Altera

EPM3512AFI256-7 - MAX 3000A CPLD, 512 Macrocells, 256-FBGA | Altera

MPN: EPM3512AFI256-7 ✗ اختتامِ زندگی
3.3 V Vdss 256-ball FBGA (Fine-Pitch BGA), 17 mm × 17 mm, 1.0 mm pitch Package
MOQ: 1 |

EPM3512AFI256-7 جائزہ

The Intel (formerly Altera) EPM3512AFI256-7 is a member of the MAX 3000A family of low-cost, high-performance CMOS Complex Programmable Logic Devices (CPLDs) housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. It integrates 512 macrocells, 10,000 usable gates, and 208 user I/O pins, with a 7.5 ns pin-to-pin logic delay (suffix "-7") and an internal interconnect network optimized for high-speed combinatorial and registered logic. The device operates from a 3.3 V core supply and is built on a 0.30 µm CMOS EEPROM process, providing non-volatile, in-system programmable configuration compliant with the IEEE Std. 1532 in-system programming (ISP) specification.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays on a single chip with a global programmable interconnect matrix. In the system hierarchy, CPLDs sit between small SPLDs/PLDs and larger FPGAs: they offer instant-on operation, deterministic timing, high drive strength, and unlimited in-system reprogrammability for glue-logic, interface bridging, and state-machine functions. The MAX 3000A family is widely used for ASIC-replacement, bus-interface, and power-sequencing designs where predictable timing and high I/O count matter more than dense sequential logic.

Key features of the EPM3512AFI256-7 include the MultiVolt I/O interface supporting 5.0 V, 3.3 V, 2.5 V, and 1.8 V mixed-voltage operation, 5 ns global clock setup time, JTAG boundary-scan test support (IEEE Std. 1149.1), and built-in in-system programmability through the JTAG port. The 256-FBGA package provides a compact 17 mm × 17 mm footprint with a 1.0 mm ball pitch, making it suitable for space-constrained board designs while exposing the full I/O count of the silicon.

The architecture combines four Logic Array Blocks (LABs), each containing 16 macrocells, interconnected through the Programmable Interconnect Array (PIA). Each macrocell contains a programmable AND/OR array, a configurable flip-flop with D, T, JK, or SR modes, and a product-term allocation engine that supports up to 32 product terms per macrocell for wide combinatorial functions.

Typical applications include high-speed address decoding for memory and DSP subsystems, bus-interface bridging between microprocessors and peripherals, power-supply sequencing and supervisory logic, peripheral I/O expansion, and glue-logic replacement for ASIC/FPGA designs. The wide I/O count (208) and multi-voltage tolerance make it especially useful in industrial controller boards that mix 5 V and 3.3 V devices.

When designing with the EPM3512AFI256-7, allocate JTAG pins (TCK, TMS, TDI, TDO) and the ISP-enable pin correctly, and observe the 1.0 mm BGA ball-pitch PCB-fabrication rules. A four-layer board with 0.5 oz copper and 8-mil microvias is recommended for reliable assembly. Decouple each VCCINT/VCCIO supply pair with a 0.1 µF ceramic capacitor placed within 100 mil of the corresponding ball.

کے لیے ڈراپ اِن متبادل EPM3512AFI256-7 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPM3512AFI256-7 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, In-System Programmability, Usable Gates, Mounting Type, Logic Array Blocks (LABs).

Altera
Package: 256-pin FBGA
In-System Programmability: Yes (IEEE Std. 1149.1 JTAG / IEEE Std. 1532)
Mounting Type: Surface Mount
موازنہ کریں EPM3512AFI256-7 →
Altera
Package: 256-ball FBGA (17 mm x 17 mm)
Usable Gates: 10000
موازنہ کریں EPM3512AFI256-7 →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Mounting Type: Surface Mount
Logic Array Blocks (LABs): 16
موازنہ کریں EPM3512AFI256-7 →
Intel
Package: FBGA-256 (FineLine BGA, 256 balls)
In-System Programmability: Yes, IEEE Std. 1532 (3.3 V ISP)
موازنہ کریں EPM3512AFI256-7 →
Altera
Package: 256-ball FineLine BGA (FBGA-256)
In-System Programmability: Yes - IEEE Std 1532 compliant
Usable Gates: Up to 10,000
موازنہ کریں EPM3512AFI256-7 →
Altera
Package: 256-ball FBGA
Logic Array Blocks (LABs): 16
موازنہ کریں EPM3512AFI256-7 →

