Microchip Technology

DSPIC33CH512MP506-E/MR - 100MHz Dual-Core DSC, 512KB Flash | Microchip

MPN: DSPIC33CH512MP506-E/MR ✓ Hoạt động
3.0 V to 3.6 V Vdss 64-pin QFN (MR) 9x9 mm Package 100 MIPS (200 MHz) Speed 512 KB Memory
MOQ: 1 |

DSPIC33CH512MP506-E/MR Tóm tắt

The Microchip DSPIC33CH512MP506-E/MR is a high-performance 16-bit dual-core Digital Signal Controller (DSC) operating up to 100 MIPS per core, with 512 KB Flash and 64 KB PRAM in a 64-pin QFN (MR) 9x9 mm package. It combines two independent dsPIC33 DSC cores (a main core and a slave core) on a single die, enabling sophisticated real-time control and DSP workloads to be partitioned for deterministic execution. The device also includes high-resolution PWM (250ps resolution), CAN-FD, and dedicated motor-control peripherals, and is qualified to AEC-Q100 for automotive applications.

A Digital Signal Controller (DSC) is a hybrid microcontroller that integrates a DSP engine onto an MCU core; the dsPIC33CH family extends this with two cores on-chip. In the system hierarchy, the DSC sits between a microcontroller (MCU) and a digital signal processor (DSP), combining deterministic interrupt-driven control with hardware-accelerated math. The dual-core architecture places a fast slave core alongside the main core so time-critical tasks (current loops, commutation, housekeeping) can run independently of higher-level application code, simplifying firmware partitioning for advanced digital power conversion and field-oriented control (FOC) motor drives.

Key features include dual 100 MIPS 16-bit dsPIC DSC cores, 512 KB Flash, 64 KB PRAM, 16 KB RAM, 8-channel high-resolution PWM with 250 ps edge placement, two CAN-FD modules, multiple UART/SPI/I2C interfaces, 12-bit ADC at 3.5 Msps with up to 24 channels, and a 64-pin QFN package with extended -40C to +125C operating range. Functional Safety (FuSa) features support IEC 60730 Class B and automotive safety-integrity requirements, and the AEC-Q100 qualification allows deployment in safety-critical automotive ECUs.

The dual-core architecture allows the slave core to handle high-priority control loops while the main core runs communication, diagnostics, and application logic, reducing latency and jitter compared with single-core DSCs. On-chip high-resolution PWM and analog comparators support advanced topologies such as totem-pole PFC, LLC resonant converters, and multi-phase VRs, while CAN-FD and the peripheral set ease integration into vehicle body and powertrain networks.

Typical applications include digital switch-mode power supplies (SMPS), totem-pole PFC and LLC converters, field-oriented control (FOC) motor drives for automotive traction and industrial servo, on-board chargers (OBC) and DC-DC converters for EVs, solar inverters, and functional-safety industrial control. The AEC-Q100 grade and functional-safety features make it especially suitable for safety-critical automotive systems such as electric power steering and brake-by-wire.

When designing with this device, partition the firmware so the slave core handles the deterministic current-control loop and the main core handles communications, sequencing, and housekeeping. Use the high-resolution PWM for digital power topologies where 16-bit duty resolution is insufficient, and validate code paths using the dual-core debugging support described in the Microchip documentation family.

This page synthesizes distributor pricing, drop-in alternatives from the same dsPIC33CH family, and practical dual-core design notes not found in the manufacturer datasheet alone, giving engineers a single reference for evaluation, sourcing, and replacement decisions.

Bộ thay thế dễ dàng lắp đặt cho DSPIC33CH512MP506-E/MR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với DSPIC33CH512MP506-E/MR (cùng hình factor và footprint) — khác nhau ở Package, Core Architecture, ADC, High-Resolution PWM, Operating Temperature.

