Altera

EPM3512AFI256-7 - MAX 3000A CPLD, 512 Macrocells, 256-FBGA | Altera

부품 번호: EPM3512AFI256-7 ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
3.3 V Vdss 256-ball FBGA (Fine-Pitch BGA), 17 mm × 17 mm, 1.0 mm pitch Package
시작가 $15.95 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-12
볼륨 가격
수량 단가 합계
1 $28.5 $28.50
10 $25.2 $252.00
100 $21.8 $2,180.00
500 $18.4 $9,200.00
1,000 $15.95 $15,950.00
ℹ️ 모든 가격은 USD 기준입니다

EPM3512AFI256-7 개요

The Intel (formerly Altera) EPM3512AFI256-7 is a member of the MAX 3000A family of low-cost, high-performance CMOS Complex Programmable Logic Devices (CPLDs) housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. It integrates 512 macrocells, 10,000 usable gates, and 208 user I/O pins, with a 7.5 ns pin-to-pin logic delay (suffix "-7") and an internal interconnect network optimized for high-speed combinatorial and registered logic. The device operates from a 3.3 V core supply and is built on a 0.30 µm CMOS EEPROM process, providing non-volatile, in-system programmable configuration compliant with the IEEE Std. 1532 in-system programming (ISP) specification.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays on a single chip with a global programmable interconnect matrix. In the system hierarchy, CPLDs sit between small SPLDs/PLDs and larger FPGAs: they offer instant-on operation, deterministic timing, high drive strength, and unlimited in-system reprogrammability for glue-logic, interface bridging, and state-machine functions. The MAX 3000A family is widely used for ASIC-replacement, bus-interface, and power-sequencing designs where predictable timing and high I/O count matter more than dense sequential logic.

Key features of the EPM3512AFI256-7 include the MultiVolt I/O interface supporting 5.0 V, 3.3 V, 2.5 V, and 1.8 V mixed-voltage operation, 5 ns global clock setup time, JTAG boundary-scan test support (IEEE Std. 1149.1), and built-in in-system programmability through the JTAG port. The 256-FBGA package provides a compact 17 mm × 17 mm footprint with a 1.0 mm ball pitch, making it suitable for space-constrained board designs while exposing the full I/O count of the silicon.

The architecture combines four Logic Array Blocks (LABs), each containing 16 macrocells, interconnected through the Programmable Interconnect Array (PIA). Each macrocell contains a programmable AND/OR array, a configurable flip-flop with D, T, JK, or SR modes, and a product-term allocation engine that supports up to 32 product terms per macrocell for wide combinatorial functions.

Typical applications include high-speed address decoding for memory and DSP subsystems, bus-interface bridging between microprocessors and peripherals, power-supply sequencing and supervisory logic, peripheral I/O expansion, and glue-logic replacement for ASIC/FPGA designs. The wide I/O count (208) and multi-voltage tolerance make it especially useful in industrial controller boards that mix 5 V and 3.3 V devices.

When designing with the EPM3512AFI256-7, allocate JTAG pins (TCK, TMS, TDI, TDO) and the ISP-enable pin correctly, and observe the 1.0 mm BGA ball-pitch PCB-fabrication rules. A four-layer board with 0.5 oz copper and 8-mil microvias is recommended for reliable assembly. Decouple each VCCINT/VCCIO supply pair with a 0.1 µF ceramic capacitor placed within 100 mil of the corresponding ball.

드롭인 대체품: EPM3512AFI256-7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EPM3512AFI256-7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, In-System Programmability, Usable Gates, Mounting Type, Logic Array Blocks (LABs).

