EPM3512AFI256-7 - MAX 3000A CPLD, 512 Macrocells, 256-FBGA | Altera
Référence : EPM3512AFI256-7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2 180,00 |
| 500 | $18.4 | $9 200,00 |
| 1 000 | $15.95 | $15 950,00 |
EPM3512AFI256-7 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays on a single chip with a global programmable interconnect matrix. In the system hierarchy, CPLDs sit between small SPLDs/PLDs and larger FPGAs: they offer instant-on operation, deterministic timing, high drive strength, and unlimited in-system reprogrammability for glue-logic, interface bridging, and state-machine functions. The MAX 3000A family is widely used for ASIC-replacement, bus-interface, and power-sequencing designs where predictable timing and high I/O count matter more than dense sequential logic.
Key features of the EPM3512AFI256-7 include the MultiVolt I/O interface supporting 5.0 V, 3.3 V, 2.5 V, and 1.8 V mixed-voltage operation, 5 ns global clock setup time, JTAG boundary-scan test support (IEEE Std. 1149.1), and built-in in-system programmability through the JTAG port. The 256-FBGA package provides a compact 17 mm × 17 mm footprint with a 1.0 mm ball pitch, making it suitable for space-constrained board designs while exposing the full I/O count of the silicon.
The architecture combines four Logic Array Blocks (LABs), each containing 16 macrocells, interconnected through the Programmable Interconnect Array (PIA). Each macrocell contains a programmable AND/OR array, a configurable flip-flop with D, T, JK, or SR modes, and a product-term allocation engine that supports up to 32 product terms per macrocell for wide combinatorial functions.
Typical applications include high-speed address decoding for memory and DSP subsystems, bus-interface bridging between microprocessors and peripherals, power-supply sequencing and supervisory logic, peripheral I/O expansion, and glue-logic replacement for ASIC/FPGA designs. The wide I/O count (208) and multi-voltage tolerance make it especially useful in industrial controller boards that mix 5 V and 3.3 V devices.
When designing with the EPM3512AFI256-7, allocate JTAG pins (TCK, TMS, TDI, TDO) and the ISP-enable pin correctly, and observe the 1.0 mm BGA ball-pitch PCB-fabrication rules. A four-layer board with 0.5 oz copper and 8-mil microvias is recommended for reliable assembly. Decouple each VCCINT/VCCIO supply pair with a 0.1 µF ceramic capacitor placed within 100 mil of the corresponding ball.
Alternatives de remplacement direct pour EPM3512AFI256-7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3512AFI256-7 (même facteur de forme et même empreinte) — différant par Package, In-System Programmability, Usable Gates, Mounting Type, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3512AFI256-10
✅ Remplacement direct✓ En stock
$18.75 / unité
Voir la fiche technique →EPM3512AFI256-10N
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →EPM3512AFC256-7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$58.4 / unité
Voir la fiche technique →EPM3512AFC256-10N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$43.22 / unité
Voir la fiche technique →EPM3512AFC256-10
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.5 / unité
Voir la fiche technique →EPM3512AFI256-7 Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 32 (16 macrocells each) |
| User I/O Pins | 208 |
| Pin-to-Pin Delay (tPD) | 7.5 ns |
| Supply Voltage VCCINT | 3.3 V |
| MultiVolt I/O Voltage | 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS EEPROM |
| Boîtier | 256-ball FBGA (Fine-Pitch BGA), 17 mm × 17 mm, 1.0 mm pitch |
| In-System Programmability | IEEE Std. 1532 compliant via JTAG |
| Boundary-Scan Test | IEEE Std. 1149.1 (JTAG) |
