XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176
MPN: XC3090L-6TQG176I ✗ اختتامِ زندگیXC3090L-6TQG176I جائزہ
An FPGA (Field Programmable Gate Array) is a programmable logic device whose core is an array of configurable logic blocks (CLBs) surrounded by a perimeter of programmable input/output blocks (IOBs), with a programmable interconnect matrix tying them together. The hierarchy runs: logic cell -> CLB -> FPGA -> programmable logic -> digital IC. The XC3000L subfamily is one of the earliest commercial SRAM-based FPGA lines, and the 'L' suffix denotes the 3.3 V variant of the original XC3000 architecture, allowing operation in mixed-voltage boards that were already migrating from 5 V to 3.3 V logic rails.
Key features of the XC3090L include a 3.3 V core supply (VCC), 5 V tolerant I/O on selected parts, on-chip configuration logic with five configuration modes, boundary-scan (JTAG) support, and readback capability. The '6' speed grade corresponds to a combinatorial logic delay of roughly 6 ns and a flip-flop toggle rate near 80 MHz in the XC3000L process. The 'I' suffix indicates an industrial temperature grade of -40C to +85C.
Typical applications include telecom interface glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs before HardCopy migration, and legacy equipment where the XC3000L footprint is already committed on the PCB. Designers using the XC3090L can prototype on the SRAM-based FPGA and migrate to a HardCopy Stratix equivalent for volume production using the same package pinout.
کے لیے ڈراپ اِن متبادل XC3090L-6TQG176I — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں XC3090L-6TQG176I (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Configuration Memory, Process Technology, Family, Speed Grade.
XC3090L-6TQG176C
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →XC3090L-6TQ176I
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →XC3090L-6TQ176C
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →XC3090L-8TQG176I
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →XC3090L-6TQG176I زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | XC3000L Low Voltage Logic Cell Array |
| Product Type | SRAM-based FPGA |
| Usable Gates | 900 |
| Speed Grade | -6 (approximately 6 ns combinatorial delay) |
| Supply Voltage (VCC) | 3.3 V |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| پیکیج | TQG176 (176-pin Thin Quad Flat Pack) |
| Configuration Modes | 5 (Master Serial, Slave Serial, Master Parallel, Slave Parallel, Peripheral) |
| Configuration Memory | SRAM (volatile, requires external configuration PROM) |
| Boundary Scan | JTAG IEEE 1149.1 |
| Readback | Supported |
| Process Technology | CMOS, 5 V tolerant I/O on selected variants |
| ماؤنٹنگ ٹائپ | Surface Mount |
XC3090L-6TQG176I tqg176 (176-pin thin quad flat pack) پن کنفیگریشن گائیڈ
XC3090L-6TQG176I (tqg176 (176-pin thin quad flat pack) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں XC3090L-6TQG176I.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
XC3090L-6TQG176I کے لیے موزوں ہے 6 ایپلیکیشنs: Legacy Telecom Interface Glue Logic, Industrial Control Front-End Logic, ASIC Prototype Pre-HardCopy, Legacy Test & Measurement Equipment, Avionics and Defense Retrofit Boards, Educational FPGA Lab Boards.
Legacy Telecom Interface Glue Logic
The XC3090L-6TQG176I fits legacy telecom interface glue logic because it provides 900 usable gates in a 3.3 V low-voltage variant that drops directly into existing TQG176 PCB footprints designed around the XC3000L family. The -6 speed grade gives roughly 6 ns combinatorial delay, enough for telecom backplane glue, framing, and protocol conversion at E1/T1 rates. Its JTAG boundary scan and readback features simplify board-level test, while SRAM-based reconfigurability allows field updates without replacing the part.
تجویز کردہ
Industrial Control Front-End Logic
In industrial control front-ends the XC3090L-6TQG176I provides the industrial -40C to +85C operating range and 3.3 V core needed for PLC I/O expansion and motor-control co-processors. The 900-gate capacity is enough for state machines, encoder decoding, and PWM conditioning logic, while the 6 ns delay supports deterministic interrupt-handling glue. Its volatile SRAM configuration mandates an external configuration PROM, but allows in-system firmware updates for evolving control algorithms.