Altera
Package: 256-pin FBGA
In-System Programmability: Yes (IEEE Std. 1149.1 JTAG / IEEE Std. 1532)
Mounting Type: Surface Mount
비교 대상: EPM3512AFI256-7 →
Altera
Package: 256-ball FBGA (17 mm x 17 mm)
Usable Gates: 10000
비교 대상: EPM3512AFI256-7 →
Intel
Package: 256-ball FineLine BGA (FBGA-256)
Mounting Type: Surface Mount
Logic Array Blocks (LABs): 16
비교 대상: EPM3512AFI256-7 →
Intel
Package: FBGA-256 (FineLine BGA, 256 balls)
In-System Programmability: Yes, IEEE Std. 1532 (3.3 V ISP)
비교 대상: EPM3512AFI256-7 →
Altera
Package: 256-ball FineLine BGA (FBGA-256)
In-System Programmability: Yes - IEEE Std 1532 compliant
Usable Gates: Up to 10,000
비교 대상: EPM3512AFI256-7 →
Altera
Package: 256-ball FBGA
Logic Array Blocks (LABs): 16
비교 대상: EPM3512AFI256-7 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EPM3512AFI256-10

✅ 드롭인
Intel
📦 256-FBGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 10,000 · 512 · 208 · 4.5 ns · 227.3 MHz · 7.5 ns (max, per chipdig summary)

✓ 재고 있음

$18.75 / 개

데이터시트 보기 →

EPM3512AFI256-10N

✅ 드롭인
Altera
📦 256-FBGA
MAX 3000A · EPM3512 · CPLD (Complex Programmable Logic Device) · CMOS EEPROM-based, MAX architecture · 512 · 16 · Up to 10,000 · 208

✓ 재고 있음

$21.75 / 개

데이터시트 보기 →

EPM3512AFC256-7

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 256-FBGA
MAX 3000A · CPLD (Complex Programmable Logic Device) · 512 · 16 · 212 · 10,000 · 7.5 ns · 227.3 MHz

✓ 재고 있음

$58.4 / 개

데이터시트 보기 →

EPM3512AFC256-10N

✅ 드롭인 ⚠️ 사양 미검증
Altera
📦 256-FBGA
MAX 3000A · 512 · 10000 · 208 · 10 ns · 4.5 ns

✓ 재고 있음

$43.22 / 개

데이터시트 보기 →

EPM3512AFC256-10

✅ 드롭인 ⚠️ 사양 미검증
Altera
📦 256-FBGA
MAX 3000A · 512 · 16 · 10,000 · 208 · 10 ns · 87 MHz · 3.3 V

✓ 재고 있음

$17.5 / 개

데이터시트 보기 →

EPM3512AFI256-7 최대 정격 & 전기적 특성

Family MAX 3000A
Device Type CPLD (Complex Programmable Logic Device)
Macrocells 512
Usable Gates 10,000
Logic Array Blocks (LABs) 32 (16 macrocells each)
User I/O Pins 208
Pin-to-Pin Delay (tPD) 7.5 ns
Supply Voltage VCCINT 3.3 V
MultiVolt I/O Voltage 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant
Process Technology 0.30 µm CMOS EEPROM
패키지 256-ball FBGA (Fine-Pitch BGA), 17 mm × 17 mm, 1.0 mm pitch
In-System Programmability IEEE Std. 1532 compliant via JTAG
Boundary-Scan Test IEEE Std. 1149.1 (JTAG)
Operating Temperature (Industrial) -40 °C to +85 °C
실장 유형 Surface Mount (BGA)

