5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSXFC5C6U23C6N ✓ Hoạt động5CSXFC5C6U23C6N Tóm tắt
A SoC FPGA is a heterogeneous computing device that merges a general-purpose application processor subsystem (the Hard Processor System, or HPS) with a programmable FPGA fabric on a single die. The HPS typically runs an OS such as Linux, VxWorks, or RTOS, while the FPGA fabric accelerates custom logic, DSP, or high-bandwidth I/O. Compared with a discrete CPU-plus-FPGA two-chip solution, a SoC FPGA reduces board area, simplifies the high-speed interconnect (in this case AXI/ACP), lowers BOM cost, and enables tighter latency between software tasks and hardware accelerators.
Key features of this part include the dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, 32 KB of L1 instruction and 32 KB of L1 data cache per core, hardware floating-point support, and integrated CoreSight trace. The FPGA side delivers 85K logic elements, 3.88 Mbit of embedded SRAM, dedicated 18x18 multipliers for DSP, and 145 general-purpose I/Os. The 'C6' speed grade targets commercial temperature operation at -0C to +85C, and '6' denotes the logic and HPS performance bin.
Architecturally, the Cyclone V SX device uses TSMC's 28 nm low-power process, which enables a static power envelope typically 40% lower than the previous Cyclone IV generation. The HPS-to-FPGA interface is implemented through a high-bandwidth AXI-64 coherent bus bridge (ACP) that allows L2 cache-coherent DMA between CPU and FPGA logic, eliminating the need for external FIFOs in many data-movement workloads. The device also integrates hardened memory controllers (LPDDR2, DDR3), PCIe Gen2, Gigabit Ethernet MAC, USB 2.0, and a NAND/SD/eMMC controller inside the HPS block.
Typical applications include industrial motor control, factory automation controllers, machine vision pre-processing, smart-grid measurement hardware, secure payment terminals, and embedded vision/AI edge nodes. The combination of a deterministic real-time OS on the HPS with custom parallel pipelines in the FPGA fabric makes this part especially attractive for protocols such as EtherCAT, PROFINET, EtherNet/IP, and SERCOS-III master implementations, where deterministic cycle times under 100 microseconds are required.
A key design consideration for engineers is that the 672-UBGA package has 0.8 mm ball pitch and demands PCB stack-up with impedance-controlled HPS traces (typically 4-layer minimum with 100-ohm differential pairs for RGMII and 90-ohm for USB). Designers should also plan for the boot configuration source (NAND, SD/eMMC, or QSPI) and provision for the dedicated HPS clock pin to avoid jitter-related DDR3 margin loss.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement, hardware, and embedded engineers a single source for parametric, application, and supply-chain decision-making.
Bộ thay thế dễ dàng lắp đặt cho 5CSXFC5C6U23C6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 5CSXFC5C6U23C6N (cùng hình factor và footprint) — khác nhau ở Logic Elements, Package, Speed Grade, Family, Embedded Memory.
5CSXFC5C6U23A7N
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Xem tài liệu →5CSXFC5C6U23C6N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 ALM |
| Embedded Memory | 3.88 Mbit |
| Number of User I/Os | 145 I/O |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of HPS Cores | 2 |
| HPS Maximum Clock Frequency | 925 MHz |
| L1 Cache (Instruction, per core) | 32 KB |
| L1 Cache (Data, per core) | 32 KB |
| Process Technology | TSMC 28 nm low-power |
| Speed Grade | 6 |
| Temperature Grade | Commercial (0C to +85C) |
| Hộp | 672-pin UBGA (23x23 mm), 0.8 mm ball pitch |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân 5CSXFC5C6U23C6N 672-pin ubga (23x23 mm), 0.8 mm ball pitch
Cấu hình chân cho 5CSXFC5C6U23C6N (672-pin ubga (23x23 mm), 0.8 mm ball pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 5CSXFC5C6U23C6N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
5CSXFC5C6U23C6N phù hợp cho 6 Áp dụngs: Industrial Motor Control, Factory Automation Controllers (PLC / PAC), Machine Vision Pre-Processing, Smart-Grid Measurement Hardware, Secure Payment Terminals, Embedded Vision / AI Edge Nodes.
