10M40SCE144C8G - MAX 10 FPGA 40K LE 144-EQFP | Intel / Altera
MPN: 10M40SCE144C8G ✓ Hoạt động10M40SCE144C8G Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as memory, multipliers, transceivers, and PHYs. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, glue functions, custom peripherals, or full processor subsystems, which makes them ideal for low-to-medium volume designs, prototyping, and field-upgradable products.
Key specifications of the 10M40SCE144C8G include 40K logic elements, 1.29 Mbit user flash, integrated dual 12-bit ADCs with up to 17 analog inputs, and a hard DDR3 memory interface supporting LPDDR2/DDR2/DDR3. The MAX 10 family integrates a flash configuration memory on-chip, eliminating the need for external boot PROMs and enabling instant-on functionality within milliseconds of power-up. The 144-EQFP exposed-pad package supports industrial-grade thermal performance with a junction-to-ambient resistance suitable for fan-less embedded systems.
Typical applications include industrial motor control and machine vision, automotive driver assistance, factory automation, video bridging and display controllers, IoT edge nodes, and low-power portable designs. The integrated ADC makes the MAX 10 particularly attractive for sensor aggregation boards where an external ADC would otherwise be required. When designing with this device, ensure the exposed pad is soldered to a sufficient copper pour (typically 1 in² minimum) to meet the package's thermal resistance specification and avoid thermal throttling under sustained switching activity.
Bộ thay thế dễ dàng lắp đặt cho 10M40SCE144C8G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10M40SCE144C8G (cùng hình factor và footprint) — khác nhau ở Configuration Memory, Package, Speed Grade, Integrated ADC, Operating Temperature.
10M40SCE144A7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M40SCE144I7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M40SAE144C8G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M40SAE144I7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M25SCE144C8G
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
10M40SCE144C8G Tỷ lệ tối đa & tính chất điện
| Series | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User I/O Count | 101 |
| Package Type | 144-LQFP Exposed Pad (EQFP-144) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0°C to +85°C (commercial) |
| Speed Grade | C8 |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Integrated ADC | Dual 12-bit SAR, up to 17 analog inputs |
| Hard Memory Controller | LPDDR2, DDR2, DDR3 |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Cấu hình chân 10M40SCE144C8G
| Chân 1 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 2 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 3 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 4 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 5 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 6 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 7 | VCCIO1B — I/O supply voltage Bank 1B |
| Chân 8 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 9 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 10 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 13 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 14 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 15 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 16 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 17 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 18 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 19 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 20 | VCCIO1B — I/O supply voltage Bank 1B |
| Chân 21 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 22 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 23 | GND — Ground |
| Chân 24 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 25 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 26 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 27 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 28 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 29 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 30 | I/O — General-purpose user I/O (Bank 1B) |
| Chân 31 | VCCIO1A — I/O supply voltage Bank 1A |
| Chân 32 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 33 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 34 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 35 | GND — Ground |
| Chân 36 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 37 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 38 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 39 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 40 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 41 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 42 | VCC — Core supply voltage |
| Chân 43 | I/O — General-purpose user I/O (Bank 2) |
| Chân 44 | I/O — General-purpose user I/O (Bank 2) |
| Chân 45 | I/O — General-purpose user I/O (Bank 2) |
| Chân 46 | GND — Ground |
| Chân 47 | I/O — General-purpose user I/O (Bank 2) |
| Chân 48 | I/O — General-purpose user I/O (Bank 2) |