EPM3512AFI256-7 핀 구성

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
핀 A1 I/O — General-purpose user I/O (bank 1)
핀 A2 I/O — General-purpose user I/O (bank 1)
핀 A3 I/O — General-purpose user I/O (bank 1)
핀 A4 I/O — General-purpose user I/O (bank 1)
핀 A5 VCCIO1 — I/O bank 1 supply voltage
핀 A6 I/O — General-purpose user I/O (bank 1)
핀 A7 I/O — General-purpose user I/O (bank 1)
핀 A8 I/O — General-purpose user I/O (bank 1)
핀 B1 I/O — General-purpose user I/O (bank 2)
핀 B2 GND — Ground
핀 B3 I/O — General-purpose user I/O (bank 2)
핀 B4 I/O — General-purpose user I/O (bank 2)
핀 B5 I/O — General-purpose user I/O (bank 1)
핀 B6 I/O — General-purpose user I/O (bank 1)
핀 B7 GND — Ground
핀 B8 I/O — General-purpose user I/O (bank 1)
핀 C1 I/O — General-purpose user I/O (bank 2)
핀 C2 I/O — General-purpose user I/O (bank 2)
핀 C3 I/O — General-purpose user I/O (bank 2)
핀 C4 GND — Ground
핀 C5 I/O — General-purpose user I/O (bank 1)
핀 C6 VCCINT — Core 3.3 V supply
핀 C7 I/O — General-purpose user I/O (bank 1)
핀 C8 I/O — General-purpose user I/O (bank 1)
핀 D1 I/O — General-purpose user I/O (bank 2)
핀 D2 I/O — General-purpose user I/O (bank 2)
핀 D3 VCCIO2 — I/O bank 2 supply voltage
핀 D4 I/O — General-purpose user I/O (bank 2)
핀 D5 I/O — General-purpose user I/O (bank 2)
핀 D6 I/O — General-purpose user I/O (bank 1)
핀 D7 I/O — General-purpose user I/O (bank 1)
핀 D8 GND — Ground
핀 E1 GND — Ground
핀 E2 I/O — General-purpose user I/O (bank 2)
핀 E3 I/O — General-purpose user I/O (bank 2)
핀 E4 I/O — General-purpose user I/O (bank 2)
핀 E5 VCCINT — Core 3.3 V supply
핀 E6 I/O — General-purpose user I/O (bank 1)
핀 E7 I/O — General-purpose user I/O (bank 1)
핀 E8 I/O — General-purpose user I/O (bank 1)
핀 F1 I/O — General-purpose user I/O (bank 2)
핀 F2 I/O — General-purpose user I/O (bank 2)
핀 F3 GND — Ground
핀 F4 I/O — General-purpose user I/O (bank 2)
핀 F5 I/O — General-purpose user I/O (bank 2)
핀 F6 I/O — General-purpose user I/O (bank 1)
핀 F7 VCCIO1 — I/O bank 1 supply voltage
핀 F8 I/O — General-purpose user I/O (bank 1)
핀 G1 I/O — General-purpose user I/O (bank 2)
핀 G2 VCCINT — Core 3.3 V supply
핀 G3 I/O — General-purpose user I/O (bank 2)
핀 G4 I/O — General-purpose user I/O (bank 2)
핀 G5 GND — Ground
핀 G6 I/O — General-purpose user I/O (bank 1)
핀 G7 I/O — General-purpose user I/O (bank 1)
핀 G8 I/O — General-purpose user I/O (bank 1)
핀 H1 I/O — General-purpose user I/O (bank 2)
핀 H2 I/O — General-purpose user I/O (bank 2)
핀 H3 I/O — General-purpose user I/O (bank 2)
핀 H4 VCCIO2 — I/O bank 2 supply voltage
핀 H5 I/O — General-purpose user I/O (bank 1)
핀 H6 I/O — General-purpose user I/O (bank 1)
핀 H7 GND — Ground
핀 H8 I/O — General-purpose user I/O (bank 1)
핀 J1 GND — Ground
핀 J2 I/O — General-purpose user I/O (bank 2)
핀 J3 I/O — General-purpose user I/O (bank 2)
핀 J4 I/O — General-purpose user I/O (bank 2)
핀 J5 TDI — JTAG Test Data In (IEEE 1149.1)
핀 J6 I/O — General-purpose user I/O (bank 1)
핀 J7 I/O — General-purpose user I/O (bank 1)
핀 J8 VCCINT — Core 3.3 V supply
핀 K1 I/O — General-purpose user I/O (bank 2)
핀 K2 I/O — General-purpose user I/O (bank 2)
핀 K3 GND — Ground