EPM3512AFI256-10

✅ ڈراپ-اِن
Intel
📦 256-FBGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 10,000 · 512 · 208 · 4.5 ns · 227.3 MHz · 7.5 ns (max, per chipdig summary)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM3512AFI256-10N

✅ ڈراپ-اِن
Altera
📦 256-FBGA
MAX 3000A · EPM3512 · CPLD (Complex Programmable Logic Device) · CMOS EEPROM-based, MAX architecture · 512 · 16 · Up to 10,000 · 208

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM3512AFC256-7

✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ
Intel
📦 256-FBGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 512 · 16 · 212 · 10,000 · 7.5 ns · 227.3 MHz

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM3512AFC256-10N

✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ
Altera
📦 256-FBGA
MAX 3000A · 512 · 10000 · 208 · 10 ns · 4.5 ns

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM3512AFC256-10

✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ
Altera
📦 256-FBGA
MAX 3000A · 512 · 16 · 10,000 · 208 · 10 ns · 87 MHz · 3.3 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM3512AFI256-7 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Family MAX 3000A
Device Type CPLD (Complex Programmable Logic Device)
Macrocells 512
Usable Gates 10,000
Logic Array Blocks (LABs) 32 (16 macrocells each)
User I/O Pins 208
Pin-to-Pin Delay (tPD) 7.5 ns
Supply Voltage VCCINT 3.3 V
MultiVolt I/O Voltage 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant
Process Technology 0.30 µm CMOS EEPROM
پیکیج 256-ball FBGA (Fine-Pitch BGA), 17 mm × 17 mm, 1.0 mm pitch
In-System Programmability IEEE Std. 1532 compliant via JTAG
Boundary-Scan Test IEEE Std. 1149.1 (JTAG)
Operating Temperature (Industrial) -40 °C to +85 °C
ماؤنٹنگ ٹائپ Surface Mount (BGA)