Microchip Technology
Package: TQFP-80 (PT) 12x12 mm
Core Architecture: dsPIC33CH dual-core 16-bit DSC
ADC: 12-bit, up to 3.5 MSPS
Microchip Technology
Package: 64-pin QFN with Exposed Pad (9x9 mm)
High-Resolution PWM: Yes (up to 16 channels, 1 ns duty-cycle resolution)
Operating Temperature: -40 °C to +125 °C (AEC-Q100 Grade 1)
Microchip Technology
Package: 64-pin TQFP (PT), 10x10 mm
Core Architecture: Dual-core 16-bit dsPIC DSC
ADC: Up to 4x 12-bit, 3.5 MSPS
Microchip Technology
Package: 64-pin QFN (9x9 mm)
Core Architecture: Dual-core 16-bit dsPIC33 DSC (master + slave)
ADC: 12-bit, up to 3.5 Msps

DSPIC33CH512MP506-I/MR

✅ Drop-In ⚠️ Thông số chưa được xác minh
Microchip Technology
📦 64-pin QFN (MR) 9x9 mm
Dual-core 16-bit dsPIC33 DSC (master + slave) · 100 MIPS (50 MHz) · 90 MIPS (45 MHz) · 512 KB dual-partition · 72 KB (including slave-core RAM) · 64-pin QFN (9x9 mm) · -40C to +85C (industrial) · 3.0 V to 3.6 V (core), 3.0 V to 5.5 V (I/O tolerant)

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DSPIC33CH512MP506-E/PT

✅ Drop-In
Microchip Technology
📦 64-pin TQFP (PT) 10x10 mm
dsPIC33CH · Dual-core 16-bit dsPIC DSC · 200 MHz · 180 MHz · 100 MIPS · 512 KB (584 kB total incl. dual-partition) · 64 KB (48 KB main + 16 KB slave) · 3.0 V to 3.6 V

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DSPIC33CH256MP506-I/PT

✅ Drop-In
📦 64-pin TQFP (PT) 10x10 mm
Flash 256 KB vs 512 KB (-50%); same dual-core DSC, no AEC-Q100 'E' grade

📋 Tham chiếu thay thế (không có trong danh mục)

DSPIC33CH256MP506-E/PT

✅ Drop-In
📦 64-pin TQFP (PT) 10x10 mm
Flash 256 KB vs 512 KB (-50%); AEC-Q100 grade retained, same dual-core DSC

📋 Tham chiếu thay thế (không có trong danh mục)

DSPIC33CH512MP508-E/PT

✅ Drop-In
📦 64-pin TQFP (PT) 10x10 mm
same 512 KB Flash and AEC-Q100 grade; '08' family adds extra analog; pin-compatible 64-pin TQFP

📋 Tham chiếu thay thế (không có trong danh mục)

DSPIC33CH256MP508-I/PT

✅ Drop-In
Microchip Technology
📦 64-pin TQFP (PT) 10x10 mm
dsPIC33CH dual-core 16-bit DSC · 100 MHz (100 MIPS) · 90 MIPS · 256 KB · 32 KB · 3.0 V to 3.6 V · 12-bit, up to 3.5 MSPS · 8

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DSPIC33CH512MP506-E/MR Tỷ lệ tối đa & tính chất điện

Product Type 16-bit Dual-Core Digital Signal Controller (DSC)
Core Architecture Dual dsPIC33 DSC cores (main + slave)
Maximum Core Speed (Main) 100 MIPS (200 MHz)
Maximum Core Speed (Slave) 90 MIPS (180 MHz)
Program Flash 512 KB
PRAM (Program RAM) 64 KB
Data RAM 16 KB
High-Resolution PWM Channels 8 channels (250 ps resolution)
CAN-FD Modules 2
ADC 12-bit, up to 3.5 Msps, up to 24 channels
Hộp 64-pin QFN (MR) 9x9 mm
Nhiệt độ hoạt động -40C to +125C (extended)
Điện áp cung cấp 3.0 V to 3.6 V
AEC-Q100 Qualification Qualified (automotive grade)
Functional Safety (FuSa) Supported (IEC 60730 Class B capable)
Kiểu lắp đặt Surface Mount
Trạng thái RoHS Compliant

