AT91SAM9260B-CU - ARM926EJ-S MCU 180MHz 217-LFBGA | Microchip
MPN: AT91SAM9260B-CU ⚠ Lần mua cuốiAT91SAM9260B-CU Tóm tắt
Key features include Full-Speed USB Host and Device ports, a 10/100 Ethernet MAC with RMII/MII interface, an image sensor interface (ISI), a MultiMedia Card Interface (MCI), I2S audio, three USARTs, two UARTs, SPI, TWI (I2C), Timer Counters, a Synchronous Serial Controller (SSC), and an ADC. The 6-layer matrix bus architecture provides high internal bandwidth, which makes the part suitable for multimedia, image-capture, and connected-embedded applications. The 'B' silicon revision improves upon the original AT91SAM9260 with errata fixes and refined peripheral behavior.
The AT91SAM9260 family occupies the ARM9-based MPU segment of the Microchip SAM9 portfolio. As an ARM926EJ-S device with a memory management unit (MMU), it runs full operating systems such as Linux, WinCE, and MQX. Compared to Cortex-M microcontrollers, it offers higher compute throughput, richer connectivity peripherals, and OS support at the cost of higher power and a more complex toolchain.
Typical applications include human-machine interfaces (HMIs), industrial control panels, image-capture and machine-vision front-ends, networked point-of-sale terminals, building automation gateways, and low-cost Ethernet/USB-connected embedded nodes where an MMU-capable SoC is required.
When designing with this device, ensure the LFBGA-217 layout uses the manufacturer-recommended 8-layer PCB stack-up, a 12 MHz or similar main oscillator, and a regulated 1.8V core / 3.3V I/O supply pair to satisfy the SAM9260 power-domain requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-grade source.
Bộ thay thế dễ dàng lắp đặt cho AT91SAM9260B-CU — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với AT91SAM9260B-CU (cùng hình factor và footprint) — khác nhau ở Core Architecture, Ethernet, Package, Mounting Type, Operating Temperature.
AT91SAM9260-CU
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
AT91SAM9260B-CU-999
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
AT91SAM9260B-QU
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
AT91SAM9G20B-CU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →AT91SAM9260A-CU
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
AT91SAM9260B-CU Tỷ lệ tối đa & tính chất điện
| Core Architecture | ARM926EJ-S (ARM9) |
| Core Count | 1 |
| Bề rộng đường dữ liệu | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| ROM Size | 32 KB |
| SRAM Size | 8 KB |
| External Memory Bus | 16-bit EBI (SDRAM, NAND Flash, NOR Flash) |
| Hộp | 217-ball LFBGA (15x15 mm) |
| Kiểu lắp đặt | Surface Mount |
| Supply Voltage - Core | 1.65 V to 1.95 V (typ. 1.8 V) |
| Supply Voltage - I/O | 3.0 V to 3.6 V (typ. 3.3 V) |
| USB Interface | 1x USB 2.0 Full-Speed Host + 1x USB 2.0 Full-Speed Device |
| Ethernet | 10/100 Mbps MAC with RMII/MII |
| Image Sensor Interface (ISI) | Yes |
| Nhiệt độ hoạt động | -40C to +85C (industrial) |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 |
| Peripherals | MCI, I2S, 3x USART, 2x UART, SPI, TWI, SSC, ADC, Timer Counters |
Cấu hình chân AT91SAM9260B-CU
| Chân A1 | VDDIO — 3.3V I/O supply |
| Chân B2 | VDDCORE — 1.8V core supply |
| Chân C3 | GND — Ground |
| Chân D4 | XIN — Main oscillator input |
| Chân E5 | XOUT — Main oscillator output |
| Chân F6 | NRST — Reset input (active low) |
| Chân G7 | JTAG_TCK — JTAG test clock |
| Chân H8 | JTAG_TMS — JTAG test mode select |
| Chân J9 | JTAG_TDI — JTAG test data in |
| Chân K10 | JTAG_TDO — JTAG test data out |
| Chân L11 | USB_DP — USB D+ (device/host) |
| Chân M12 | USB_DM — USB D- (device/host) |
| Chân N13 | ETH_TX+ — Ethernet RMII/MII transmit positive |
| Chân P14 | ETH_TX- — Ethernet RMII/MII transmit negative |
Ứng dụng tiêu biểu
AT91SAM9260B-CU phù hợp cho 6 Áp dụngs: Human-Machine Interface (HMI) Panels, Industrial Control & Building Automation Gateways, Image-Capture and Machine-Vision Front-Ends, Networked Point-of-Sale Terminals, Low-Cost Ethernet-Connected Embedded Nodes, USB-Connected Data-Acquisition Devices.
Human-Machine Interface (HMI) Panels
The AT91SAM9260B-CU fits HMI panels because its ARM926EJ-S architecture with integrated MMU runs a Linux or WinCE graphics stack, while the on-chip LCD controller (LCDC) drives TFT panels up to WVGA. With 180 MHz of compute, 8 KB on-chip SRAM and a 16-bit external bus to SDRAM, the part handles multi-layer GUIs, touch input, and asset rendering at typical industrial frame rates. The 217-LFBGA package supports compact carrier-board layouts behind the display.