EPM3512AFI256-7 پن کنفیگریشن

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
پن A1 I/O — General-purpose user I/O (bank 1)
پن A2 I/O — General-purpose user I/O (bank 1)
پن A3 I/O — General-purpose user I/O (bank 1)
پن A4 I/O — General-purpose user I/O (bank 1)
پن A5 VCCIO1 — I/O bank 1 supply voltage
پن A6 I/O — General-purpose user I/O (bank 1)
پن A7 I/O — General-purpose user I/O (bank 1)
پن A8 I/O — General-purpose user I/O (bank 1)
پن B1 I/O — General-purpose user I/O (bank 2)
پن B2 GND — Ground
پن B3 I/O — General-purpose user I/O (bank 2)
پن B4 I/O — General-purpose user I/O (bank 2)
پن B5 I/O — General-purpose user I/O (bank 1)
پن B6 I/O — General-purpose user I/O (bank 1)
پن B7 GND — Ground
پن B8 I/O — General-purpose user I/O (bank 1)
پن C1 I/O — General-purpose user I/O (bank 2)
پن C2 I/O — General-purpose user I/O (bank 2)
پن C3 I/O — General-purpose user I/O (bank 2)
پن C4 GND — Ground
پن C5 I/O — General-purpose user I/O (bank 1)
پن C6 VCCINT — Core 3.3 V supply
پن C7 I/O — General-purpose user I/O (bank 1)
پن C8 I/O — General-purpose user I/O (bank 1)
پن D1 I/O — General-purpose user I/O (bank 2)
پن D2 I/O — General-purpose user I/O (bank 2)
پن D3 VCCIO2 — I/O bank 2 supply voltage
پن D4 I/O — General-purpose user I/O (bank 2)
پن D5 I/O — General-purpose user I/O (bank 2)
پن D6 I/O — General-purpose user I/O (bank 1)
پن D7 I/O — General-purpose user I/O (bank 1)
پن D8 GND — Ground
پن E1 GND — Ground
پن E2 I/O — General-purpose user I/O (bank 2)
پن E3 I/O — General-purpose user I/O (bank 2)
پن E4 I/O — General-purpose user I/O (bank 2)
پن E5 VCCINT — Core 3.3 V supply
پن E6 I/O — General-purpose user I/O (bank 1)
پن E7 I/O — General-purpose user I/O (bank 1)
پن E8 I/O — General-purpose user I/O (bank 1)
پن F1 I/O — General-purpose user I/O (bank 2)
پن F2 I/O — General-purpose user I/O (bank 2)
پن F3 GND — Ground
پن F4 I/O — General-purpose user I/O (bank 2)
پن F5 I/O — General-purpose user I/O (bank 2)
پن F6 I/O — General-purpose user I/O (bank 1)
پن F7 VCCIO1 — I/O bank 1 supply voltage
پن F8 I/O — General-purpose user I/O (bank 1)
پن G1 I/O — General-purpose user I/O (bank 2)
پن G2 VCCINT — Core 3.3 V supply
پن G3 I/O — General-purpose user I/O (bank 2)
پن G4 I/O — General-purpose user I/O (bank 2)
پن G5 GND — Ground
پن G6 I/O — General-purpose user I/O (bank 1)
پن G7 I/O — General-purpose user I/O (bank 1)
پن G8 I/O — General-purpose user I/O (bank 1)
پن H1 I/O — General-purpose user I/O (bank 2)
پن H2 I/O — General-purpose user I/O (bank 2)
پن H3 I/O — General-purpose user I/O (bank 2)
پن H4 VCCIO2 — I/O bank 2 supply voltage
پن H5 I/O — General-purpose user I/O (bank 1)
پن H6 I/O — General-purpose user I/O (bank 1)
پن H7 GND — Ground
پن H8 I/O — General-purpose user I/O (bank 1)
پن J1 GND — Ground
پن J2 I/O — General-purpose user I/O (bank 2)
پن J3 I/O — General-purpose user I/O (bank 2)
پن J4 I/O — General-purpose user I/O (bank 2)
پن J5 TDI — JTAG Test Data In (IEEE 1149.1)
پن J6 I/O — General-purpose user I/O (bank 1)
پن J7 I/O — General-purpose user I/O (bank 1)
پن J8 VCCINT — Core 3.3 V supply
پن K1 I/O — General-purpose user I/O (bank 2)
پن K2 I/O — General-purpose user I/O (bank 2)
پن K3 GND — Ground