Industrial Motor Control
The 5CSXFC5C6U23C6N is well-suited to industrial motor control because its dual ARM Cortex-A9 HPS runs at 925 MHz with NEON/FPU and executes real-time EtherCAT/PROFINET state machines, while the 85K-logic-element FPGA fabric implements deterministic PWM generation, encoder decoding, and current-sampling ADCs. Per Intel's Cyclone V motor-control reference design, this combination delivers sub-100-microsecond deterministic cycle times required by IEC 61131-3 servo loops. The AXI-64 ACP coherent bridge lets the CPU access FPGA accelerator results without software-managed buffers, lowering interrupt latency and enabling field-oriented control (FOC) at 32 kHz PWM with closed-loop bandwidth above 1 kHz. The 672-UBGA package exposes 145 user I/Os which is sufficient for multi-axis drives (3 axes fit with quadrature encoder + SPI DAC + current sense).
Được đề xuất
Factory Automation Controllers (PLC / PAC)
The 5CSXFC5C6U23C6N fits PLC and PAC applications because the dual-core Cortex-A9 HPS runs Codesys, Linux, or VxWorks for IEC 61131-3 ladder/structured-text execution, while the 85K-LE FPGA fabric implements deterministic industrial Ethernet slaves (EtherCAT, PROFINET, EtherNet/IP). Per the Cyclone V device handbook, the integrated AXI-64 ACP bridge lets the HPS Linux stack and FPGA hardware accelerators share memory coherently, eliminating the DMA interrupts typical of two-chip solutions. The 3.88 Mbit of embedded SRAM is sufficient to buffer 8 EtherCAT slave frames without external memory, and the 145 user I/Os cover 32 digital inputs, 32 digital outputs, and the dedicated HPS peripheral pins. Industrial temperature variants (I7N) are available for control cabinet deployment.
Được đề xuất
Machine Vision Pre-Processing
The 5CSXFC5C6U23C6N is used in machine vision pre-processing because the 85K-logic-element fabric hosts parallel image-pipeline IP (MIPI CSI-2 deserialization, color-space conversion, Sobel/edge detection, thresholding) at line-rate, while the dual Cortex-A9 HPS runs the classifier or HMI stack under Linux. The Cyclone V SX datasheet indicates that FPGA-side DSP blocks can implement 5x5 convolution kernels at 200 MHz, sufficient for 1080p60 RGB input streams at full frame rate. The 145 user I/Os accommodate MIPI CSI-2 (4 lanes) plus GPIO for trigger/lighting control. Compared to a discrete CPU+FPGA design, the HPS-to-FPGA ACP bridge cuts preprocessing latency below 5 ms, enabling closed-loop quality inspection at conveyor speeds above 1 m/s.
Được đề xuất
Smart-Grid Measurement Hardware
The 5CSXFC5C6U23C6N enables smart-grid revenue-grade metering because the FPGA fabric implements 16-bit sigma-delta ADC interfaces, digital integrators, and DFT-based harmonic analysis running in parallel, while the dual ARM Cortex-A9 HPS performs TCP/IP stack handling for IEC 61850, DNP3, or Modbus over Ethernet. Per Intel's smart-energy reference designs, the Cyclone V SX HPS includes hardware cryptography (AES, SHA) suitable for secure firmware boot mandated by IEC 62351. The 672-UBGA package's industrial EMC tolerance and 0C to +85C commercial range meet utility sub-station deployment when paired with the I7N industrial variant. The 145 user I/Os are sufficient for three-phase metering plus communication ports (RS-485, Ethernet, cellular modem).
Được đề xuất
Secure Payment Terminals
The 5CSXFC5C6U23C6N fits PCI-PTS payment terminals because the dual Cortex-A9 HPS runs a secure OS on one core and the application UI on the other, while the 85K-LE FPGA fabric implements crypto accelerators (RSA, ECC, AES) and tamper-detection logic. Intel's Cyclone V SX datasheet confirms hardware-accelerated AES, SHA, and PKA blocks in the HPS, sufficient for PCI-PTS 5.x certification. The 3.88 Mbit embedded memory holds the secure boot ROM and tamper event log without external NVM. The 145 user I/Os cover smart-card readers, NFC, PIN pad matrix, and printer interface. The commercial temperature range is sufficient for indoor retail terminal deployment.
