10M16DAU324C8G - MAX 10 FPGA 16K LE 246 I/O UBGA-324 | Intel / Altera
MPN: 10M16DAU324C8G ✓ Hoạt động10M16DAU324C8G Tóm tắt
A MAX 10 FPGA is a low-cost, non-volatile family of programmable logic devices that combine an FPGA fabric, embedded flash configuration memory, analog-to-digital converters (ADCs), and on-chip dual-configuration flash on a single die. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting between simple CPLDs and high-performance FPGAs. MAX 10 devices target glue-logic, bridge, motor control, and I/O expansion designs that benefit from instant-on behavior without an external boot flash.
Key features include 16,000 logic elements (LEs), 562,176 bits of user flash memory (UFM) and embedded SRAM, up to 246 user I/O pins, integrated 12-bit SAR ADCs, on-die temperature-sensing diode, and hardened DDR3 memory interface support. The device supports up to 1.6 Gbps LVDS performance per pair, dual-boot configuration from internal flash, and a hardened Nios II soft-processor-ready fabric.
The architecture combines a look-up-table (LUT)-based logic fabric with embedded M9K memory blocks, 18x18 multipliers, and a tightly integrated analog and power-management block. Dual-configuration flash allows field upgrades and fail-safe fallback, while the embedded ADC enables precision analog sampling without an external mixed-signal IC.
Typical applications include industrial motor control, sensor fusion pre-processing, video bridging, low-cost ASIC prototyping, USB Type-C interface expansion, and factory automation I/O concentrators. The integrated ADC is also widely used for thermal and current monitoring in white-goods and motor-drive systems.
When designing with this device, allocate adequate BGA breakout routing and thermal copper on the 324-UBGA footprint. Use the Quartus Prime design suite and verify pin assignments against the device-specific pin-out file before PCB fabrication, since UBGA ball mapping differs across MAX 10 density grades.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single reference for evaluating the 10M16DAU324C8G for new designs and re-sourcing.
Bộ thay thế dễ dàng lắp đặt cho 10M16DAU324C8G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10M16DAU324C8G (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Configuration Memory, Operating Temperature, Process Technology.
10M16DAU324I7G
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
10M25DAU324C8G
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
10M08DAU324C8G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M16DCU324I6G
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
10M16SAU324I7G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M40DAU324C8G
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10M50DAU324C8G
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10M16DAU324C8G Tỷ lệ tối đa & tính chất điện
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 |
| Maximum User I/O | 246 |
| Hộp | 324-UBGA (Ultra FineLine BGA) |
| Core Supply Voltage | 1.2 V (on-chip regulator) |
| Process Technology | TSMC 55 nm CMOS (non-volatile) |
| Configuration Memory | Internal flash, dual-boot capable |
| Embedded ADC | 12-bit SAR ADC |
| LVDS Performance | Up to 1.6 Gbps per pair |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) |
| Nhiệt độ hoạt động | Commercial (0C to +85C) - speed grade 8 |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Trạng thái RoHS | Compliant |
Cấu hình chân 10M16DAU324C8G
| Chân A1 | IO — General-purpose user I/O pin (bank 1A) |
| Chân A2 | VCCIO1A — I/O supply voltage for bank 1A |
| Chân B1 | IO — General-purpose user I/O pin (bank 1A) |
| Chân B2 | GND — Ground reference for bank 1A |
| Chân C1 | IO — General-purpose user I/O pin (bank 1B) |
| Chân C2 | VCCIO1B — I/O supply voltage for bank 1B |
| Chân D1 | IO — General-purpose user I/O pin (bank 2) |
| Chân D2 | GND — Ground reference for bank 2 |
| Chân E1 | IO — General-purpose user I/O pin (bank 2) |
| Chân E2 | VCCIO2 — I/O supply voltage for bank 2 |
| Chân F1 | IO — General-purpose user I/O pin (bank 3) |
| Chân F2 | GND — Ground reference for bank 3 |
| Chân G1 | IO — General-purpose user I/O pin (bank 3) |
| Chân G2 | VCCIO3 — I/O supply voltage for bank 3 |
| Chân H1 | IO — General-purpose user I/O pin (bank 4) |
| Chân H2 | GND — Ground reference for bank 4 |
| Chân J1 | IO — General-purpose user I/O pin (bank 4) |
| Chân J2 | VCCIO4 — I/O supply voltage for bank 4 |
| Chân K1 | IO — General-purpose user I/O pin (bank 5) |
| Chân K2 | GND — Ground reference for bank 5 |
| Chân L1 | IO — General-purpose user I/O pin (bank 5) |
| Chân L2 | VCCIO5 — I/O supply voltage for bank 5 |
| Chân M1 | IO — General-purpose user I/O pin (bank 6) |
| Chân M2 | GND — Ground reference for bank 6 |
| Chân N1 | IO — General-purpose user I/O pin (bank 6) |
| Chân N2 | VCCIO6 — I/O supply voltage for bank 6 |
| Chân P1 | IO — General-purpose user I/O pin (bank 7) |
| Chân P2 | GND — Ground reference for bank 7 |
| Chân R1 | IO — General-purpose user I/O pin (bank 7) |
| Chân R2 | VCCIO7 — I/O supply voltage for bank 7 |
| Chân T1 | IO — General-purpose user I/O pin (bank 8) |
| Chân T2 | GND — Ground reference for bank 8 |
| Chân U1 | VCCIO8 — I/O supply voltage for bank 8 |
| Chân U2 | VCC — Core 1.2 V supply (on-chip regulated) |
Ứng dụng tiêu biểu
10M16DAU324C8G phù hợp cho 7 Áp dụngs: Industrial Motor Control and BLDC Drive, Sensor Fusion and Industrial IoT Gateway, Video Interface Bridging and Display Aggregation, USB Type-C and High-Speed I/O Expansion, Low-Cost ASIC Prototyping and FPGA Mezzanine Card, Power Supply Sequencing and Digital Point-of-Load Control, Automotive Driver Assistance and HIL Test Equipment.