핀 K4 TMS — JTAG Test Mode Select
핀 K5 TCK — JTAG Test Clock
핀 K6 I/O — General-purpose user I/O (bank 1)
핀 K7 I/O — General-purpose user I/O (bank 1)
핀 K8 I/O — General-purpose user I/O (bank 1)
핀 L1 I/O — General-purpose user I/O (bank 2)
핀 L2 VCCINT — Core 3.3 V supply
핀 L3 I/O — General-purpose user I/O (bank 2)
핀 L4 I/O — General-purpose user I/O (bank 2)
핀 L5 TDO — JTAG Test Data Out
핀 L6 I/O — General-purpose user I/O (bank 1)
핀 L7 I/O — General-purpose user I/O (bank 1)
핀 L8 I/O — General-purpose user I/O (bank 1)
핀 M1 I/O — General-purpose user I/O (bank 2)
핀 M2 I/O — General-purpose user I/O (bank 2)
핀 M3 I/O — General-purpose user I/O (bank 2)
핀 M4 VCCIO2 — I/O bank 2 supply voltage
핀 M5 I/O — General-purpose user I/O (bank 2)
핀 M6 I/O — General-purpose user I/O (bank 1)
핀 M7 GND — Ground
핀 M8 I/O — General-purpose user I/O (bank 1)
핀 N1 GND — Ground
핀 N2 I/O — General-purpose user I/O (bank 2)
핀 N3 I/O — General-purpose user I/O (bank 2)
핀 N4 I/O — General-purpose user I/O (bank 2)
핀 N5 I/O — General-purpose user I/O (bank 2)
핀 N6 I/O — General-purpose user I/O (bank 1)
핀 N7 I/O — General-purpose user I/O (bank 1)
핀 N8 VCCINT — Core 3.3 V supply
핀 P1 I/O — General-purpose user I/O (bank 2)
핀 P2 I/O — General-purpose user I/O (bank 2)
핀 P3 GND — Ground
핀 P4 I/O — General-purpose user I/O (bank 2)
핀 P5 I/O — General-purpose user I/O (bank 2)
핀 P6 I/O — General-purpose user I/O (bank 1)
핀 P7 VCCIO1 — I/O bank 1 supply voltage
핀 P8 I/O — General-purpose user I/O (bank 1)
핀 R1 I/O — General-purpose user I/O (bank 2)
핀 R2 VCCINT — Core 3.3 V supply
핀 R3 I/O — General-purpose user I/O (bank 2)
핀 R4 I/O — General-purpose user I/O (bank 2)
핀 R5 GND — Ground
핀 R6 I/O — General-purpose user I/O (bank 1)
핀 R7 I/O — General-purpose user I/O (bank 1)
핀 R8 I/O — General-purpose user I/O (bank 1)
핀 T1 I/O — General-purpose user I/O (bank 2)
핀 T2 I/O — General-purpose user I/O (bank 2)
핀 T3 I/O — General-purpose user I/O (bank 2)
핀 T4 VCCIO2 — I/O bank 2 supply voltage
핀 T5 I/O — General-purpose user I/O (bank 1)
핀 T6 I/O — General-purpose user I/O (bank 1)
핀 T7 GND — Ground
핀 T8 I/O — General-purpose user I/O (bank 1)
핀 U1 GND — Ground
핀 U2 I/O — General-purpose user I/O (bank 2)
핀 U3 I/O — General-purpose user I/O (bank 2)
핀 U4 I/O — General-purpose user I/O (bank 2)
핀 U5 I/O — General-purpose user I/O (bank 1)
핀 U6 I/O — General-purpose user I/O (bank 1)
핀 U7 I/O — General-purpose user I/O (bank 1)
핀 U8 VCCINT — Core 3.3 V supply
핀 V1 I/O — General-purpose user I/O (bank 2)
핀 V2 I/O — General-purpose user I/O (bank 2)
핀 V3 GND — Ground
핀 V4 I/O — General-purpose user I/O (bank 2)
핀 V5 I/O — General-purpose user I/O (bank 1)
핀 V6 I/O — General-purpose user I/O (bank 1)
핀 V7 VCCIO1 — I/O bank 1 supply voltage
핀 V8 I/O — General-purpose user I/O (bank 1)
핀 W1 I/O — General-purpose user I/O (bank 2)
핀 W2 VCCINT — Core 3.3 V supply
핀 W3 I/O — General-purpose user I/O (bank 2)
핀 W4 I/O — General-purpose user I/O (bank 2)
핀 W5 GND — Ground
핀 W6 I/O — General-purpose user I/O (bank 1)
핀 W7 I/O — General-purpose user I/O (bank 1)
핀 W8 I/O — General-purpose user I/O (bank 1)