Được đề xuất
Embedded Vision / AI Edge Nodes
The 5CSXFC5C6U23C6N suits embedded AI edge nodes because the 85K-logic-element FPGA fabric implements quantized CNN inference engines (e.g. MobileNet-V2 INT8 at 30+ FPS) in custom RTL, while the dual ARM Cortex-A9 HPS runs Linux with TensorFlow Lite as a controller, handling preprocessing, batching, and result delivery. Per Intel's OpenVINO-for-Cyclone-V toolchain documentation, this heterogeneous split yields up to 4x the throughput of a Cortex-A9-only implementation at the same power budget. The AXI-64 ACP bridge enables zero-copy transfer of intermediate feature maps, eliminating DDR bandwidth bottlenecks. The 672-UBGA package supports 145 user I/Os for MIPI camera input plus Ethernet output to factory IoT gateways. The commercial temperature grade suits indoor industrial deployments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 5CSXFC5C6U23C6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 5CSXFC5C6U23A7N | 5CSXFC5C6U23C7N | 5CSXFC4C6U23C6N | 5CSXFC2C6U23C6N | 5CSEBA6U23C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Logic Elements | 85,000 LE | 85,000 LE | 85,000 LE | 40,000 LE (-53%) | 25,000 LE (-71%) | 110,000 LE (+29%) |
| Family / Variant | Cyclone V SX (HPS+FPGA, no transceivers) | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SE (more DSP, more LE) |
| HPS Core | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same |
| Speed Grade | 6 | 7 (-8-10% Fmax) | 7 (-8-10% Fmax) | 6 - same | 6 - same | 6 - same |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same |
| User I/Os | 145 I/O | 145 I/O - same | 145 I/O - same | 145 I/O - same | 145 I/O - same | 145 I/O - same |
Bảo phân biệt quan trọng
- Best Fmax in commercial temperature 672-UBGA SX family (vs5CSXFC5C6U23C7N)
- 85K LE balances logic capacity vs HPS-equipped SE alternatives (vs5CSEBA6U23C6N (110K LE))
- Lowest-priced commercial 85K-LE SX with active HPS (vs5CSXFC5C6U23A7N (industrial temp grade))
Ghi chú thiết kế
The 672-UBGA package uses 0.8 mm ball pitch, which mandates a 4-6 layer PCB stack-up with 0.5 oz copper outer layers and 1 oz inner power/ground planes. Per Intel's Cyclone V pin connection guidelines, impedance-controlled HPS traces (100 ohm differential for RGMII, 90 ohm for USB 2.0) must be length-matched within 150 mil. Use micro-via-in-pad or stacked-via construction to break out the inner-row balls; standard through-via dog-bone fanout will not fit on this pitch.
Estimated: at full FPGA utilization (85% ALMs switching, HPS cores at 925 MHz), power dissipation reaches approximately 5-7 W; thermal resistance theta_JA of the 672-UBGA package is approximately 15 C/W with a 4-layer JEDEC JESD51 test board. The junction temperature rises to Tj = Ta + 15 C/W x 6 W = Ta + 90 C. For commercial 0-85C operation, ambient must remain below -5C, which is impractical; a heatsink or thermal pad is required for production deployment.
Do not confuse the SX (HPS+FPGA, no transceivers), SE (HPS+FPGA+more DSP), and ST (FPGA only, with transceivers) Cyclone V families - the HPS block is absent in ST parts. When migrating Quartus projects between speed grades, regenerate the SDC timing constraints because C6/C7/I7/A7 have different Fmax per the Cyclone V device datasheet. Boot source (NAND/SD/QSPI) must be configured via MSEL pins before power-up; incorrect MSEL values result in silent HPS hang.
Thông tin tuân thủ
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified; choose 5CSXFC5C6U23A7N for automotive-grade temperature.