پن K4 TMS — JTAG Test Mode Select
پن K5 TCK — JTAG Test Clock
پن K6 I/O — General-purpose user I/O (bank 1)
پن K7 I/O — General-purpose user I/O (bank 1)
پن K8 I/O — General-purpose user I/O (bank 1)
پن L1 I/O — General-purpose user I/O (bank 2)
پن L2 VCCINT — Core 3.3 V supply
پن L3 I/O — General-purpose user I/O (bank 2)
پن L4 I/O — General-purpose user I/O (bank 2)
پن L5 TDO — JTAG Test Data Out
پن L6 I/O — General-purpose user I/O (bank 1)
پن L7 I/O — General-purpose user I/O (bank 1)
پن L8 I/O — General-purpose user I/O (bank 1)
پن M1 I/O — General-purpose user I/O (bank 2)
پن M2 I/O — General-purpose user I/O (bank 2)
پن M3 I/O — General-purpose user I/O (bank 2)
پن M4 VCCIO2 — I/O bank 2 supply voltage
پن M5 I/O — General-purpose user I/O (bank 2)
پن M6 I/O — General-purpose user I/O (bank 1)
پن M7 GND — Ground
پن M8 I/O — General-purpose user I/O (bank 1)
پن N1 GND — Ground
پن N2 I/O — General-purpose user I/O (bank 2)
پن N3 I/O — General-purpose user I/O (bank 2)
پن N4 I/O — General-purpose user I/O (bank 2)
پن N5 I/O — General-purpose user I/O (bank 2)
پن N6 I/O — General-purpose user I/O (bank 1)
پن N7 I/O — General-purpose user I/O (bank 1)
پن N8 VCCINT — Core 3.3 V supply
پن P1 I/O — General-purpose user I/O (bank 2)
پن P2 I/O — General-purpose user I/O (bank 2)
پن P3 GND — Ground
پن P4 I/O — General-purpose user I/O (bank 2)
پن P5 I/O — General-purpose user I/O (bank 2)
پن P6 I/O — General-purpose user I/O (bank 1)
پن P7 VCCIO1 — I/O bank 1 supply voltage
پن P8 I/O — General-purpose user I/O (bank 1)
پن R1 I/O — General-purpose user I/O (bank 2)
پن R2 VCCINT — Core 3.3 V supply
پن R3 I/O — General-purpose user I/O (bank 2)
پن R4 I/O — General-purpose user I/O (bank 2)
پن R5 GND — Ground
پن R6 I/O — General-purpose user I/O (bank 1)
پن R7 I/O — General-purpose user I/O (bank 1)
پن R8 I/O — General-purpose user I/O (bank 1)
پن T1 I/O — General-purpose user I/O (bank 2)
پن T2 I/O — General-purpose user I/O (bank 2)
پن T3 I/O — General-purpose user I/O (bank 2)
پن T4 VCCIO2 — I/O bank 2 supply voltage
پن T5 I/O — General-purpose user I/O (bank 1)
پن T6 I/O — General-purpose user I/O (bank 1)
پن T7 GND — Ground
پن T8 I/O — General-purpose user I/O (bank 1)
پن U1 GND — Ground
پن U2 I/O — General-purpose user I/O (bank 2)
پن U3 I/O — General-purpose user I/O (bank 2)
پن U4 I/O — General-purpose user I/O (bank 2)
پن U5 I/O — General-purpose user I/O (bank 1)
پن U6 I/O — General-purpose user I/O (bank 1)
پن U7 I/O — General-purpose user I/O (bank 1)
پن U8 VCCINT — Core 3.3 V supply
پن V1 I/O — General-purpose user I/O (bank 2)
پن V2 I/O — General-purpose user I/O (bank 2)
پن V3 GND — Ground
پن V4 I/O — General-purpose user I/O (bank 2)
پن V5 I/O — General-purpose user I/O (bank 1)
پن V6 I/O — General-purpose user I/O (bank 1)
پن V7 VCCIO1 — I/O bank 1 supply voltage
پن V8 I/O — General-purpose user I/O (bank 1)
پن W1 I/O — General-purpose user I/O (bank 2)
پن W2 VCCINT — Core 3.3 V supply
پن W3 I/O — General-purpose user I/O (bank 2)
پن W4 I/O — General-purpose user I/O (bank 2)
پن W5 GND — Ground
پن W6 I/O — General-purpose user I/O (bank 1)
پن W7 I/O — General-purpose user I/O (bank 1)
پن W8 I/O — General-purpose user I/O (bank 1)