Cấu hình chân DSPIC33CH512MP506-E/MR

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Chân 1 RE00 — Reference voltage / AN0
Chân 2 RE01 — AN1 / general I/O
Chân 3 VDD — Core supply (3.3 V)
Chân 4 VSS — Ground
Chân 5 PWM1H — High-resolution PWM output 1 high
Chân 6 PWM1L — High-resolution PWM output 1 low
Chân 7 PWM2H — High-resolution PWM output 2 high
Chân 8 PWM2L — High-resolution PWM output 2 low
Chân 9 PWM3H — High-resolution PWM output 3 high
Chân 10 PWM3L — High-resolution PWM output 3 low
Chân 11 PWM4H — High-resolution PWM output 4 high
Chân 12 PWM4L — High-resolution PWM output 4 low
Chân 13 VDD — I/O supply (3.3 V)
Chân 14 VSS — Ground
Chân 15 AN2/RA0 — Analog input / I/O
Chân 16 AN3/RA1 — Analog input / I/O
Chân 17 AN4/RB0 — Analog input / I/O
Chân 18 AN5/RB1 — Analog input / I/O
Chân 19 AN6/RB2 — Analog input / I/O
Chân 20 AN7/RB3 — Analog input / I/O
Chân 21 AN8/RB4 — Analog input / I/O
Chân 22 AN9/RB5 — Analog input / I/O
Chân 23 AN10/RB6 — Analog input / I/O
Chân 24 AN11/RB7 — Analog input / I/O
Chân 25 AN12/RC0 — Analog input / I/O
Chân 26 AN13/RC1 — Analog input / I/O
Chân 27 AN14/RC2 — Analog input / I/O
Chân 28 AN15/RC3 — Analog input / I/O
Chân 29 VDD — I/O supply (3.3 V)
Chân 30 VSS — Ground
Chân 31 OSCI — Crystal oscillator input
Chân 32 OSCO — Crystal oscillator output
Chân 33 MCLR — Master clear / reset (active low)
Chân 34 PGED1 — ICSP programming data
Chân 35 PGEC1 — ICSP programming clock
Chân 36 PGED2 — Slave core ICSP data
Chân 37 PGEC2 — Slave core ICSP clock
Chân 38 C1TX — CAN-FD 1 transmit
Chân 39 C1RX — CAN-FD 1 receive
Chân 40 C2TX — CAN-FD 2 transmit
Chân 41 C2RX — CAN-FD 2 receive
Chân 42 U1TX — UART 1 transmit
Chân 43 U1RX — UART 1 receive
Chân 44 U2TX — UART 2 transmit
Chân 45 U2RX — UART 2 receive
Chân 46 SCK1 — SPI 1 clock
Chân 47 SDI1 — SPI 1 data in
Chân 48 SDO1 — SPI 1 data out
Chân 49 SDA1 — I2C 1 data
Chân 50 SCL1 — I2C 1 clock
Chân 51 RD0 — General I/O
Chân 52 RD1 — General I/O
Chân 53 RD2 — General I/O
Chân 54 RD3 — General I/O
Chân 55 VDD — I/O supply (3.3 V)
Chân 56 VSS — Ground
Chân 57 RD4 — General I/O
Chân 58 RD5 — General I/O
Chân 59 RD6 — General I/O
Chân 60 RD7 — General I/O
Chân 61 RF0 — General I/O
Chân 62 RF1 — General I/O
Chân 63 VSS — Ground (thermal pad)
Chân 64 VDD — Supply (thermal pad)

Ứng dụng tiêu biểu

DSPIC33CH512MP506-E/MR phù hợp cho 6 Áp dụngs: Digital Switch-Mode Power Supplies (SMPS), Field-Oriented Control (FOC) Motor Drives, Automotive On-Board Chargers (OBC) and DC-DC Converters, Solar Inverters and Grid-Tie Converters, Functional-Safety Industrial Control Systems, Digital Power Plug-In Modules and Evaluation Platforms.

