10M40SCE144C8G - MAX 10 FPGA 40K LE 144-EQFP | Intel / Altera
부품 번호: 10M40SCE144C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $59.13 | $59.13 |
| 10 | $56.2 | $562.00 |
| 100 | $51.45 | $5,145.00 |
| 500 | $47.1 | $23,550.00 |
| 1,000 | $43.2 | $43,200.00 |
10M40SCE144C8G 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as memory, multipliers, transceivers, and PHYs. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, glue functions, custom peripherals, or full processor subsystems, which makes them ideal for low-to-medium volume designs, prototyping, and field-upgradable products.
Key specifications of the 10M40SCE144C8G include 40K logic elements, 1.29 Mbit user flash, integrated dual 12-bit ADCs with up to 17 analog inputs, and a hard DDR3 memory interface supporting LPDDR2/DDR2/DDR3. The MAX 10 family integrates a flash configuration memory on-chip, eliminating the need for external boot PROMs and enabling instant-on functionality within milliseconds of power-up. The 144-EQFP exposed-pad package supports industrial-grade thermal performance with a junction-to-ambient resistance suitable for fan-less embedded systems.
Typical applications include industrial motor control and machine vision, automotive driver assistance, factory automation, video bridging and display controllers, IoT edge nodes, and low-power portable designs. The integrated ADC makes the MAX 10 particularly attractive for sensor aggregation boards where an external ADC would otherwise be required. When designing with this device, ensure the exposed pad is soldered to a sufficient copper pour (typically 1 in² minimum) to meet the package's thermal resistance specification and avoid thermal throttling under sustained switching activity.
드롭인 대체품: 10M40SCE144C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M40SCE144C8G (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Package, Speed Grade, Integrated ADC, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M40SCE144A7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$57.21 / 개
데이터시트 보기 →10M40SCE144I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$43.85 / 개
데이터시트 보기 →10M40SAE144C8G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195.85 / 개
데이터시트 보기 →10M40SAE144I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$57.1 / 개
데이터시트 보기 →10M25SCE144C8G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M40SCE144C8G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User I/O Count | 101 |
| Package Type | 144-LQFP Exposed Pad (EQFP-144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0°C to +85°C (commercial) |
| Speed Grade | C8 |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Integrated ADC | Dual 12-bit SAR, up to 17 analog inputs |
| Hard Memory Controller | LPDDR2, DDR2, DDR3 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10M40SCE144C8G 핀 구성
| 핀 1 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 2 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 3 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 4 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 5 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 6 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 7 | VCCIO1B — I/O supply voltage Bank 1B |
| 핀 8 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 9 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 10 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 13 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 14 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 15 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 16 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 17 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 18 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 19 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 20 | VCCIO1B — I/O supply voltage Bank 1B |
| 핀 21 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 22 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 23 | GND — Ground |
| 핀 24 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 25 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 26 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 27 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 28 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 29 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 30 | I/O — General-purpose user I/O (Bank 1B) |
| 핀 31 | VCCIO1A — I/O supply voltage Bank 1A |
| 핀 32 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 33 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 34 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 37 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 38 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 39 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 40 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 41 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 42 | VCC — Core supply voltage |
| 핀 43 | I/O — General-purpose user I/O (Bank 2) |
| 핀 44 | I/O — General-purpose user I/O (Bank 2) |