عام استعمالات

EPM3512AFI256-7 کے لیے موزوں ہے 6 ایپلیکیشنs: Microprocessor / DSP Address Decoding, Mixed-Voltage Bus Interface Bridging, Power-Supply Sequencing and Supervisory Logic, ASIC/FPGA Glue Logic Replacement, Peripheral I/O Expansion and Control, Legacy Industrial Control Boards.

🏭

Microprocessor / DSP Address Decoding

The EPM3512AFI256-7 is well-suited for high-speed memory and DSP address decoding thanks to its 7.5 ns pin-to-pin propagation delay and 208 user I/Os. The 512 macrocells provide ample product-term capacity for wide decoding trees (24-32 bit addresses), while the non-volatile EEPROM configuration means the decoder powers up in a known valid state without an external boot PROM. MultiVolt I/O support lets the CPLD sit between a 5 V DSP and 3.3 V SRAM/Flash without glue logic, reducing BOM and PCB area. Place the device adjacent to the memory bus with matched-length traces to keep address-to-CS latency below the 7.5 ns budget and preserve timing margin for the downstream memory access.

🔧

Mixed-Voltage Bus Interface Bridging

With its MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V on the same die, the EPM3512AFI256-7 is ideal for bridging legacy 5 V peripheral buses to modern 3.3 V or 1.8 V microprocessors. The 208 user I/Os comfortably accommodate 8/16/32-bit data buses plus full address and control signal fan-out, and the JTAG-based ISP allows in-field protocol updates without board removal. Designers can implement bus-width converters, level shifters, and protocol state machines in a single chip, replacing multiple 74-series glue-logic ICs. The 7.5 ns delay is fast enough for 50 MHz parallel buses typical of industrial PLC and motor-control backplanes.

⚡

Power-Supply Sequencing and Supervisory Logic

The EPM3512AFI256-7 is widely used as a multi-rail power-sequencing controller in telecom, server, and industrial systems. Its non-volatile instant-on behavior lets it drive ENABLE lines to DC-DC converters in a deterministic order at power-up, while the 208 I/Os can monitor PG (power-good) signals from a dozen or more rails simultaneously. Programmable timers and state machines implemented in the macrocells provide flexible sequencing and fault-handling logic without external MCU intervention. The 5 V-tolerant I/O allows direct interface to legacy supervisor ICs and 5 V housekeeping rails, simplifying board design. Estimated: sequencing of 8 rails with 10 ms intervals uses roughly 60 macrocells and 90 I/Os, leaving abundant headroom for fault logging.

🖥️

ASIC/FPGA Glue Logic Replacement

Replacing discrete 74-series TTL or CMOS glue logic with the EPM3512AFI256-7 consolidates dozens of small packages into a single 256-FBGA, dramatically reducing PCB area and improving signal integrity by shortening interconnect. The 10,000 usable gates and 512 macrocells can absorb typical board-level glue functions such as chip-select generation, wait-state insertion, interrupt prioritization, and reset distribution in one device. The deterministic 7.5 ns timing makes timing closure straightforward compared with FPGA-based glue, and the non-volatile configuration eliminates boot-time configuration overhead. Designers migrating from discrete logic should plan for a one-time schematic and library entry effort but gain long-term BOM simplification and inventory reduction.

🏭

Peripheral I/O Expansion and Control

The EPM3512AFI256-7 can serve as a high-I/O peripheral controller in industrial PCs, embedded SBCs, and FPGA-based prototyping boards. With 208 user I/Os, it can directly drive dozens of LEDs, optocouplers, relays, and digital I/O lines, while the JTAG port allows firmware updates for control logic without board removal. The MultiVolt interface simplifies connection to 24 V industrial sensors via external optos, and the high-drive capability supports long cable runs with proper termination. Industrial-grade -40 to +85 °C operation ensures reliability in factory automation, HVAC, and process-control environments where commercial parts would fail.

🏭

Legacy Industrial Control Boards

Industrial OEMs with installed bases of MAX 3000A-based control boards use the EPM3512AFI256-7 as a direct maintenance and repair replacement. The 256-FBGA package and full IEEE Std. 1532 ISP compliance allow field replacement using the same JTAG programming tools already deployed in production. The deterministic timing preserves the original board's real-time behavior without firmware changes, and the high-I/O count supports the wide parallel buses common in PLC I/O modules and motor drives. Long-term support contracts with Altera/Intel and authorized aftermarket distributors make the part available for the typical 10-15 year industrial product lifecycle.