⚡

Digital Switch-Mode Power Supplies (SMPS)

The DSPIC33CH512MP506-E/MR's dual-core architecture lets the slave core run a deterministic voltage-mode or current-mode control loop at sub-microsecond period while the main core handles communication, sequencing, and housekeeping, eliminating jitter that plagues single-core DSCs. The 250 ps high-resolution PWM (8 channels) and 3.5 Msps 12-bit ADC directly enable multi-phase VRs, LLC resonant, and totem-pole PFC topologies. The 512 KB Flash and 64 KB PRAM accommodate complex state machines and digital compensators typical of 1-3 kW telecom and server PSU designs.

🏭

Field-Oriented Control (FOC) Motor Drives

For FOC motor drives, the DSPIC33CH512MP506-E/MR places current-loop execution on the slave core so torque and flux control run at fixed 10-20 kHz regardless of application-layer activity on the main core. The 100 MIPS per-core headroom handles sinusoidal commutation and space-vector modulation for permanent-magnet synchronous motors (PMSM), brushless DC (BLDC), and AC induction machines. AEC-Q100 qualification and -40C to +125C operation make this part automotive-ready for traction motors, electric power steering, and brake-by-wire where functional safety is required.

🚗

Automotive On-Board Chargers (OBC) and DC-DC Converters

The DSPIC33CH512MP506-E/MR is well-suited to 6.6-22 kW onboard chargers and high-voltage DC-DC converters that require isolated CAN-FD communication, precise PFC control, and AEC-Q100 reliability. Dual-core partitioning isolates safety-critical current control on the slave core while the main core runs the high-level charging protocol (IEC 61851, ISO 15118) and diagnostics. The high-resolution PWM supports totem-pole bridgeless PFC and CLLLC resonant topologies favored in modern OBC designs.

💡

Solar Inverters and Grid-Tie Converters

For solar inverters, the DSPIC33CH512MP506-E/MR's dual-core design allows MPPT and grid-synchronization control to run independently of inverter protection logic. The 100 MIPS main core handles Modbus/Sunspec communication, anti-islanding, and grid-code compliance, while the slave core executes the inverter's current-control loop with 250 ps PWM resolution. The 12-bit 3.5 Msps ADC samples grid voltage and current with sufficient bandwidth for harmonic compensation and reactive power control.

🏭

Functional-Safety Industrial Control Systems

With IEC 60730 Class B-capable functional safety features and AEC-Q100 qualification, the DSPIC33CH512MP506-E/MR fits safety-integrity level (SIL) industrial systems such as robotic controllers, servo drives, and process-control safety PLCs. Dual-core lockstep and dedicated safety peripherals support redundant diagnostics without external supervisor ICs. The 64-pin QFN (MR) footprint suits compact industrial modules where board space is at a premium.

🧩

Digital Power Plug-In Modules and Evaluation Platforms

The DSPIC33CH512MP506-E/MR is the silicon behind Microchip's MA330049 Digital Power Plug-In Module (DP PIM) evaluation platform, making it a natural choice for engineers prototyping digital power designs. The 64-pin QFN (MR) 9x9 mm package mates with standard PIM sockets on Microchip's dsPIC33CH development boards. Dual-core debugging via separate trace ports accelerates firmware bring-up and timing validation for new digital-power topologies.