| Operating Temperature (Industrial) | -40 °C to +85 °C |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de EPM3512AFI256-7
| Broche A1 | I/O — General-purpose user I/O (bank 1) |
| Broche A2 | I/O — General-purpose user I/O (bank 1) |
| Broche A3 | I/O — General-purpose user I/O (bank 1) |
| Broche A4 | I/O — General-purpose user I/O (bank 1) |
| Broche A5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A6 | I/O — General-purpose user I/O (bank 1) |
| Broche A7 | I/O — General-purpose user I/O (bank 1) |
| Broche A8 | I/O — General-purpose user I/O (bank 1) |
| Broche B1 | I/O — General-purpose user I/O (bank 2) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — General-purpose user I/O (bank 2) |
| Broche B4 | I/O — General-purpose user I/O (bank 2) |
| Broche B5 | I/O — General-purpose user I/O (bank 1) |
| Broche B6 | I/O — General-purpose user I/O (bank 1) |
| Broche B7 | GND — Ground |
| Broche B8 | I/O — General-purpose user I/O (bank 1) |
| Broche C1 | I/O — General-purpose user I/O (bank 2) |
| Broche C2 | I/O — General-purpose user I/O (bank 2) |
| Broche C3 | I/O — General-purpose user I/O (bank 2) |
| Broche C4 | GND — Ground |
| Broche C5 | I/O — General-purpose user I/O (bank 1) |
| Broche C6 | VCCINT — Core 3.3 V supply |
| Broche C7 | I/O — General-purpose user I/O (bank 1) |
| Broche C8 | I/O — General-purpose user I/O (bank 1) |
| Broche D1 | I/O — General-purpose user I/O (bank 2) |
| Broche D2 | I/O — General-purpose user I/O (bank 2) |
| Broche D3 | VCCIO2 — I/O bank 2 supply voltage |
| Broche D4 | I/O — General-purpose user I/O (bank 2) |
| Broche D5 | I/O — General-purpose user I/O (bank 2) |
| Broche D6 | I/O — General-purpose user I/O (bank 1) |
| Broche D7 | I/O — General-purpose user I/O (bank 1) |
| Broche D8 | GND — Ground |
| Broche E1 | GND — Ground |
| Broche E2 | I/O — General-purpose user I/O (bank 2) |
| Broche E3 | I/O — General-purpose user I/O (bank 2) |
| Broche E4 | I/O — General-purpose user I/O (bank 2) |
| Broche E5 | VCCINT — Core 3.3 V supply |
| Broche E6 | I/O — General-purpose user I/O (bank 1) |
| Broche E7 | I/O — General-purpose user I/O (bank 1) |
| Broche E8 | I/O — General-purpose user I/O (bank 1) |
| Broche F1 | I/O — General-purpose user I/O (bank 2) |
| Broche F2 | I/O — General-purpose user I/O (bank 2) |
| Broche F3 | GND — Ground |
| Broche F4 | I/O — General-purpose user I/O (bank 2) |
| Broche F5 | I/O — General-purpose user I/O (bank 2) |
| Broche F6 | I/O — General-purpose user I/O (bank 1) |
| Broche F7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche F8 | I/O — General-purpose user I/O (bank 1) |
| Broche G1 | I/O — General-purpose user I/O (bank 2) |
| Broche G2 | VCCINT — Core 3.3 V supply |
| Broche G3 | I/O — General-purpose user I/O (bank 2) |
| Broche G4 | I/O — General-purpose user I/O (bank 2) |
| Broche G5 | GND — Ground |
| Broche G6 | I/O — General-purpose user I/O (bank 1) |
| Broche G7 | I/O — General-purpose user I/O (bank 1) |
| Broche G8 | I/O — General-purpose user I/O (bank 1) |
| Broche H1 | I/O — General-purpose user I/O (bank 2) |
| Broche H2 | I/O — General-purpose user I/O (bank 2) |
| Broche H3 | I/O — General-purpose user I/O (bank 2) |
| Broche H4 | VCCIO2 — I/O bank 2 supply voltage |
| Broche H5 | I/O — General-purpose user I/O (bank 1) |
| Broche H6 | I/O — General-purpose user I/O (bank 1) |
| Broche H7 | GND — Ground |
| Broche H8 | I/O — General-purpose user I/O (bank 1) |
| Broche J1 | GND — Ground |
| Broche J2 | I/O — General-purpose user I/O (bank 2) |
| Broche J3 | I/O — General-purpose user I/O (bank 2) |
| Broche J4 | I/O — General-purpose user I/O (bank 2) |
| Broche J5 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche J6 | I/O — General-purpose user I/O (bank 1) |
| Broche J7 | I/O — General-purpose user I/O (bank 1) |