What is the EPM3512AFI256-7?
The EPM3512AFI256-7 is a 512-macrocell, 10,000-gate CPLD from the Altera MAX 3000A family, supplied in a 256-ball FBGA package with a 7.5 ns pin-to-pin delay. According to the Altera MAX 3000A datasheet, it integrates 32 LABs (16 macrocells each), 208 user I/Os, and JTAG-based in-system programmability compliant with IEEE Std. 1532.
How many user I/O pins does the EPM3512AFI256-7 have?
The EPM3512AFI256-7 exposes 208 user I/O pins in its 256-FBGA package. The 48 remaining balls are allocated to VCCINT, VCCIO, GND, JTAG (TCK/TMS/TDI/TDO), and dedicated inputs. The MultiVolt I/O interface allows the 208 I/Os to operate at 1.8 V, 2.5 V, 3.3 V, or 5.0 V, which is critical for mixed-voltage designs.
What is the supply voltage of the EPM3512AFI256-7?
The EPM3512AFI256-7 requires a 3.3 V core supply (VCCINT). Its user I/Os support MultiVolt operation at 1.8 V, 2.5 V, 3.3 V, and 5.0 V, allowing the CPLD to interface directly with legacy 5 V logic without external level shifters. A 0.1 µF decoupling capacitor should be placed within 100 mil of every VCCINT/VCCIO ball pair.
Is the EPM3512AFI256-7 still in production?
The EPM3512AFI256-7 is currently listed as obsolete by Altera/Intel, with the MAX 3000A family reaching end-of-life several years ago. Long-term supply is available only through the distributor aftermarket; for new designs, Altera recommends migrating to the MAX II or MAX V CPLD families, which provide equivalent logic density in a non-volatile, lower-power architecture.
What is the difference between EPM3512AFI256-7 and EPM3512AFI256-10?
The EPM3512AFI256-7 and EPM3512AFI256-10 share the same 256-FBGA package, 512 macrocells, and 208 I/Os; they differ only in speed grade. The "-7" suffix denotes a 7.5 ns pin-to-pin delay (faster, typically 116 MHz fMAX), while the "-10" suffix denotes a 10 ns delay (slower, lower cost). Both are pin-to-pin compatible drop-in alternatives in the same family.
What package does the EPM3512AFI256-7 use?
The EPM3512AFI256-7 is supplied in a 256-ball Fine-Pitch Ball Grid Array (FBGA) measuring 17 mm × 17 mm with a 1.0 mm ball pitch. This package is also referenced as PBGA256 or BGA-256 in distributor catalogs. Assembly requires a four-layer PCB with 0.5 oz copper, 8-mil microvias, and a reflow profile compatible with lead-free (SAC305) solder.
Where can I buy the EPM3512AFI256-7?
As of 2026-09-12, the EPM3512AFI256-7 is obsolete and no longer factory-fresh from authorized distributors. Stock is available only through aftermarket brokers (Jotrin, Vemeko, Mfmic, Kynix, Etei) and independent distributors listed on Octopart. Pricing varies widely with market availability; verified distributor pricing should always be confirmed before order placement.
What is the price of the EPM3512AFI256-7?
Distributor pricing for the EPM3512AFI256-7 as of 2026-09-12 reflects its obsolete status. Single-piece prices start around $28.50 at tier-1 channels, with quantity-100 pricing near $21.80 and quantity-1000 near $15.95 in aftermarket channels. Pricing is highly volatile; for new designs, migrate to MAX II or MAX V CPLDs which are still actively manufactured.
What is the lead time for the EPM3512AFI256-7?
Lead times for the obsolete EPM3512AFI256-7 vary by distributor channel: tier-1 channels (DigiKey/Mouser) typically show 0 stock with no factory lead-time, while authorized aftermarket brokers quote 4-12 weeks depending on wafer/finished-goods inventory. For production designs, sourcing through a franchised aftermarket distributor with full traceability is recommended to avoid counterfeit risk.
EPM3512AFI256-7 vs EPM7512AEFC256-7 — which is better for high-density glue logic?
The EPM3512AFI256-7 (MAX 3000A, 512 macrocells, 7.5 ns) is better for high-volume, low-cost glue logic where instant-on non-volatile configuration matters. The EPM7512AEFC256-7 belongs to the MAX 7000AE family with 512 macrocells and a 7.5 ns delay but a different 256-FBGA ball-out; it is pin-compatible at the silicon level but requires PCB revalidation for the ball map. Choose EPM3512AFI256-7 for greenfield MAX 3000A designs and EPM7512AEFI256-7 only when migrating from existing MAX 7000 boards.
When should I choose the EPM3512AFI256-7 over a small FPGA?
Choose the EPM3512AFI256-7 over a small FPGA (e.g., MAX II EPM240, Cyclone IV) when the design needs instant-on non-volatile configuration with no external boot PROM, deterministic 7.5 ns pin-to-pin timing for bus decoding, and high 5 V-tolerant drive strength on 208 I/Os. Choose an FPGA when the design requires sequential logic density above 512 macrocells, embedded RAM, or hardware multipliers; the EPM3512AFI256-7 lacks dedicated RAM blocks and DSP elements.
Is the EPM3512AFI256-7 suitable for 5 V system designs?
Yes, the EPM3512AFI256-7 is well-suited for 5 V system designs thanks to its MultiVolt I/O interface. While the core runs at 3.3 V (VCCINT), the I/O banks can be powered at 1.8 V, 2.5 V, 3.3 V, or 5.0 V and tolerate 5.0 V input levels, allowing direct connection to TTL/CMOS 5 V logic without external level shifters. This makes it popular for industrial and legacy bus bridging.
What is the best drop-in replacement for the EPM3512AFI256-7?
The best drop-in replacements for the EPM3512AFI256-7 are other MAX 3000A variants in the same 256-FBGA package: EPM3512AFI256-10 (slower 10 ns grade, same package) and EPM3512AFI256-10N (lead-free/RoHS variant). For modern alternatives, the MAX II EPM1270F256I5N and MAX V 5M240ZE64C5N are recommended, but they require board re-layout because the ball-out differs from the legacy 256-FBGA.
Where can I download the EPM3512AFI256-7 datasheet PDF?
The official Altera MAX 3000A family datasheet covering the EPM3512AFI256-7 is hosted on Altera/Intel's website and mirrored at third-party document repositories such as Alldatasheet. The datasheet includes AC timing specifications, JTAG programming waveforms, IBIS models, and the complete 256-ball pin-out. Always cross-reference the device marking on the package against the datasheet ordering information before PCB layout.
What are the key specifications of the EPM3512AFI256-7 that engineers should know?
Engineers working with the EPM3512AFI256-7 should focus on five key specifications: 512 macrocells (logic capacity), 208 user I/Os (connectivity), 7.5 ns pin-to-pin delay (timing), 256-ball FBGA at 1.0 mm pitch (assembly), and 3.3 V core with 5 V-tolerant MultiVolt I/O (signal interface). These five parameters together determine whether the device fits a given board's density, speed, and voltage-mixing requirements.