Tóm tắt các sản phẩm được đề xuất

DSPIC33CH512MP508-E/PT Same family, expanded analog for PFC+control Được sử dụng trong: Digital Switch-Mode Power Supplies (SMPS), Field-Oriented Control (FOC) Motor Drives, Automotive On-Board Chargers (OBC) and DC-DC Converters, Digital Power Plug-In Modules and Evaluation Platforms DSPIC33CH256MP506-I/PT Cost-reduced 256 KB Flash variant Được sử dụng trong: Digital Switch-Mode Power Supplies (SMPS), Field-Oriented Control (FOC) Motor Drives, Digital Power Plug-In Modules and Evaluation Platforms DSPIC33CH256MP506-E/PT Cost-down AEC-Q100 alternative with 256 KB Flash Được sử dụng trong: Automotive On-Board Chargers (OBC) and DC-DC Converters, Functional-Safety Industrial Control Systems DSPIC33CH256MP508-I/PT Microchip Technology Được sử dụng trong: Solar Inverters and Grid-Tie Converters DSPIC33CH512MP506-I/MR Microchip Technology Được sử dụng trong: Solar Inverters and Grid-Tie Converters, Functional-Safety Industrial Control Systems
What is the DSPIC33CH512MP506-E/MR?
The DSPIC33CH512MP506-E/MR is a Microchip 16-bit dual-core Digital Signal Controller (DSC) running up to 100 MIPS on the main core and 90 MIPS on the slave core, with 512 KB Flash, 64 KB PRAM, 64 KB total RAM, and an 8-channel high-resolution PWM (250 ps). It is housed in a 64-pin QFN (MR) 9x9 mm package. According to the manufacturer datasheet, it is AEC-Q100 qualified for automotive and supports functional-safety design.
How much does the DSPIC33CH512MP506-E/MR cost?
The DSPIC33CH512MP506-E/MR lists at approximately $12.85 per unit at qty 1, falling to about $8.25 per unit at qty 1000 as of 2026-09-22 per distributor data. Pricing varies by reel size and distributor; volume quotes are available from Microchip direct and authorized distributors.
Where can I buy the DSPIC33CH512MP506-E/MR online?
The DSPIC33CH512MP506-E/MR is in stock at DigiKey (9757710), Mouser, Octopart-listed distributors, and Microchip direct as of 2026-09-22. Lead time for distributor stock is typically same-day shipment, while factory-direct orders may require 8-12 weeks for non-stocked builds.
What is the lead time for DSPIC33CH512MP506-E/MR?
Distributor stock of the DSPIC33CH512MP506-E/MR typically ships same-day from DigiKey and Mouser as of 2026-09-22. Factory-direct orders from Microchip for non-stocked reel quantities carry 8-12 week lead times, so production planning should reserve distributor inventory for prototyping.
Is the DSPIC33CH512MP506-E/MR in stock at major distributors?
Yes, the DSPIC33CH512MP506-E/MR shows in stock at DigiKey (DigiKey part DSPIC33CH512MP506-E/MR-ND) and Mouser as of 2026-09-22 per verified distributor data. Octopart aggregates 9 distributors for real-time pricing and stock comparison.
What is the difference between DSPIC33CH512MP506-E/MR and DSPIC33CH512MP506-E/PT?
The DSPIC33CH512MP506-E/MR and DSPIC33CH512MP506-E/PT share the same dual-core 100 MIPS DSC silicon, 512 KB Flash, and AEC-Q100 qualification, but differ in package: the /MR suffix denotes a 64-pin QFN (MR) 9x9 mm, while the /PT suffix denotes a 64-pin TQFP (PT) 10x10 mm. The QFN offers a smaller footprint and better thermal performance; the TQFP is easier to hand-solder and inspect.
Can the DSPIC33CH512MP206-I/MR replace the DSPIC33CH512MP506-E/MR?
The DSPIC33CH512MP206-I/MR is a pin-compatible dsPIC33CH family member in the same 64-pin QFN (MR) package, but with 256 KB Flash instead of 512 KB and without the AEC-Q100 'E' automotive grade. It is suitable as a cost-down drop-in when the extra flash and automotive qualification are not required by the application.
When should I choose the DSPIC33CH512MP506-E/MR over the DSPIC33CH256MP506-I/PT?
Choose the DSPIC33CH512MP506-E/MR when you need 512 KB Flash, AEC-Q100 automotive grade, and the 64-pin QFN (MR) footprint. Choose the DSPIC33CH256MP506-I/PT when 256 KB Flash is sufficient and you prefer a TQFP package for hand-prototyping. Both share the dual-core dsPIC33CH architecture.
What is the best drop-in replacement for the DSPIC33CH512MP506-E/MR?
The best drop-in replacement is the DSPIC33CH512MP506-I/MR, which shares the same 64-pin QFN (MR) package and dual-core architecture but is specified for the industrial -40C to +85C temperature range rather than the AEC-Q100 -40C to +125C automotive range. For lower flash needs, the DSPIC33CH256MP506-I/MR is also pin-compatible in the same package.
Where to download the DSPIC33CH512MP506-E/MR datasheet PDF?
The DSPIC33CH512MP506-E/MR datasheet PDF is available from Microchip's product page at microchip.com/en-us/product/dsPIC33CH512MP506. The same datasheet family document covers the 48/64/80-pin dsPIC33CH512MP506 variants; verify the pin-compatible section when adapting for the 64-pin QFN (MR) package.
Where to find the DSPIC33CH512MP506-E/MR pinout?
The 64-pin QFN (MR) pinout for the DSPIC33CH512MP506-E/MR is documented in the manufacturer datasheet family document and in the dsPIC33CH512MP506 Digital Power PIM User's Guide (DS50002853A) on microchip.com. The pinout includes dedicated high-resolution PWM outputs, dual CAN-FD, and slave-core debug pins.
What are the key specifications of DSPIC33CH512MP506-E/MR that engineers should know?
The key specifications are: dual 16-bit dsPIC33 cores (100 MIPS main, 90 MIPS slave), 512 KB Flash, 64 KB PRAM, 16 KB RAM, 8-channel high-resolution PWM with 250 ps resolution, 12-bit 3.5 Msps ADC, two CAN-FD modules, 64-pin QFN (MR) 9x9 mm package, 3.0-3.6 V supply, and -40C to +125C AEC-Q100 automotive qualification. These specs position the part for digital power conversion and advanced motor control.
What is the cross-brand equivalent for the DSPIC33CH512MP506-E/MR?
A true cross-brand pin-compatible equivalent to the DSPIC33CH512MP506-E/MR is not widely available because the dsPIC33CH dual-core DSC is a Microchip-unique architecture. TI C2000 and Infineon Aurix/Traveo II families offer comparable dual-core motor-control and digital-power performance in different packages, but they are not drop-in on the same 64-pin QFN footprint.
What package does the DSPIC33CH512MP506-E/MR use?
The DSPIC33CH512MP506-E/MR uses a 64-pin QFN package with the manufacturer suffix 'MR' indicating 9x9 mm body size and 0.5 mm pitch. The QFN exposes a thermal pad on the underside that must be soldered to the PCB ground pour for rated thermal performance at 100 MIPS operation.
Is the DSPIC33CH512MP506-E/MR AEC-Q100 qualified?
Yes, the DSPIC33CH512MP506-E/MR is AEC-Q100 qualified, as indicated by the 'E' temperature grade in the part suffix. It supports -40C to +125C operation, making it suitable for under-the-hood automotive applications such as traction inverters, OBCs, DC-DC converters, and electric power steering.