Industrial Motor Control and BLDC Drive
The 10M16DAU324C8G fits industrial motor control and BLDC / PMSM drive designs because its 16K logic elements, 18x18 multipliers, and integrated 12-bit SAR ADC handle trapezoidal and field-oriented control (FOC) algorithms in a single chip. Its on-die temperature-sensing diode enables drive-stage thermal monitoring, while the 1.2 V core with on-chip regulator simplifies 24V industrial bus designs. Used between the MCU and the IGBT/MOSFET gate driver, it generates the commutation PWM and processes back-EMF feedback from current-sense amplifiers in real time.
Được đề xuất
Sensor Fusion and Industrial IoT Gateway
The 10M16DAU324C8G serves as the programmable sensor-fusion front-end in Industrial IoT gateways, where 16K LEs are enough to implement multi-protocol bridging (RS-485, CAN, Modbus) and pre-processing for accelerometer, gyroscope, and pressure sensors. Its dual-boot internal flash supports secure field firmware updates, and the 246 user I/O enable direct connection to multiple sensor buses without external muxing. Placed between the sensor array and the host SoC, it reduces host CPU interrupt load while preserving raw data for edge analytics.
Được đề xuất
Video Interface Bridging and Display Aggregation
The 10M16DAU324C8G bridges legacy parallel RGB / LVDS display interfaces to modern MIPI-DSI or eDP panels in industrial HMIs and digital signage, using its hardened DDR3 memory controller for line-buffer frame storage and 1.6 Gbps LVDS performance for high-speed pixel links. The 562 Kb of embedded memory supports small frame buffering without external SDRAM, reducing BOM cost. Designers typically place it between the video source SoC and the panel, performing color-space conversion and timing regeneration in the fabric.
Được đề xuất
USB Type-C and High-Speed I/O Expansion
The 10M16DAU324C8G enables USB Type-C, USB 3.0, and high-speed I/O expansion in industrial PCs and embedded systems, where 16K LEs implement USB Type-C port controllers, PD negotiation logic, and downstream port multiplexing. The MAX 10 device's dual-boot flash supports in-field PD firmware updates to track the evolving USB-PD specification. Its 246 I/O provide ample pin budget for multi-port hubs without external mux ICs, reducing board area and BOM cost in industrial PC designs.
Được đề xuất
Low-Cost ASIC Prototyping and FPGA Mezzanine Card
The 10M16DAU324C8G is well-suited as a low-cost ASIC prototyping and FPGA mezzanine card (FMC) carrier for low-to-mid complexity ASIC verification, where 16K LEs emulate sub-modules before tape-out and the integrated ADC samples analog test points in real time. Its 324-UBGA footprint fits standard industrial SBC carrier boards, and the Quartus Prime toolchain supports incremental compile for fast iteration. Used in bring-up labs, it provides a low-NRE path to verify register-transfer-level (RTL) functionality before committing to mask costs.
Được đề xuất
Power Supply Sequencing and Digital Point-of-Load Control
The 10M16DAU324C8G implements digital point-of-load (PoL) control and multi-rail power supply sequencing for telecom, server, and industrial systems, using its 16K LEs to run PID compensation loops in the fabric and its hardened ADC to sample output voltage and current telemetry. Dual-boot flash stores multiple golden firmware images for safe field updates without bricking the power system. Placed between the analog controller and the supervisor, it adds telemetry, fault logging, and adaptive voltage scaling (AVS) interfaces without disturbing the analog control loop.