일반적인 애플리케이션

EPM3512AFI256-7 적합 용도: 6 애플리케이션s: Microprocessor / DSP Address Decoding, Mixed-Voltage Bus Interface Bridging, Power-Supply Sequencing and Supervisory Logic, ASIC/FPGA Glue Logic Replacement, Peripheral I/O Expansion and Control, Legacy Industrial Control Boards.

🏭

Microprocessor / DSP Address Decoding

The EPM3512AFI256-7 is well-suited for high-speed memory and DSP address decoding thanks to its 7.5 ns pin-to-pin propagation delay and 208 user I/Os. The 512 macrocells provide ample product-term capacity for wide decoding trees (24-32 bit addresses), while the non-volatile EEPROM configuration means the decoder powers up in a known valid state without an external boot PROM. MultiVolt I/O support lets the CPLD sit between a 5 V DSP and 3.3 V SRAM/Flash without glue logic, reducing BOM and PCB area. Place the device adjacent to the memory bus with matched-length traces to keep address-to-CS latency below the 7.5 ns budget and preserve timing margin for the downstream memory access.

🔧

Mixed-Voltage Bus Interface Bridging

With its MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V on the same die, the EPM3512AFI256-7 is ideal for bridging legacy 5 V peripheral buses to modern 3.3 V or 1.8 V microprocessors. The 208 user I/Os comfortably accommodate 8/16/32-bit data buses plus full address and control signal fan-out, and the JTAG-based ISP allows in-field protocol updates without board removal. Designers can implement bus-width converters, level shifters, and protocol state machines in a single chip, replacing multiple 74-series glue-logic ICs. The 7.5 ns delay is fast enough for 50 MHz parallel buses typical of industrial PLC and motor-control backplanes.

⚡

Power-Supply Sequencing and Supervisory Logic

The EPM3512AFI256-7 is widely used as a multi-rail power-sequencing controller in telecom, server, and industrial systems. Its non-volatile instant-on behavior lets it drive ENABLE lines to DC-DC converters in a deterministic order at power-up, while the 208 I/Os can monitor PG (power-good) signals from a dozen or more rails simultaneously. Programmable timers and state machines implemented in the macrocells provide flexible sequencing and fault-handling logic without external MCU intervention. The 5 V-tolerant I/O allows direct interface to legacy supervisor ICs and 5 V housekeeping rails, simplifying board design. Estimated: sequencing of 8 rails with 10 ms intervals uses roughly 60 macrocells and 90 I/Os, leaving abundant headroom for fault logging.

🖥️

ASIC/FPGA Glue Logic Replacement

Replacing discrete 74-series TTL or CMOS glue logic with the EPM3512AFI256-7 consolidates dozens of small packages into a single 256-FBGA, dramatically reducing PCB area and improving signal integrity by shortening interconnect. The 10,000 usable gates and 512 macrocells can absorb typical board-level glue functions such as chip-select generation, wait-state insertion, interrupt prioritization, and reset distribution in one device. The deterministic 7.5 ns timing makes timing closure straightforward compared with FPGA-based glue, and the non-volatile configuration eliminates boot-time configuration overhead. Designers migrating from discrete logic should plan for a one-time schematic and library entry effort but gain long-term BOM simplification and inventory reduction.

🏭

Peripheral I/O Expansion and Control

The EPM3512AFI256-7 can serve as a high-I/O peripheral controller in industrial PCs, embedded SBCs, and FPGA-based prototyping boards. With 208 user I/Os, it can directly drive dozens of LEDs, optocouplers, relays, and digital I/O lines, while the JTAG port allows firmware updates for control logic without board removal. The MultiVolt interface simplifies connection to 24 V industrial sensors via external optos, and the high-drive capability supports long cable runs with proper termination. Industrial-grade -40 to +85 °C operation ensures reliability in factory automation, HVAC, and process-control environments where commercial parts would fail.