Được đề xuất
Industrial Control & Building Automation Gateways
The AT91SAM9260B-CU fits building-automation gateways because the integrated 10/100 Ethernet MAC and Full-Speed USB Host port let a single chip bridge Modbus, BACnet, or KNX over IP to local sensors and actuators. The 180 MHz ARM926EJ-S runs MQTT brokers or BACnet stacks under Linux, while the MCI and SPI peripherals support local SD-card data logging. The industrial -40C to +85C temperature range and 217-LFBGA package suit DIN-rail enclosure designs.
Được đề xuất
Image-Capture and Machine-Vision Front-Ends
The AT91SAM9260B-CU fits low-cost image-capture front-ends because the integrated Image Sensor Interface (ISI) accepts raw Bayer/RGB streams from CMOS sensors, and the 16-bit EBI feeds a bank of SDRAM for frame buffering. The 6-layer internal bus moves pixel data between the ISI, the LCDC, and the Ethernet MAC with low contention. Combined with the 180 MHz ARM926EJ-S core, it pre-processes VGA-class streams for networked machine-vision nodes.
Được đề xuất
Networked Point-of-Sale Terminals
The AT91SAM9260B-CU fits point-of-sale terminals that combine a touchscreen, a mag-stripe or smart-card reader, a thermal printer, and Ethernet or USB connectivity. The on-chip LCDC drives the operator display, the MCI supports SD-card storage of transactions, and the SSC / I2S peripherals link to audio prompt chips. Linux on the ARM926EJ-S provides the certified payment stack with cryptographic libraries, and the 217-LFBGA package fits compact terminal mainboards.
Được đề xuất
Low-Cost Ethernet-Connected Embedded Nodes
The AT91SAM9260B-CU fits Ethernet-connected embedded nodes such as remote sensor concentrators, HVAC controllers, or simple IoT gateways because the 10/100 MAC with RMII/MII interface attaches a standard PHY with no extra glue logic. The 180 MHz ARM926EJ-S runs lightweight Linux with TLS and MQTT clients. Multiple USARTs and SPIs expand to sensor buses, while the industrial temperature grade and 217-LFBGA package suit fanless embedded enclosures.
Được đề xuất
USB-Connected Data-Acquisition Devices
The AT91SAM9260B-CU fits USB-connected data-acquisition devices because the Full-Speed USB Device port presents a vendor-specific interface to a host PC while the ADC, Timer Counters, and USARTs digitize analog and serial sensor inputs. The 180 MHz ARM926EJ-S core buffers and timestamp samples in external SDRAM, and the MCI exports files to an SD card. The 217-LFBGA package keeps the PCB small enough for portable lab instruments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho AT91SAM9260B-CU — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | AT91SAM9260-CU | AT91SAM9260B-CU-999 | AT91SAM9260B-QU | AT91SAM9G20B-CU | AT91SAM9260A-CU |
|---|---|---|---|---|---|---|
| Package | 217-LFBGA (15x15 mm) | 217-LFBGA (15x15 mm) - same | 217-LFBGA (15x15 mm) - same | 208-QFP (28x28 mm) | 217-LFBGA (15x15 mm) - same | 217-LFBGA (15x15 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 210 MHz | 180 MHz |
| ROM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| SRAM Size | 8 KB | 8 KB | 8 KB | 8 KB | 16 KB | 8 KB |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Silicon Revision | 'B' (errata fixed) | Original (older errata list) | 'B' (errata fixed, tray code -999) | 'B' (errata fixed) | 9G20 family (different silicon) | 'A' revision (between original and B) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete (NRND) |
Bảo phân biệt quan trọng
- On-die MMU enables full Linux and WinCE BSPs (vsCortex-M microcontrollers)
- 6-layer internal bus architecture (vsSingle 32-bit bus peripherals)
- Integrated Image Sensor Interface (ISI) (vsMPUs without dedicated camera port)
Ghi chú thiết kế
Estimated: at typical 1.8V core draw of ~100 mA and 3.3V I/O draw of ~50 mA at 180 MHz, total dissipation is roughly 0.35 W. The 217-LFBGA package has a typical theta_JA around 25 C/W on a 4-layer JEDEC PCB, giving a 9 C junction rise above ambient. No heatsink is required, but adequate copper pour under the BGA is essential to spread heat across the inner ground plane.
Use an 8-layer PCB with dedicated 1.8V and 3.3V planes for the SAM9260 power domains. Place all decoupling capacitors within 2 mm of their respective power balls. Use a 0.8 mm pitch BGA land pattern with non-solder-mask-defined (NSMD) pads and micro-via-in-pad technology for the inner rows to ensure reliable reflow and rework access.
Power sequencing is critical on SAM9260: bring up the 1.8V core supply first, then the 3.3V I/O supply. Reverse or simultaneous ramp-up may latch the device or trigger undefined behavior. Also, the main 12 MHz (or 18.432 MHz) crystal must meet the datasheet ESR and series resistance limits - crystals outside the spec cause USB and Ethernet PHY timing failures.
Route the SDRAM address/command traces with matched lengths within the byte lanes, and isolate the Ethernet RMII/MII clock and data traces from switching power and analog ADC inputs. Keep the USB DP/DM pair as a 90-ohm differential with no stubs. Place the JTAG header on the board edge to enable post-assembly boundary-scan testing.
Thông tin tuân thủ
RoHS and halogen-free compliant per GlobalSpec cross-reference data. The part is in last-time-buy lifecycle with reported estimated EOL of 2023 - confirm current Microchip product change notifications for revised dates.