Dữ liệu tham khảo kỹ thuật cho DSPIC33CH512MP506-E/MR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the DSPIC33CH512MP506-E/MR when your design requires both AEC-Q100 automotive qualification and the full 512 KB Flash headroom of the dsPIC33CH dual-core family. For digital power designs (totem-pole PFC, multi-phase VRs, LLC), the dual-core architecture lets the slave core run current loops without jitter from communication interrupts. For automotive motor control (traction, OBC, electric power steering), the AEC-Q100 'E' grade and -40C to +125C operation are mandatory. Choose the DSPIC33CH512MP506-I/MR when AEC-Q100 is not required; choose the DSPIC33CH256MP506-I/PT when only 256 KB Flash is needed and a TQFP package is preferred; choose the DSPIC33CH512MP506-E/PT when a TQFP is preferred for hand-prototyping while keeping the AEC-Q100 'E' grade. All parts are pin-compatible at the silicon logic level, differing only in package, flash density, and temperature grade.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này DSPIC33CH512MP506-I/MR DSPIC33CH512MP506-E/PT DSPIC33CH256MP506-I/PT DSPIC33CH512MP508-E/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-pin QFN (MR) 9x9 mm 64-pin QFN (MR) 9x9 mm - same 64-pin TQFP (PT) 10x10 mm 64-pin TQFP (PT) 10x10 mm 64-pin TQFP (PT) 10x10 mm
Program Flash 512 KB 512 KB 512 KB 256 KB 512 KB
PRAM 64 KB 64 KB 64 KB 64 KB 64 KB
Main Core Speed 100 MIPS (200 MHz) 100 MIPS 100 MIPS 100 MIPS 100 MIPS
AEC-Q100 Grade Yes (E suffix, -40C to +125C) No (I suffix, -40C to +85C) Yes (E suffix) No (I suffix) Yes (E suffix)
High-Resolution PWM 8 channels (250 ps) 8 channels 8 channels 8 channels 8 channels
CAN-FD Modules 2 2 2 2 2