کے لیے انجینئرنگ ریفرنس ڈیٹا EPM3512AFI256-7 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the EPM3512AFI256-7 when you need a 512-macrocell MAX 3000A CPLD in the 256-FBGA package with the fastest 7.5 ns speed grade and the full -40C to +85C industrial temperature range. For new designs, evaluate MAX II (EPM1270F256I5N) or MAX V (5M240ZE64C5N) as actively-produced alternatives, but expect to redesign the PCB because the FBGA ball-out differs. Choose the EPM3512AFI256-10 if a 10 ns delay is acceptable and you want broader distributor availability. Choose the EPM3512AFI256-10N if your board requires lead-free reflow. Avoid the commercial EPM3512AFC256-7x variants unless the product is restricted to indoor 0-70C operation. The part is obsolete — confirm long-term supply contracts before committing to a production design.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ EPM3512AFI256-10 EPM3512AFI256-10N EPM3512AFC256-7 EPM3512AFC256-10N
Brand Altera Altera Altera Altera Altera
Package 256-FBGA (17x17mm, 1.0mm pitch) 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same
Family MAX 3000A MAX 3000A - same MAX 3000A - same MAX 3000A - same MAX 3000A - same
Macrocells 512 512 512 512 512
Pin-to-Pin Delay (tPD) 7.5 ns 10 ns (+33%) 10 ns (+33%) 7.5 ns (same) 10 ns (+33%)
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C 0C to +70C (Commercial) 0C to +70C (Commercial)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