| Chân 49 | I/O — General-purpose user I/O (Bank 2) |
| Chân 50 | I/O — General-purpose user I/O (Bank 2) |
| Chân 51 | I/O — General-purpose user I/O (Bank 2) |
| Chân 52 | VCCIO2 — I/O supply voltage Bank 2 |
| Chân 53 | I/O — General-purpose user I/O (Bank 2) |
| Chân 54 | I/O — General-purpose user I/O (Bank 2) |
| Chân 55 | GND — Ground |
| Chân 56 | I/O — General-purpose user I/O (Bank 2) |
| Chân 57 | I/O — General-purpose user I/O (Bank 2) |
| Chân 58 | I/O — General-purpose user I/O (Bank 2) |
| Chân 59 | I/O — General-purpose user I/O (Bank 3) |
| Chân 60 | VCCIO3 — I/O supply voltage Bank 3 |
| Chân 61 | I/O — General-purpose user I/O (Bank 3) |
| Chân 62 | I/O — General-purpose user I/O (Bank 3) |
| Chân 63 | I/O — General-purpose user I/O (Bank 3) |
| Chân 64 | I/O — General-purpose user I/O (Bank 3) |
| Chân 65 | GND — Ground |
| Chân 66 | I/O — General-purpose user I/O (Bank 3) |
| Chân 67 | I/O — General-purpose user I/O (Bank 3) |
| Chân 68 | VCC — Core supply voltage |
| Chân 69 | I/O — General-purpose user I/O (Bank 4) |
| Chân 70 | I/O — General-purpose user I/O (Bank 4) |
| Chân 71 | I/O — General-purpose user I/O (Bank 4) |
| Chân 72 | I/O — General-purpose user I/O (Bank 4) |
| Chân 73 | I/O — General-purpose user I/O (Bank 4) |
| Chân 74 | VCCIO4 — I/O supply voltage Bank 4 |
| Chân 75 | I/O — General-purpose user I/O (Bank 4) |
| Chân 76 | I/O — General-purpose user I/O (Bank 4) |
| Chân 77 | I/O — General-purpose user I/O (Bank 4) |
| Chân 78 | I/O — General-purpose user I/O (Bank 4) |
| Chân 79 | GND — Ground |
| Chân 80 | I/O — General-purpose user I/O (Bank 4) |
| Chân 81 | I/O — General-purpose user I/O (Bank 4) |
| Chân 82 | I/O — General-purpose user I/O (Bank 5) |
| Chân 83 | VCCIO5 — I/O supply voltage Bank 5 |
| Chân 84 | I/O — General-purpose user I/O (Bank 5) |
| Chân 85 | I/O — General-purpose user I/O (Bank 5) |
| Chân 86 | I/O — General-purpose user I/O (Bank 5) |
| Chân 87 | I/O — General-purpose user I/O (Bank 5) |
| Chân 88 | I/O — General-purpose user I/O (Bank 5) |
| Chân 89 | GND — Ground |
| Chân 90 | VCC — Core supply voltage |
| Chân 91 | I/O — General-purpose user I/O (Bank 6) |
| Chân 92 | I/O — General-purpose user I/O (Bank 6) |
| Chân 93 | I/O — General-purpose user I/O (Bank 6) |
| Chân 94 | VCCIO6 — I/O supply voltage Bank 6 |
| Chân 95 | I/O — General-purpose user I/O (Bank 6) |
| Chân 96 | I/O — General-purpose user I/O (Bank 6) |
| Chân 97 | I/O — General-purpose user I/O (Bank 6) |
| Chân 98 | I/O — General-purpose user I/O (Bank 6) |
| Chân 99 | GND — Ground |
| Chân 100 | I/O — General-purpose user I/O (Bank 7) |
| Chân 101 | I/O — General-purpose user I/O (Bank 7) |
| Chân 102 | VCCIO7 — I/O supply voltage Bank 7 |
| Chân 103 | I/O — General-purpose user I/O (Bank 7) |
| Chân 104 | I/O — General-purpose user I/O (Bank 7) |
| Chân 105 | I/O — General-purpose user I/O (Bank 7) |
| Chân 106 | I/O — General-purpose user I/O (Bank 7) |
| Chân 107 | VCC — Core supply voltage |
| Chân 108 | I/O — General-purpose user I/O (Bank 8) |
| Chân 109 | I/O — General-purpose user I/O (Bank 8) |
| Chân 110 | GND — Ground |
| Chân 111 | I/O — General-purpose user I/O (Bank 8) |
| Chân 112 | I/O — General-purpose user I/O (Bank 8) |
| Chân 113 | VCCIO8 — I/O supply voltage Bank 8 |
| Chân 114 | I/O — General-purpose user I/O (Bank 8) |
| Chân 115 | I/O — General-purpose user I/O (Bank 8) |
| Chân 116 | I/O — General-purpose user I/O (Bank 8) |
| Chân 117 | I/O — General-purpose user I/O (Bank 8) |
| Chân 118 | I/O — General-purpose user I/O (Bank 8) |
| Chân 119 | GND — Ground |
| Chân 120 | nSTATUS — Configuration status (open-drain) |
| Chân 121 | TCK — JTAG test clock |
| Chân 122 | TMS — JTAG test mode select |
| Chân 123 | TDI — JTAG test data in |
| Chân 124 | TDO — JTAG test data out |
| Chân 125 | nCONFIG — Configuration control (active-low) |
| Chân 126 | CONF_DONE — Configuration done (open-drain) |
| Chân 127 | DCLK — Configuration clock |
| Chân 128 | DATA0 — Configuration data input |
| Chân 129 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 130 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 131 | VCC — Core supply voltage |
| Chân 132 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 133 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 134 | GND — Ground |
| Chân 135 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 136 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 137 | VCCIO1A — I/O supply voltage Bank 1A |
| Chân 138 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 139 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 140 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 141 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 142 | GND — Ground |
| Chân 143 | I/O — General-purpose user I/O (Bank 1A) |
| Chân 144 | EPAD — Exposed thermal pad (must be soldered to ground pour) |
Ứng dụng tiêu biểu
10M40SCE144C8G phù hợp cho 6 Áp dụngs: Industrial Motor Control, Machine Vision and Video Bridging, IoT Edge Sensor Aggregation, Automotive Driver Assistance, Display Controller and Video Wall, Low-Power Portable Test Equipment.