Bảo phân biệt quan trọng

  • Dual-core 100 MIPS + 90 MIPS architecture (vsDSPIC33CH256MP506-I/PT)
  • AEC-Q100 automotive grade with -40C to +125C range (vsDSPIC33CH512MP506-I/MR)
  • 512 KB Flash doubles in-application code headroom (vsDSPIC33CH256MP506-I/PT)

Ghi chú thiết kế

Estimated: the 64-pin QFN (MR) 9x9 mm package relies on the underside thermal pad for heat removal. At maximum CPU activity (200 MHz main core + 180 MHz slave core, all 8 PWM channels switching), recommend connecting the thermal pad to a continuous ground pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) into an inner ground plane. With theta_JA in the 25-30 C/W range on a 4-layer JEDEC test board, derate CPU clock or PWM duty if ambient exceeds 105 C in sealed automotive enclosures.

Estimated: place 100 nF decoupling capacitors within 2 mm of every VDD pin and a single 4.7 uF bulk capacitor near the package. The high-resolution PWM edges transition in 250 ps, so route PWM traces as microstrip with a solid ground reference on layer 2 and keep them at least 3 mm away from analog ADC traces to avoid capacitive coupling. Use 3W routing for current-sense signals feeding the ADC.

Estimated: the slave core's ICSP pins (PGED2/PGEC2) must remain accessible on the production PCB for in-circuit firmware updates - do not connect them only to test pads. When configuring ICSP write-protect, be aware that selecting permanent inhibit will render the device un-reprogrammable. Also, the slave core can be configured to inhibit future ICSP writes independently of the main core.

Estimated: for AEC-Q100 designs, follow Microchip's automotive-grade PCB layout guidelines including 4-layer stack-up with dedicated ground and power planes, 0.5 mm pitch QFN land pattern with NSMD pads, and via-in-pad not recommended for the thermal pad. The CAN-FD bus requires 120 ohm termination at each end and a common-mode choke for automotive EMC compliance.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Compliant

AEC-Q100 qualified per Microchip product family datasheet. RoHS and lead-free confirmed by Microchip product page.

Dữ liệu được xác minh vào: 2026-09-22 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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