| Broche J8 | VCCINT — Core 3.3 V supply |
| Broche K1 | I/O — General-purpose user I/O (bank 2) |
| Broche K2 | I/O — General-purpose user I/O (bank 2) |
| Broche K3 | GND — Ground |
| Broche K4 | TMS — JTAG Test Mode Select |
| Broche K5 | TCK — JTAG Test Clock |
| Broche K6 | I/O — General-purpose user I/O (bank 1) |
| Broche K7 | I/O — General-purpose user I/O (bank 1) |
| Broche K8 | I/O — General-purpose user I/O (bank 1) |
| Broche L1 | I/O — General-purpose user I/O (bank 2) |
| Broche L2 | VCCINT — Core 3.3 V supply |
| Broche L3 | I/O — General-purpose user I/O (bank 2) |
| Broche L4 | I/O — General-purpose user I/O (bank 2) |
| Broche L5 | TDO — JTAG Test Data Out |
| Broche L6 | I/O — General-purpose user I/O (bank 1) |
| Broche L7 | I/O — General-purpose user I/O (bank 1) |
| Broche L8 | I/O — General-purpose user I/O (bank 1) |
| Broche M1 | I/O — General-purpose user I/O (bank 2) |
| Broche M2 | I/O — General-purpose user I/O (bank 2) |
| Broche M3 | I/O — General-purpose user I/O (bank 2) |
| Broche M4 | VCCIO2 — I/O bank 2 supply voltage |
| Broche M5 | I/O — General-purpose user I/O (bank 2) |
| Broche M6 | I/O — General-purpose user I/O (bank 1) |
| Broche M7 | GND — Ground |
| Broche M8 | I/O — General-purpose user I/O (bank 1) |
| Broche N1 | GND — Ground |
| Broche N2 | I/O — General-purpose user I/O (bank 2) |
| Broche N3 | I/O — General-purpose user I/O (bank 2) |
| Broche N4 | I/O — General-purpose user I/O (bank 2) |
| Broche N5 | I/O — General-purpose user I/O (bank 2) |
| Broche N6 | I/O — General-purpose user I/O (bank 1) |
| Broche N7 | I/O — General-purpose user I/O (bank 1) |
| Broche N8 | VCCINT — Core 3.3 V supply |
| Broche P1 | I/O — General-purpose user I/O (bank 2) |
| Broche P2 | I/O — General-purpose user I/O (bank 2) |
| Broche P3 | GND — Ground |
| Broche P4 | I/O — General-purpose user I/O (bank 2) |
| Broche P5 | I/O — General-purpose user I/O (bank 2) |
| Broche P6 | I/O — General-purpose user I/O (bank 1) |
| Broche P7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche P8 | I/O — General-purpose user I/O (bank 1) |
| Broche R1 | I/O — General-purpose user I/O (bank 2) |
| Broche R2 | VCCINT — Core 3.3 V supply |
| Broche R3 | I/O — General-purpose user I/O (bank 2) |
| Broche R4 | I/O — General-purpose user I/O (bank 2) |
| Broche R5 | GND — Ground |
| Broche R6 | I/O — General-purpose user I/O (bank 1) |
| Broche R7 | I/O — General-purpose user I/O (bank 1) |
| Broche R8 | I/O — General-purpose user I/O (bank 1) |
| Broche T1 | I/O — General-purpose user I/O (bank 2) |
| Broche T2 | I/O — General-purpose user I/O (bank 2) |
| Broche T3 | I/O — General-purpose user I/O (bank 2) |
| Broche T4 | VCCIO2 — I/O bank 2 supply voltage |
| Broche T5 | I/O — General-purpose user I/O (bank 1) |
| Broche T6 | I/O — General-purpose user I/O (bank 1) |
| Broche T7 | GND — Ground |
| Broche T8 | I/O — General-purpose user I/O (bank 1) |
| Broche U1 | GND — Ground |
| Broche U2 | I/O — General-purpose user I/O (bank 2) |
| Broche U3 | I/O — General-purpose user I/O (bank 2) |
| Broche U4 | I/O — General-purpose user I/O (bank 2) |
| Broche U5 | I/O — General-purpose user I/O (bank 1) |
| Broche U6 | I/O — General-purpose user I/O (bank 1) |
| Broche U7 | I/O — General-purpose user I/O (bank 1) |
| Broche U8 | VCCINT — Core 3.3 V supply |
| Broche V1 | I/O — General-purpose user I/O (bank 2) |
| Broche V2 | I/O — General-purpose user I/O (bank 2) |
| Broche V3 | GND — Ground |
| Broche V4 | I/O — General-purpose user I/O (bank 2) |
| Broche V5 | I/O — General-purpose user I/O (bank 1) |
| Broche V6 | I/O — General-purpose user I/O (bank 1) |
| Broche V7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche V8 | I/O — General-purpose user I/O (bank 1) |