اہم امتیازی خصوصیات

  • Highest speed grade in the 256-FBGA MAX 3000A lineup (بمقابلہEPM3512AFI256-10)
  • Industrial temperature range -40C to +85C (بمقابلہEPM3512AFC256-7)
  • 208 user I/Os with MultiVolt 5V tolerance (بمقابلہEPM3512AFC256-10N)

ڈیزائن نوٹس

The 256-FBGA package uses a 1.0 mm ball pitch and 17 mm × 17 mm body. Use a four-layer PCB with 0.5 oz copper, NSMD (non-solder-mask-defined) pads, and 8-mil (0.20 mm) laser-drilled microvias for fan-out. Via-in-pad is recommended for inner rows to break out the 256 balls on standard 4-layer stack-ups. Apply a lead-free SAC305 (Sn96.5/Ag3.0/Cu0.5) reflow profile with peak temperature 245-250 °C, TAL 60-90 s. Place a 0.1 µF X7R 0402/0603 decoupling capacitor within 100 mil of every VCCINT and VCCIO ball, plus a 4.7 µF bulk capacitor per supply rail.

The EPM3512AFI256-7 requires a 3.3 V VCCINT supply but its I/O banks tolerate up to 5.5 V on inputs. Do NOT apply 5 V to any pin before VCCINT has ramped — the I/O structure is referenced to VCCIO and undefined behavior can permanently damage the device. Hold JTAG TCK low or grounded during power-up to prevent accidental ISP entry. Always include a 10 kΩ pull-up on TMS and TDI, and a 10 kΩ pull-down on TCK per IEEE 1149.1 recommendations.

Route the four JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with ≤ 4 inches total trace length, and place a 22 Ω series-termination resistor close to the driver on TCK and TMS to suppress ringing on fast edges. Keep JTAG traces away from clock and switching-power traces; use a guard ground via fence every 200 mil. Estimated: the 7.5 ns tPD budget allows roughly 1.5 inches of matched trace length for address/control signals at 50 MHz operation; above 75 MHz use a -7 speed grade only.

تعمیل کی معلومات

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
لیڈ فری
Unknown
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Unknown

EPM3512AFI256-7 launched in 2000s-era MAX 3000A family; RoHS/REACH status not explicitly stated in verified web data — marked unknown. N-suffixed variants (EPM3512AFI256-10N) are lead-free. AEC-Q100 not applicable — automotive use requires separate qualification.

ڈیٹا کی تصدیق کی تاریخ: 2026-09-12 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

EPM3512AFI256-7 datasheet EPM3512AFI256-7 price EPM3512AFI256-7 buy MAX 3000A CPLD 512 macrocells Altera CPLD 256-FBGA obsolete EPM3512AFI256-7 pinout EPM3512AFI256-7 vs EPM3512AFI256-10 MAX 3000A drop-in replacement EPM3512AFI256-7 lead time 2026 256-ball FBGA CPLD 7.5ns MAX 3000A in-system programmable JTAG Altera MAX 3000A address decoder EPM3512AFI256-7 industrial temperature is EPM3512AFI256-7 still in production

متعلقہ اجزاء اور اصطلاحات

Altera Intel EPM3512AFI256-7 MAX 3000A CPLD Complex Programmable Logic Device FBGA BGA-256 MultiVolt I/O JTAG IEEE Std. 1149.1 IEEE Std. 1532 macrocell Logic Array Block Programmable Interconnect Array 0.30 µm CMOS EEPROM 5 V tolerant industrial temperature grade address decoder glue logic ASIC replacement power sequencing VCCINT VCCIO EPM1270F256I5N MAX II MAX V RoHS lead-free
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