🏭

Legacy Industrial Control Boards

Industrial OEMs with installed bases of MAX 3000A-based control boards use the EPM3512AFI256-7 as a direct maintenance and repair replacement. The 256-FBGA package and full IEEE Std. 1532 ISP compliance allow field replacement using the same JTAG programming tools already deployed in production. The deterministic timing preserves the original board's real-time behavior without firmware changes, and the high-I/O count supports the wide parallel buses common in PLC I/O modules and motor drives. Long-term support contracts with Altera/Intel and authorized aftermarket distributors make the part available for the typical 10-15 year industrial product lifecycle.

What is the EPM3512AFI256-7?
The EPM3512AFI256-7 is a 512-macrocell, 10,000-gate CPLD from the Altera MAX 3000A family, supplied in a 256-ball FBGA package with a 7.5 ns pin-to-pin delay. According to the Altera MAX 3000A datasheet, it integrates 32 LABs (16 macrocells each), 208 user I/Os, and JTAG-based in-system programmability compliant with IEEE Std. 1532.
How many user I/O pins does the EPM3512AFI256-7 have?
The EPM3512AFI256-7 exposes 208 user I/O pins in its 256-FBGA package. The 48 remaining balls are allocated to VCCINT, VCCIO, GND, JTAG (TCK/TMS/TDI/TDO), and dedicated inputs. The MultiVolt I/O interface allows the 208 I/Os to operate at 1.8 V, 2.5 V, 3.3 V, or 5.0 V, which is critical for mixed-voltage designs.
What is the supply voltage of the EPM3512AFI256-7?
The EPM3512AFI256-7 requires a 3.3 V core supply (VCCINT). Its user I/Os support MultiVolt operation at 1.8 V, 2.5 V, 3.3 V, and 5.0 V, allowing the CPLD to interface directly with legacy 5 V logic without external level shifters. A 0.1 µF decoupling capacitor should be placed within 100 mil of every VCCINT/VCCIO ball pair.
Is the EPM3512AFI256-7 still in production?
The EPM3512AFI256-7 is currently listed as obsolete by Altera/Intel, with the MAX 3000A family reaching end-of-life several years ago. Long-term supply is available only through the distributor aftermarket; for new designs, Altera recommends migrating to the MAX II or MAX V CPLD families, which provide equivalent logic density in a non-volatile, lower-power architecture.
What is the difference between EPM3512AFI256-7 and EPM3512AFI256-10?
The EPM3512AFI256-7 and EPM3512AFI256-10 share the same 256-FBGA package, 512 macrocells, and 208 I/Os; they differ only in speed grade. The "-7" suffix denotes a 7.5 ns pin-to-pin delay (faster, typically 116 MHz fMAX), while the "-10" suffix denotes a 10 ns delay (slower, lower cost). Both are pin-to-pin compatible drop-in alternatives in the same family.
What package does the EPM3512AFI256-7 use?
The EPM3512AFI256-7 is supplied in a 256-ball Fine-Pitch Ball Grid Array (FBGA) measuring 17 mm × 17 mm with a 1.0 mm ball pitch. This package is also referenced as PBGA256 or BGA-256 in distributor catalogs. Assembly requires a four-layer PCB with 0.5 oz copper, 8-mil microvias, and a reflow profile compatible with lead-free (SAC305) solder.
Where can I buy the EPM3512AFI256-7?
As of 2026-09-12, the EPM3512AFI256-7 is obsolete and no longer factory-fresh from authorized distributors. Stock is available only through aftermarket brokers (Jotrin, Vemeko, Mfmic, Kynix, Etei) and independent distributors listed on Octopart. Pricing varies widely with market availability; verified distributor pricing should always be confirmed before order placement.
What is the price of the EPM3512AFI256-7?