| 핀 45 | I/O — General-purpose user I/O (Bank 2) |
| 핀 46 | GND — Ground |
| 핀 47 | I/O — General-purpose user I/O (Bank 2) |
| 핀 48 | I/O — General-purpose user I/O (Bank 2) |
| 핀 49 | I/O — General-purpose user I/O (Bank 2) |
| 핀 50 | I/O — General-purpose user I/O (Bank 2) |
| 핀 51 | I/O — General-purpose user I/O (Bank 2) |
| 핀 52 | VCCIO2 — I/O supply voltage Bank 2 |
| 핀 53 | I/O — General-purpose user I/O (Bank 2) |
| 핀 54 | I/O — General-purpose user I/O (Bank 2) |
| 핀 55 | GND — Ground |
| 핀 56 | I/O — General-purpose user I/O (Bank 2) |
| 핀 57 | I/O — General-purpose user I/O (Bank 2) |
| 핀 58 | I/O — General-purpose user I/O (Bank 2) |
| 핀 59 | I/O — General-purpose user I/O (Bank 3) |
| 핀 60 | VCCIO3 — I/O supply voltage Bank 3 |
| 핀 61 | I/O — General-purpose user I/O (Bank 3) |
| 핀 62 | I/O — General-purpose user I/O (Bank 3) |
| 핀 63 | I/O — General-purpose user I/O (Bank 3) |
| 핀 64 | I/O — General-purpose user I/O (Bank 3) |
| 핀 65 | GND — Ground |
| 핀 66 | I/O — General-purpose user I/O (Bank 3) |
| 핀 67 | I/O — General-purpose user I/O (Bank 3) |
| 핀 68 | VCC — Core supply voltage |
| 핀 69 | I/O — General-purpose user I/O (Bank 4) |
| 핀 70 | I/O — General-purpose user I/O (Bank 4) |
| 핀 71 | I/O — General-purpose user I/O (Bank 4) |
| 핀 72 | I/O — General-purpose user I/O (Bank 4) |
| 핀 73 | I/O — General-purpose user I/O (Bank 4) |
| 핀 74 | VCCIO4 — I/O supply voltage Bank 4 |
| 핀 75 | I/O — General-purpose user I/O (Bank 4) |
| 핀 76 | I/O — General-purpose user I/O (Bank 4) |
| 핀 77 | I/O — General-purpose user I/O (Bank 4) |
| 핀 78 | I/O — General-purpose user I/O (Bank 4) |
| 핀 79 | GND — Ground |
| 핀 80 | I/O — General-purpose user I/O (Bank 4) |
| 핀 81 | I/O — General-purpose user I/O (Bank 4) |
| 핀 82 | I/O — General-purpose user I/O (Bank 5) |
| 핀 83 | VCCIO5 — I/O supply voltage Bank 5 |
| 핀 84 | I/O — General-purpose user I/O (Bank 5) |
| 핀 85 | I/O — General-purpose user I/O (Bank 5) |
| 핀 86 | I/O — General-purpose user I/O (Bank 5) |
| 핀 87 | I/O — General-purpose user I/O (Bank 5) |
| 핀 88 | I/O — General-purpose user I/O (Bank 5) |
| 핀 89 | GND — Ground |
| 핀 90 | VCC — Core supply voltage |
| 핀 91 | I/O — General-purpose user I/O (Bank 6) |
| 핀 92 | I/O — General-purpose user I/O (Bank 6) |
| 핀 93 | I/O — General-purpose user I/O (Bank 6) |
| 핀 94 | VCCIO6 — I/O supply voltage Bank 6 |
| 핀 95 | I/O — General-purpose user I/O (Bank 6) |
| 핀 96 | I/O — General-purpose user I/O (Bank 6) |
| 핀 97 | I/O — General-purpose user I/O (Bank 6) |
| 핀 98 | I/O — General-purpose user I/O (Bank 6) |
| 핀 99 | GND — Ground |
| 핀 100 | I/O — General-purpose user I/O (Bank 7) |
| 핀 101 | I/O — General-purpose user I/O (Bank 7) |
| 핀 102 | VCCIO7 — I/O supply voltage Bank 7 |
| 핀 103 | I/O — General-purpose user I/O (Bank 7) |
| 핀 104 | I/O — General-purpose user I/O (Bank 7) |
| 핀 105 | I/O — General-purpose user I/O (Bank 7) |
| 핀 106 | I/O — General-purpose user I/O (Bank 7) |
| 핀 107 | VCC — Core supply voltage |
| 핀 108 | I/O — General-purpose user I/O (Bank 8) |
| 핀 109 | I/O — General-purpose user I/O (Bank 8) |
| 핀 110 | GND — Ground |
| 핀 111 | I/O — General-purpose user I/O (Bank 8) |
| 핀 112 | I/O — General-purpose user I/O (Bank 8) |
| 핀 113 | VCCIO8 — I/O supply voltage Bank 8 |
| 핀 114 | I/O — General-purpose user I/O (Bank 8) |
| 핀 115 | I/O — General-purpose user I/O (Bank 8) |
| 핀 116 | I/O — General-purpose user I/O (Bank 8) |
| 핀 117 | I/O — General-purpose user I/O (Bank 8) |
| 핀 118 | I/O — General-purpose user I/O (Bank 8) |
| 핀 119 | GND — Ground |
| 핀 120 | nSTATUS — Configuration status (open-drain) |
| 핀 121 | TCK — JTAG test clock |
| 핀 122 | TMS — JTAG test mode select |
| 핀 123 | TDI — JTAG test data in |
| 핀 124 | TDO — JTAG test data out |
| 핀 125 | nCONFIG — Configuration control (active-low) |
| 핀 126 | CONF_DONE — Configuration done (open-drain) |
| 핀 127 | DCLK — Configuration clock |
| 핀 128 | DATA0 — Configuration data input |
| 핀 129 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 130 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 131 | VCC — Core supply voltage |
| 핀 132 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 133 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 134 | GND — Ground |
| 핀 135 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 136 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 137 | VCCIO1A — I/O supply voltage Bank 1A |
| 핀 138 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 139 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 140 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 141 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 142 | GND — Ground |
| 핀 143 | I/O — General-purpose user I/O (Bank 1A) |
| 핀 144 | EPAD — Exposed thermal pad (must be soldered to ground pour) |
일반적인 애플리케이션
10M40SCE144C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Machine Vision and Video Bridging, IoT Edge Sensor Aggregation, Automotive Driver Assistance, Display Controller and Video Wall, Low-Power Portable Test Equipment.