| Broche W1 | I/O — General-purpose user I/O (bank 2) |
| Broche W2 | VCCINT — Core 3.3 V supply |
| Broche W3 | I/O — General-purpose user I/O (bank 2) |
| Broche W4 | I/O — General-purpose user I/O (bank 2) |
| Broche W5 | GND — Ground |
| Broche W6 | I/O — General-purpose user I/O (bank 1) |
| Broche W7 | I/O — General-purpose user I/O (bank 1) |
| Broche W8 | I/O — General-purpose user I/O (bank 1) |
Applications typiques
EPM3512AFI256-7 convient pour 6 applications: Microprocessor / DSP Address Decoding, Mixed-Voltage Bus Interface Bridging, Power-Supply Sequencing and Supervisory Logic, ASIC/FPGA Glue Logic Replacement, Peripheral I/O Expansion and Control, Legacy Industrial Control Boards.
Microprocessor / DSP Address Decoding
The EPM3512AFI256-7 is well-suited for high-speed memory and DSP address decoding thanks to its 7.5 ns pin-to-pin propagation delay and 208 user I/Os. The 512 macrocells provide ample product-term capacity for wide decoding trees (24-32 bit addresses), while the non-volatile EEPROM configuration means the decoder powers up in a known valid state without an external boot PROM. MultiVolt I/O support lets the CPLD sit between a 5 V DSP and 3.3 V SRAM/Flash without glue logic, reducing BOM and PCB area. Place the device adjacent to the memory bus with matched-length traces to keep address-to-CS latency below the 7.5 ns budget and preserve timing margin for the downstream memory access.
Recommandé
Mixed-Voltage Bus Interface Bridging
With its MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V on the same die, the EPM3512AFI256-7 is ideal for bridging legacy 5 V peripheral buses to modern 3.3 V or 1.8 V microprocessors. The 208 user I/Os comfortably accommodate 8/16/32-bit data buses plus full address and control signal fan-out, and the JTAG-based ISP allows in-field protocol updates without board removal. Designers can implement bus-width converters, level shifters, and protocol state machines in a single chip, replacing multiple 74-series glue-logic ICs. The 7.5 ns delay is fast enough for 50 MHz parallel buses typical of industrial PLC and motor-control backplanes.
Recommandé
Power-Supply Sequencing and Supervisory Logic
The EPM3512AFI256-7 is widely used as a multi-rail power-sequencing controller in telecom, server, and industrial systems. Its non-volatile instant-on behavior lets it drive ENABLE lines to DC-DC converters in a deterministic order at power-up, while the 208 I/Os can monitor PG (power-good) signals from a dozen or more rails simultaneously. Programmable timers and state machines implemented in the macrocells provide flexible sequencing and fault-handling logic without external MCU intervention. The 5 V-tolerant I/O allows direct interface to legacy supervisor ICs and 5 V housekeeping rails, simplifying board design. Estimated: sequencing of 8 rails with 10 ms intervals uses roughly 60 macrocells and 90 I/Os, leaving abundant headroom for fault logging.
Recommandé
ASIC/FPGA Glue Logic Replacement
Replacing discrete 74-series TTL or CMOS glue logic with the EPM3512AFI256-7 consolidates dozens of small packages into a single 256-FBGA, dramatically reducing PCB area and improving signal integrity by shortening interconnect. The 10,000 usable gates and 512 macrocells can absorb typical board-level glue functions such as chip-select generation, wait-state insertion, interrupt prioritization, and reset distribution in one device. The deterministic 7.5 ns timing makes timing closure straightforward compared with FPGA-based glue, and the non-volatile configuration eliminates boot-time configuration overhead. Designers migrating from discrete logic should plan for a one-time schematic and library entry effort but gain long-term BOM simplification and inventory reduction.