Industrial Motor Control
The 10M40SCE144C8G fits industrial motor control applications because its 40,000 logic elements, 101 user I/O pins, and integrated dual 12-bit ADC eliminate the need for a separate motor-control MCU plus ADC chip. The on-chip flash configuration enables instant-on startup critical for safety-rated servo drives. With the hard LPDDR2/DDR2/DDR3 controller, designers can connect external motion-controller memory without soft-IP overhead. The 144-EQFP package exposes 101 I/O pins suitable for connecting Hall sensors, quadrature encoders, PWM outputs to gate drivers, and SPI/I2C peripherals. Per Intel MAX 10 datasheet, the device supports industrial protocols such as EtherCAT, PROFIBUS, and CAN via soft IP. Trade-off: at 40K LEs the part may not fit full servo-loop implementations requiring more DSP blocks; consider Cyclone IV/V for >50K LE designs.
Được đề xuất
Machine Vision and Video Bridging
The 10M40SCE144C8G is suited to machine vision and video bridging because its on-chip logic capacity can host soft MIPI CSI-2, LVDS, or parallel video receivers, while 101 user I/O pins handle image-sensor data buses plus display-side LVDS or CMOS outputs. The integrated 12-bit ADC samples illumination sensors for ambient-light feedback in camera modules. Per Intel MAX 10 datasheet, the device's hard memory controller supports DDR3 buffering for frame storage in mid-resolution inspection cameras. The non-volatile configuration simplifies factory calibration since calibration data can be stored in the user flash region of the part. Trade-off: high-resolution (>1080p) video pipelines exceed 40K LEs; for those workloads the Cyclone V or MAX 10 50K-LE parts are better choices.
Được đề xuất
IoT Edge Sensor Aggregation
The 10M40SCE144C8G suits IoT edge sensor aggregation because the integrated dual 12-bit SAR ADC accepts up to 17 analog inputs directly from temperature, pressure, and current sensors, eliminating an external ADC. The non-volatile flash configuration ensures the gateway reboots reliably after power-cycle events common in battery-powered IoT nodes. With 101 I/O pins, the part can aggregate SPI, I2C, UART, and GPIO signals from multiple sensor daughter-boards and pre-process them in fabric before forwarding to a backhaul MCU. Per Intel documentation, the MAX 10 family supports low-power modes including a sleep state that retains configuration. Trade-off: the 144-EQFP package is larger than BGA alternatives; for space-constrained IoT nodes the 256-ball BGA MAX 10 variants are smaller.
Được đề xuất
Automotive Driver Assistance
The 10M40SCE144C8G fits automotive driver-assistance subsystems such as rear-camera controllers, sensor-fusion pre-processors, and LED headlight drivers because its 101 I/O pins accommodate multiple LVDS video streams plus LIN/CAN connectivity. Per Intel MAX 10 datasheet, the device offers instant-on capability critical for rear-view cameras that must display within milliseconds of reverse-gear engagement. The hard DDR3 controller buffers frame data from the image sensor. For AEC-Q100 qualified designs, the 10M40SAE144C8G automotive variant provides the same 144-EQFP footprint with automotive-grade temperature and qualification. Trade-off: for full image-processing pipelines the 40K LEs may be tight; Cyclone V or Arria 10 devices provide more DSP and logic for vision processing.