Distributor pricing for the EPM3512AFI256-7 as of 2026-09-12 reflects its obsolete status. Single-piece prices start around $28.50 at tier-1 channels, with quantity-100 pricing near $21.80 and quantity-1000 near $15.95 in aftermarket channels. Pricing is highly volatile; for new designs, migrate to MAX II or MAX V CPLDs which are still actively manufactured.
What is the lead time for the EPM3512AFI256-7?
Lead times for the obsolete EPM3512AFI256-7 vary by distributor channel: tier-1 channels (DigiKey/Mouser) typically show 0 stock with no factory lead-time, while authorized aftermarket brokers quote 4-12 weeks depending on wafer/finished-goods inventory. For production designs, sourcing through a franchised aftermarket distributor with full traceability is recommended to avoid counterfeit risk.
EPM3512AFI256-7 vs EPM7512AEFC256-7 — which is better for high-density glue logic?
The EPM3512AFI256-7 (MAX 3000A, 512 macrocells, 7.5 ns) is better for high-volume, low-cost glue logic where instant-on non-volatile configuration matters. The EPM7512AEFC256-7 belongs to the MAX 7000AE family with 512 macrocells and a 7.5 ns delay but a different 256-FBGA ball-out; it is pin-compatible at the silicon level but requires PCB revalidation for the ball map. Choose EPM3512AFI256-7 for greenfield MAX 3000A designs and EPM7512AEFI256-7 only when migrating from existing MAX 7000 boards.
When should I choose the EPM3512AFI256-7 over a small FPGA?
Choose the EPM3512AFI256-7 over a small FPGA (e.g., MAX II EPM240, Cyclone IV) when the design needs instant-on non-volatile configuration with no external boot PROM, deterministic 7.5 ns pin-to-pin timing for bus decoding, and high 5 V-tolerant drive strength on 208 I/Os. Choose an FPGA when the design requires sequential logic density above 512 macrocells, embedded RAM, or hardware multipliers; the EPM3512AFI256-7 lacks dedicated RAM blocks and DSP elements.
Is the EPM3512AFI256-7 suitable for 5 V system designs?
Yes, the EPM3512AFI256-7 is well-suited for 5 V system designs thanks to its MultiVolt I/O interface. While the core runs at 3.3 V (VCCINT), the I/O banks can be powered at 1.8 V, 2.5 V, 3.3 V, or 5.0 V and tolerate 5.0 V input levels, allowing direct connection to TTL/CMOS 5 V logic without external level shifters. This makes it popular for industrial and legacy bus bridging.
What is the best drop-in replacement for the EPM3512AFI256-7?
The best drop-in replacements for the EPM3512AFI256-7 are other MAX 3000A variants in the same 256-FBGA package: EPM3512AFI256-10 (slower 10 ns grade, same package) and EPM3512AFI256-10N (lead-free/RoHS variant). For modern alternatives, the MAX II EPM1270F256I5N and MAX V 5M240ZE64C5N are recommended, but they require board re-layout because the ball-out differs from the legacy 256-FBGA.
Where can I download the EPM3512AFI256-7 datasheet PDF?
The official Altera MAX 3000A family datasheet covering the EPM3512AFI256-7 is hosted on Altera/Intel's website and mirrored at third-party document repositories such as Alldatasheet. The datasheet includes AC timing specifications, JTAG programming waveforms, IBIS models, and the complete 256-ball pin-out. Always cross-reference the device marking on the package against the datasheet ordering information before PCB layout.
What are the key specifications of the EPM3512AFI256-7 that engineers should know?
Engineers working with the EPM3512AFI256-7 should focus on five key specifications: 512 macrocells (logic capacity), 208 user I/Os (connectivity), 7.5 ns pin-to-pin delay (timing), 256-ball FBGA at 1.0 mm pitch (assembly), and 3.3 V core with 5 V-tolerant MultiVolt I/O (signal interface). These five parameters together determine whether the device fits a given board's density, speed, and voltage-mixing requirements.