Được đề xuất
Automotive Driver Assistance and HIL Test Equipment
The 10M16DAU324C8G is used in hardware-in-the-loop (HIL) test equipment and industrial driver-assistance subsystems where 16K LEs emulate sensor interfaces (CAN, LIN, Ethernet) and run protocol decoders in parallel. The integrated SAR ADC samples analog sensor channels for fault injection in test rigs, while the dual-configuration flash enables safe remote firmware rollback. Designers integrate it into test fixtures that simulate automotive ECUs in development, providing deterministic, repeatable stimulus generation at a fraction of the cost of full automotive-qualified parts.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10M16DAU324C8G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10M16DAU324I7G | 10M25DAU324C8G | 10M08DAU324C8G | 10M16DCU324I6G | 10M16SAU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 25,000 | 8,000 | 16,000 | 16,000 |
| Embedded Memory (bits) | 562,176 | 562,176 | 819,200 | 387,072 | 562,176 | 562,176 |
| Configuration Flash | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DC) | Single (SA) |
| Speed Grade | 8 | 7 | 8 | 8 | 6 | 7 |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Industrial (-40C to 100C) |
| Embedded ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
| Approx. Unit Price (USD, qty-1) | 47.91 | Higher (industrial temp) | Higher (25K LEs) | Lower (8K LEs) | Similar | Similar |
Bảo phân biệt quan trọng
- 16K LE mid-density option in the largest MAX 10 package (vs10M08DAU324C8G (8K LE))
- Dual-configuration internal flash with field firmware rollback (vs10M16SAU324I7G (single-config))
- Integrated 12-bit SAR ADC with on-die temperature sensor (vs10CL055YU484C8G (Cyclone IV))
- Hardened DDR3 memory controller in the fabric (vs10M40DAU324C8G (higher density but same package))
Ghi chú thiết kế
The 324-UBGA package has a 1.0 mm ball pitch requiring 0.5 mm via-pad antipads and microvia stack-up (laser-drilled, 0.1 mm capture pad). Route signals on outer layers with 0.1 mm trace and space; inner layers need via-in-pad plating for clean breakout. Use 8-layer stack-up with 2 dedicated ground planes adjacent to the BGA row for return-path integrity and to control impedance for DDR3 interfaces routed from the dedicated DQS pins.
The MAX 10 device uses an internal linear regulator to derive the 1.2 V core from a 2.5 V or 3.3 V VCCINT supply - connect VCCINT to a clean 2.5 V rail decoupled with at least 10 uF bulk and 100 nF high-frequency ceramic per supply pin. Each VCCIO bank requires its own 1.2/1.5/1.8/2.5/3.3 V rail matching the I/O standard; group banks with shared voltage to minimize LDO count. Keep the VCCA supply (analog PLL/ADC) quiet and isolated from noisy digital rails.
Estimated: at full fabric utilization (~85% LEs toggling at 100 MHz with all 246 I/O active), the 10M16DAU324C8G dissipates approximately 0.6-0.9 W - within the commercial-grade UBGA-324 thermal envelope without an external heatsink. For industrial environments above 70C ambient or with sustained high toggle rates, add a thermal copper land under the center BGA balls (per Quartus thermal guidelines) and 4 thermal vias to an internal ground plane to reduce theta_JA below 25 C/W.
Do not route the JTAG pins (TCK/TMS/TDO/TDI) near switching I/O or clock signals - noise on JTAG can cause configuration failures. Always pull TMS high through a 10 kohm resistor and TCK low through 10 kohm for proper Quartus programmer behavior. Verify CONFIG_MODE pin settings against the boot mode you intend (dual-boot vs single) before PCB fabrication, as these pins are sampled at power-up and cannot be changed without a hardware revision.
For LVDS operation up to 1.6 Gbps per pair, match trace lengths within 5 mils of differential pairs and keep 100 ohm differential impedance on the outer layers with continuous reference ground plane. The MAX 10 LVDS serializer/deserializer (SERDES) is implemented in the fabric using soft IP - allocate dedicated clock pins (CLK[0:3]) to drive the SERDES reference clock for best jitter performance. Use IBIS models from Intel to simulate channel loss before PCB sign-off.
Thông tin tuân thủ
RoHS compliance per Intel / Altera MAX 10 product page. Commercial temperature grade (speed grade 8). AEC-Q100 not applicable for this commercial-grade variant - choose an automotive MAX 10 variant for vehicle applications. Lead-free per JEDEC J-STD-020 MSL-3 packaging.