Recommandé
Peripheral I/O Expansion and Control
The EPM3512AFI256-7 can serve as a high-I/O peripheral controller in industrial PCs, embedded SBCs, and FPGA-based prototyping boards. With 208 user I/Os, it can directly drive dozens of LEDs, optocouplers, relays, and digital I/O lines, while the JTAG port allows firmware updates for control logic without board removal. The MultiVolt interface simplifies connection to 24 V industrial sensors via external optos, and the high-drive capability supports long cable runs with proper termination. Industrial-grade -40 to +85 °C operation ensures reliability in factory automation, HVAC, and process-control environments where commercial parts would fail.
Recommandé
Legacy Industrial Control Boards
Industrial OEMs with installed bases of MAX 3000A-based control boards use the EPM3512AFI256-7 as a direct maintenance and repair replacement. The 256-FBGA package and full IEEE Std. 1532 ISP compliance allow field replacement using the same JTAG programming tools already deployed in production. The deterministic timing preserves the original board's real-time behavior without firmware changes, and the high-I/O count supports the wide parallel buses common in PLC I/O modules and motor drives. Long-term support contracts with Altera/Intel and authorized aftermarket distributors make the part available for the typical 10-15 year industrial product lifecycle.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3512AFI256-7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3512AFI256-10 | EPM3512AFI256-10N | EPM3512AFC256-7 | EPM3512AFC256-10N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 256-FBGA (17x17mm, 1.0mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Family | MAX 3000A | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 10 ns (+33%) | 10 ns (+33%) | 7.5 ns (same) | 10 ns (+33%) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest speed grade in the 256-FBGA MAX 3000A lineup (vs EPM3512AFI256-10)
- Industrial temperature range -40C to +85C (vs EPM3512AFC256-7)
- 208 user I/Os with MultiVolt 5V tolerance (vs EPM3512AFC256-10N)
Notes de conception
The 256-FBGA package uses a 1.0 mm ball pitch and 17 mm × 17 mm body. Use a four-layer PCB with 0.5 oz copper, NSMD (non-solder-mask-defined) pads, and 8-mil (0.20 mm) laser-drilled microvias for fan-out. Via-in-pad is recommended for inner rows to break out the 256 balls on standard 4-layer stack-ups. Apply a lead-free SAC305 (Sn96.5/Ag3.0/Cu0.5) reflow profile with peak temperature 245-250 °C, TAL 60-90 s. Place a 0.1 µF X7R 0402/0603 decoupling capacitor within 100 mil of every VCCINT and VCCIO ball, plus a 4.7 µF bulk capacitor per supply rail.
The EPM3512AFI256-7 requires a 3.3 V VCCINT supply but its I/O banks tolerate up to 5.5 V on inputs. Do NOT apply 5 V to any pin before VCCINT has ramped — the I/O structure is referenced to VCCIO and undefined behavior can permanently damage the device. Hold JTAG TCK low or grounded during power-up to prevent accidental ISP entry. Always include a 10 kΩ pull-up on TMS and TDI, and a 10 kΩ pull-down on TCK per IEEE 1149.1 recommendations.
Route the four JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with ≤ 4 inches total trace length, and place a 22 Ω series-termination resistor close to the driver on TCK and TMS to suppress ringing on fast edges. Keep JTAG traces away from clock and switching-power traces; use a guard ground via fence every 200 mil. Estimated: the 7.5 ns tPD budget allows roughly 1.5 inches of matched trace length for address/control signals at 50 MHz operation; above 75 MHz use a -7 speed grade only.
Informations de conformité
EPM3512AFI256-7 launched in 2000s-era MAX 3000A family; RoHS/REACH status not explicitly stated in verified web data — marked unknown. N-suffixed variants (EPM3512AFI256-10N) are lead-free. AEC-Q100 not applicable — automotive use requires separate qualification.