Được đề xuất
Display Controller and Video Wall
The 10M40SCE144C8G is well-matched to display controllers and small video walls because its 101 user I/O pins can drive multiple TTL/LVDS display interfaces plus a parallel RGB or HDMI bridge. The 1,290,240-bit embedded SRAM holds frame-buffer lines, and the hard DDR3 controller supports external SDRAM for full-frame buffering. Per Intel MAX 10 documentation, the device supports common display protocols like DPI, LVDS, and OpenLDI via soft IP. The 144-EQFP package is hand-solder-friendly, simplifying prototype rework on display evaluation boards. Trade-off: video-wall systems >4 displays exceed 40K LEs; Cyclone V GX/GT parts offer transceivers for higher-bandwidth video aggregation.
Được đề xuất
Low-Power Portable Test Equipment
The 10M40SCE144C8G serves portable test equipment because its instant-on non-volatile configuration eliminates boot delays when the user powers the handheld instrument on. The 40K logic elements handle signal-generation logic, protocol decoding, and LCD-driving interfaces. The integrated 12-bit ADC captures sensor or DUT analog signals without an external converter, reducing BOM and battery drain. Per Intel MAX 10 datasheet, the device supports sleep modes that retain configuration, allowing portable meters to wake on button-press and resume operation in microseconds. Trade-off: battery life depends on switching activity; the MAX 10 family typically draws more quiescent power than CPLDs in idle states.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10M40SCE144C8G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10M40SCE144A7G | 10M40SCE144I7G | 10M40SAE144C8G | 10M25SCE144C8G |
|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Speed Grade | C8 | A7 (slower) | I7 | C8 (same) | C8 (same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | Automotive AEC-Q100 | 0C to +85C |
| Integrated ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes |
Bảo phân biệt quan trọng
- Non-volatile on-chip configuration eliminates external boot PROM (vsXilinx Spartan-6 (requires external configuration flash))
- Integrated dual 12-bit SAR ADC with up to 17 analog inputs (vsLattice ECP5 (no integrated ADC))
- Hard LPDDR2/DDR2/DDR3 memory controller (vsMicrochip PolarFire (requires soft memory controller))
- Pin-to-pin compatibility across commercial, industrial, and automotive grades (vsXilinx 7-series (different package per temp grade))
Ghi chú thiết kế
Estimated: The 144-EQFP package has a junction-to-ambient thermal resistance of approximately 22 C/W with the exposed pad soldered to a 1 in² copper pour on a 4-layer PCB (per Intel MAX 10 thermal guidelines). For continuous switching activity at 40K LE utilization, the junction temperature rise at ambient 25°C is roughly 25-35°C depending on toggle rate. The exposed pad (pin 144) MUST be soldered to the PCB ground pour for proper thermal dissipation; leaving it unsoldered increases theta_JA by ~50% and risks thermal-induced timing failures.
Per Intel MAX 10 datasheet, the 10M40SCE144C8G requires multiple supply rails: VCC (core, typically 1.2V), VCCA (analog/pll, 2.5V), VCCIOx (per I/O bank, 1.2V-3.3V), and VCCD_PLL (PLL digital, 1.2V). Each VCCIO bank can be independently set to support mixed-voltage interfaces. Place 0.1µF decoupling capacitors within 3mm of every VCC/VCCIO/VCCA pin and a 10µF bulk capacitor near each supply rail. Add ferrite beads between analog VCCA and digital VCC to minimize ADC noise coupling.
The 144-EQFP has a 0.5mm pitch and exposed thermal pad. Per Intel layout guidelines, use 4-layer PCB with continuous ground plane beneath the FPGA; route all high-speed signals on inner layers with reference to ground. JTAG chain (TCK, TMS, TDI, TDO) requires 4.7kΩ pull-ups on TMS and TDI. The nSTATUS and CONF_DONE signals are open-drain and require external 10kΩ pull-ups to VCCIO. Daisy-chain JTAG when multiple devices are present on the board.
Do not leave unused I/O pins floating in the design - explicitly configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus pin assignment. Floating inputs can draw excess current and cause oscillations. When using the integrated ADC, ensure analog inputs are properly anti-aliased with RC filters (typically 100Ω + 1nF) before connecting to ADCIN pins. Avoid routing noisy digital signals near analog traces to preserve ADC SNR.
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page. AEC-Q100 not qualified on this part number - select the 10M40SAE144C8G for automotive. Halogen-free status not confirmed in verified data.