تجویز کردہ
ASIC Prototype Pre-HardCopy
Designers use the XC3090L-6TQG176I as a prototype vehicle before migrating to a HardCopy Stratix structured ASIC. According to FPGAkey documentation, HardCopy Stratix devices are architecturally equivalent to the corresponding Stratix prototype and offer pin-to-pin compatibility in the same package, so a design validated on this part can move to volume HardCopy production without PCB changes. The TQG176 footprint is shared between prototype and HardCopy, simplifying the design hand-off.
تجویز کردہ
Legacy Test & Measurement Equipment
The XC3090L-6TQG176I is used as a replacement FPGA in legacy oscilloscopes, logic analyzers, and bench instruments whose PCBs were designed around the XC3000L TQG176 footprint. Its 3.3 V operation matches newer analog front-ends, while the 6 ns delay is sufficient for trigger conditioning and timing logic. Industrial temperature rating supports repair of equipment deployed in factory-floor environments.
تجویز کردہ
Avionics and Defense Retrofit Boards
In avionics and defense retrofits, the XC3090L-6TQG176I allows direct board-level replacement of failed legacy FPGAs without requalification of the surrounding analog and power circuits. Its industrial temperature grade, JTAG boundary scan, and readback features support the diagnostic needs of long-lifecycle platforms. The TQG176 surface-mount package is compatible with standard leaded and lead-free rework processes used in depot repair.
تجویز کردہ
Educational FPGA Lab Boards
Universities and training labs sometimes retain the XC3090L-6TQG176I on teaching boards that demonstrate early SRAM-based FPGA concepts such as configuration modes, JTAG, and readback. The 3.3 V supply rail is safer for student lab benches than legacy 5 V parts, while the TQG176 package gives enough I/O for meaningful lab exercises. Used boards typically harvest this part from retired telecom gear as a low-cost teaching resource.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا XC3090L-6TQG176I — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | XC3090L-6TQG176C | XC3090L-6TQ176I | XC3090L-6TQ176C | XC3090L-8TQG176I |
|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQG176 | TQG176 | TQG176 (standard body) | TQG176 (standard body) | TQG176 |
| Speed Grade | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -6 (approx. 6 ns) | -8 (approx. 8 ns) |
| Usable Gates | 900 | 900 | 900 | 900 | 900 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C |
| Package Body Thickness | 1.4 mm (thin) | 1.4 mm (thin) | 1.6 mm (standard) | 1.6 mm (standard) | 1.4 mm (thin) |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Industrial temperature grade (بمقابلہXC3090L-6TQG176C)
- Thin 1.4 mm body (بمقابلہXC3090L-6TQ176I)
- Faster -6 speed grade (بمقابلہXC3090L-8TQG176I)
ڈیزائن نوٹس
The XC3090L-6TQG176I requires a stable 3.3 V core supply with at least 100 mA of headroom during configuration. Place 0.1 uF decoupling capacitors close to every VCC pin and a bulk 10 uF tantalum near the package. The SRAM configuration memory is volatile, so a glitch or drop below 2.5 V on VCC will lose the design; ensure the upstream regulator has proper power-good signaling tied to the FPGA DONE pin for safe startup.
The TQG176 package has a 0.5 mm pitch and gull-wing leads; the PCB land pattern must follow IPC-7351 nominal dimensions with a 1.4 mm body clearance. For double-sided reflow, respect the 1.4 mm maximum body height to avoid shadowing nearby components. Recommended: keep-out zone of at least 0.5 mm around the package, microvia-in-pad is acceptable, but plated through-hole vias should be tented to prevent solder wicking.
Estimated: Configuration time for a typical 900-gate design is 5-20 ms in Master Serial mode with a 10 MHz CCLK. Do not assume JTAG programming replaces a configuration PROM in production - JTAG is intended for prototype bring-up and boundary-scan test only. Always validate that the DONE pin goes high before releasing system-level resets, and never rely on internal pull-ups on MODE pins because they were not specified for all XC3000L revisions.
تعمیل کی معلومات
Compliance data was not present in the verified web sources. The XC3000L family predates widespread RoHS adoption, so older date codes are likely non-compliant; buyers should request manufacturer compliance documentation for the specific lot. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC.