Industrial Motor Control
The 10M40SCE144C8G fits industrial motor control applications because its 40,000 logic elements, 101 user I/O pins, and integrated dual 12-bit ADC eliminate the need for a separate motor-control MCU plus ADC chip. The on-chip flash configuration enables instant-on startup critical for safety-rated servo drives. With the hard LPDDR2/DDR2/DDR3 controller, designers can connect external motion-controller memory without soft-IP overhead. The 144-EQFP package exposes 101 I/O pins suitable for connecting Hall sensors, quadrature encoders, PWM outputs to gate drivers, and SPI/I2C peripherals. Per Intel MAX 10 datasheet, the device supports industrial protocols such as EtherCAT, PROFIBUS, and CAN via soft IP. Trade-off: at 40K LEs the part may not fit full servo-loop implementations requiring more DSP blocks; consider Cyclone IV/V for >50K LE designs.
추천
Machine Vision and Video Bridging
The 10M40SCE144C8G is suited to machine vision and video bridging because its on-chip logic capacity can host soft MIPI CSI-2, LVDS, or parallel video receivers, while 101 user I/O pins handle image-sensor data buses plus display-side LVDS or CMOS outputs. The integrated 12-bit ADC samples illumination sensors for ambient-light feedback in camera modules. Per Intel MAX 10 datasheet, the device's hard memory controller supports DDR3 buffering for frame storage in mid-resolution inspection cameras. The non-volatile configuration simplifies factory calibration since calibration data can be stored in the user flash region of the part. Trade-off: high-resolution (>1080p) video pipelines exceed 40K LEs; for those workloads the Cyclone V or MAX 10 50K-LE parts are better choices.
추천
IoT Edge Sensor Aggregation
The 10M40SCE144C8G suits IoT edge sensor aggregation because the integrated dual 12-bit SAR ADC accepts up to 17 analog inputs directly from temperature, pressure, and current sensors, eliminating an external ADC. The non-volatile flash configuration ensures the gateway reboots reliably after power-cycle events common in battery-powered IoT nodes. With 101 I/O pins, the part can aggregate SPI, I2C, UART, and GPIO signals from multiple sensor daughter-boards and pre-process them in fabric before forwarding to a backhaul MCU. Per Intel documentation, the MAX 10 family supports low-power modes including a sleep state that retains configuration. Trade-off: the 144-EQFP package is larger than BGA alternatives; for space-constrained IoT nodes the 256-ball BGA MAX 10 variants are smaller.
추천
Automotive Driver Assistance
The 10M40SCE144C8G fits automotive driver-assistance subsystems such as rear-camera controllers, sensor-fusion pre-processors, and LED headlight drivers because its 101 I/O pins accommodate multiple LVDS video streams plus LIN/CAN connectivity. Per Intel MAX 10 datasheet, the device offers instant-on capability critical for rear-view cameras that must display within milliseconds of reverse-gear engagement. The hard DDR3 controller buffers frame data from the image sensor. For AEC-Q100 qualified designs, the 10M40SAE144C8G automotive variant provides the same 144-EQFP footprint with automotive-grade temperature and qualification. Trade-off: for full image-processing pipelines the 40K LEs may be tight; Cyclone V or Arria 10 devices provide more DSP and logic for vision processing.