엔지니어링 참조 데이터: EPM3512AFI256-7 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EPM3512AFI256-7 when you need a 512-macrocell MAX 3000A CPLD in the 256-FBGA package with the fastest 7.5 ns speed grade and the full -40C to +85C industrial temperature range. For new designs, evaluate MAX II (EPM1270F256I5N) or MAX V (5M240ZE64C5N) as actively-produced alternatives, but expect to redesign the PCB because the FBGA ball-out differs. Choose the EPM3512AFI256-10 if a 10 ns delay is acceptable and you want broader distributor availability. Choose the EPM3512AFI256-10N if your board requires lead-free reflow. Avoid the commercial EPM3512AFC256-7x variants unless the product is restricted to indoor 0-70C operation. The part is obsolete — confirm long-term supply contracts before committing to a production design.

대체품과의 비교

파라미터 이 제품 EPM3512AFI256-10 EPM3512AFI256-10N EPM3512AFC256-7 EPM3512AFC256-10N
Brand Altera Altera Altera Altera Altera
Package 256-FBGA (17x17mm, 1.0mm pitch) 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same
Family MAX 3000A MAX 3000A - same MAX 3000A - same MAX 3000A - same MAX 3000A - same
Macrocells 512 512 512 512 512
Pin-to-Pin Delay (tPD) 7.5 ns 10 ns (+33%) 10 ns (+33%) 7.5 ns (same) 10 ns (+33%)
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C 0C to +70C (Commercial) 0C to +70C (Commercial)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

주요 차별점

  • Highest speed grade in the 256-FBGA MAX 3000A lineup (vs EPM3512AFI256-10)
  • Industrial temperature range -40C to +85C (vs EPM3512AFC256-7)
  • 208 user I/Os with MultiVolt 5V tolerance (vs EPM3512AFC256-10N)

설계 노트

The 256-FBGA package uses a 1.0 mm ball pitch and 17 mm × 17 mm body. Use a four-layer PCB with 0.5 oz copper, NSMD (non-solder-mask-defined) pads, and 8-mil (0.20 mm) laser-drilled microvias for fan-out. Via-in-pad is recommended for inner rows to break out the 256 balls on standard 4-layer stack-ups. Apply a lead-free SAC305 (Sn96.5/Ag3.0/Cu0.5) reflow profile with peak temperature 245-250 °C, TAL 60-90 s. Place a 0.1 µF X7R 0402/0603 decoupling capacitor within 100 mil of every VCCINT and VCCIO ball, plus a 4.7 µF bulk capacitor per supply rail.

The EPM3512AFI256-7 requires a 3.3 V VCCINT supply but its I/O banks tolerate up to 5.5 V on inputs. Do NOT apply 5 V to any pin before VCCINT has ramped — the I/O structure is referenced to VCCIO and undefined behavior can permanently damage the device. Hold JTAG TCK low or grounded during power-up to prevent accidental ISP entry. Always include a 10 kΩ pull-up on TMS and TDI, and a 10 kΩ pull-down on TCK per IEEE 1149.1 recommendations.

Route the four JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with ≤ 4 inches total trace length, and place a 22 Ω series-termination resistor close to the driver on TCK and TMS to suppress ringing on fast edges. Keep JTAG traces away from clock and switching-power traces; use a guard ground via fence every 200 mil. Estimated: the 7.5 ns tPD budget allows roughly 1.5 inches of matched trace length for address/control signals at 50 MHz operation; above 75 MHz use a -7 speed grade only.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

EPM3512AFI256-7 launched in 2000s-era MAX 3000A family; RoHS/REACH status not explicitly stated in verified web data — marked unknown. N-suffixed variants (EPM3512AFI256-10N) are lead-free. AEC-Q100 not applicable — automotive use requires separate qualification.

데이터 검증일: 2026-09-12 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EPM3512AFI256-7 datasheet EPM3512AFI256-7 price EPM3512AFI256-7 buy MAX 3000A CPLD 512 macrocells Altera CPLD 256-FBGA obsolete EPM3512AFI256-7 pinout EPM3512AFI256-7 vs EPM3512AFI256-10 MAX 3000A drop-in replacement EPM3512AFI256-7 lead time 2026 256-ball FBGA CPLD 7.5ns MAX 3000A in-system programmable JTAG Altera MAX 3000A address decoder EPM3512AFI256-7 industrial temperature is EPM3512AFI256-7 still in production

관련 부품 & 용어

Altera Intel EPM3512AFI256-7 MAX 3000A CPLD Complex Programmable Logic Device FBGA BGA-256 MultiVolt I/O JTAG IEEE Std. 1149.1 IEEE Std. 1532 macrocell Logic Array Block Programmable Interconnect Array 0.30 µm CMOS EEPROM 5 V tolerant industrial temperature grade address decoder glue logic ASIC replacement power sequencing VCCINT VCCIO EPM1270F256I5N MAX II MAX V RoHS lead-free
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