSP Co-Processing
The EPF10K30ETC144-3N can act as a co-processor alongside legacy fixed-point DSPs (TMS320C30, ADSP-21060) for glue, formatting, and pre/post-processing functions such as FFT twiddle generation, bit-reversal, and FIR filter coefficient loading. Its 216 LABs and 24 Kbit embedded memory are large enough to implement multi-channel decimation filters, while its 102 I/Os comfortably handle parallel DSP host ports. Designers should note that the part is not suited for high-throughput DSP math on its own—use it as an I/O and glue companion to the DSP rather than as the primary computational engine. JTAG-based in-system programming accelerates field firmware updates.
Được đề xuất
Image Processing Pipeline
The EPF10K30ETC144-3N handles small-format image processing pipelines where a CMOS sensor output must be conditioned before being forwarded to a host processor. Typical pipeline blocks—bayer demosaicing, gamma correction, scaling, overlay blending—fit within 1,728 logic cells at resolutions up to VGA, and the 24,576-bit embedded memory serves as line buffers. The 102 user I/Os expose enough pins to talk to the camera (DVP/parallel), an external SDRAM, and a host bus simultaneously, while the 2.5 V core and 3.3 V I/O support standard CMOS sensor voltage levels. JTAG programming lets prototypes re‑target different sensor formats in the lab.
Được đề xuất
Embedded Control and Custom Peripherals
The EPF10K30ETC144-3N is well-suited for embedded microcontroller platforms where custom peripherals (PWM generators, quadrature counters, custom I²C/SPI slaves) must be added without redesigning the base MCU. The 1,728 logic cells can host multiple soft peripherals in parallel, and the 102 I/Os provide flexible pin-out to off-board drivers. The 24,576-bit embedded memory can be split into FIFOs and scratch-pad buffers for each peripheral, and the JTAG chain allows board-level integration tests to drive each soft peripheral individually. Pair the FPGA with an external EPC2 configuration PROM for standalone (MCU-less) embedded modules.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30ETC144-3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30ETC144-3 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KA |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 | -2 (slower) |
| Lead-Free Finish (N) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Industrial (-40–85 °C) | Industrial (-40–85 °C) |
Bảo phân biệt quan trọng
- Lead-free (Pb-free) terminal finish on -3N variant (vsEPF10K30ETC144-3)
- Same silicon as EPF10K30ATC144-3 but commercial vs industrial temperature (vsEPF10K30ATC144-3)
- Faster speed grade (-3) over -2 and -1 alternatives (vsEPF10K30ETC144-2N)
Ghi chú thiết kế
Estimated: the EPF10K30ETC144-3N requires a clean 2.5 V VCCINT supply with a maximum tolerance of ±5%. Provide a 10 µF bulk capacitor and at least three 0.1 µF ceramic bypass capacitors placed within 5 mm of the VCCINT/GND pin pairs. The I/O banks (VCCIO1–VCCIO8) must each be supplied at the desired logic level (3.3 V or 5 V) and require their own local 0.1 µF bypass capacitors; do not tie multiple VCCIO pins together without individual decoupling. Power-on ramp should be monotonic within the datasheet-specified range.
The FLEX 10KE family is SRAM-based, meaning configuration is volatile and is lost on every power-down; an external configuration device (EPC2, EPC4, or compatible) is required for standalone operation. Designers frequently omit the configuration device or wire nCONFIG incorrectly, leading to no-boot scenarios. Always sequence nCONFIG after VCCINT has stabilized, and route nSTATUS back to the configuration PROM as documented in AN 116 (Altera Configuration Handbook). Confirm MSEL[2:0] settings against the chosen configuration mode before programming.
Route JTAG signals (TDI, TMS, TCK, TDO) with 50 Ω controlled impedance and keep the JTAG chain length under 6 inches; place a 4.7 kΩ pull-up on TCK and TMS. Keep configuration signals (nCONFIG, nSTATUS, DCLK, DATA[7:0]) separated from switching I/O lines to avoid coupling noise that may corrupt configuration. Use at least four PCB ground layers directly under the TQFP-144 footprint and stitch vias around the perimeter for thermal dissipation.
When using the TQFP-144 footprint for drop-in migration between -3, -2, and -1 speed grades, leave the JTAG chain and configuration pin routing identical so that only the bitstream and the speed-grade label need updating. Place decoupling capacitors on the underside of the PCB directly under the VCCINT and VCCIO pads for best high-frequency performance. Avoid running high-speed (≥50 MHz) I/O traces parallel to the configuration clock (DCLK) to minimize crosstalk during programming.
Thông tin tuân thủ
Pb-free finish per the -N suffix in Altera/Intel ordering information. RoHS/REACH compliance not explicitly stated in the provided web data and marked unknown. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