추천
Display Controller and Video Wall
The 10M40SCE144C8G is well-matched to display controllers and small video walls because its 101 user I/O pins can drive multiple TTL/LVDS display interfaces plus a parallel RGB or HDMI bridge. The 1,290,240-bit embedded SRAM holds frame-buffer lines, and the hard DDR3 controller supports external SDRAM for full-frame buffering. Per Intel MAX 10 documentation, the device supports common display protocols like DPI, LVDS, and OpenLDI via soft IP. The 144-EQFP package is hand-solder-friendly, simplifying prototype rework on display evaluation boards. Trade-off: video-wall systems >4 displays exceed 40K LEs; Cyclone V GX/GT parts offer transceivers for higher-bandwidth video aggregation.
추천
Low-Power Portable Test Equipment
The 10M40SCE144C8G serves portable test equipment because its instant-on non-volatile configuration eliminates boot delays when the user powers the handheld instrument on. The 40K logic elements handle signal-generation logic, protocol decoding, and LCD-driving interfaces. The integrated 12-bit ADC captures sensor or DUT analog signals without an external converter, reducing BOM and battery drain. Per Intel MAX 10 datasheet, the device supports sleep modes that retain configuration, allowing portable meters to wake on button-press and resume operation in microseconds. Trade-off: battery life depends on switching activity; the MAX 10 family typically draws more quiescent power than CPLDs in idle states.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M40SCE144C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M40SCE144A7G | 10M40SCE144I7G | 10M40SAE144C8G | 10M25SCE144C8G |
|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Speed Grade | C8 | A7 (slower) | I7 | C8 (same) | C8 (same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | Automotive AEC-Q100 | 0C to +85C |
| Integrated ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes |
주요 차별점
- Non-volatile on-chip configuration eliminates external boot PROM (vs Xilinx Spartan-6 (requires external configuration flash))
- Integrated dual 12-bit SAR ADC with up to 17 analog inputs (vs Lattice ECP5 (no integrated ADC))
- Hard LPDDR2/DDR2/DDR3 memory controller (vs Microchip PolarFire (requires soft memory controller))
- Pin-to-pin compatibility across commercial, industrial, and automotive grades (vs Xilinx 7-series (different package per temp grade))
설계 노트
Estimated: The 144-EQFP package has a junction-to-ambient thermal resistance of approximately 22 C/W with the exposed pad soldered to a 1 in² copper pour on a 4-layer PCB (per Intel MAX 10 thermal guidelines). For continuous switching activity at 40K LE utilization, the junction temperature rise at ambient 25°C is roughly 25-35°C depending on toggle rate. The exposed pad (pin 144) MUST be soldered to the PCB ground pour for proper thermal dissipation; leaving it unsoldered increases theta_JA by ~50% and risks thermal-induced timing failures.
Per Intel MAX 10 datasheet, the 10M40SCE144C8G requires multiple supply rails: VCC (core, typically 1.2V), VCCA (analog/pll, 2.5V), VCCIOx (per I/O bank, 1.2V-3.3V), and VCCD_PLL (PLL digital, 1.2V). Each VCCIO bank can be independently set to support mixed-voltage interfaces. Place 0.1µF decoupling capacitors within 3mm of every VCC/VCCIO/VCCA pin and a 10µF bulk capacitor near each supply rail. Add ferrite beads between analog VCCA and digital VCC to minimize ADC noise coupling.
The 144-EQFP has a 0.5mm pitch and exposed thermal pad. Per Intel layout guidelines, use 4-layer PCB with continuous ground plane beneath the FPGA; route all high-speed signals on inner layers with reference to ground. JTAG chain (TCK, TMS, TDI, TDO) requires 4.7kΩ pull-ups on TMS and TDI. The nSTATUS and CONF_DONE signals are open-drain and require external 10kΩ pull-ups to VCCIO. Daisy-chain JTAG when multiple devices are present on the board.
Do not leave unused I/O pins floating in the design - explicitly configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus pin assignment. Floating inputs can draw excess current and cause oscillations. When using the integrated ADC, ensure analog inputs are properly anti-aliased with RC filters (typically 100Ω + 1nF) before connecting to ADCIN pins. Avoid routing noisy digital signals near analog traces to preserve ADC SNR.
규정 준수 정보
RoHS compliant per Altera/Intel product page. AEC-Q100 not qualified on this part number - select the 10M40SAE144C8G for automotive. Halogen-free status not confirmed in verified data.
