EP1C6F256C8N - Cyclone FPGA 6K LE 256-BGA | Intel
MPN： EP1C6F256C8N ⚠ 最後購買機會EP1C6F256C8N 概覽
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), embedded memory, routing channels, and programmable I/O cells that engineers can re-program in the field after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, and Cyclone-family parts occupy Intel's low-cost, high-volume tier of that hierarchy. They are widely used to replace discrete glue logic, accelerate parallel data paths, and bridge mismatched interfaces without committing to an ASIC NRE.
Key features of the EP1C6F256C8N include 5,980 LEs, 92,160 bits of embedded RAM (~11.25 KB), 185 user I/Os, two PLLs, and support for LVTTL, LVCMOS, SSTL, and LVDS I/O standards. The Cyclone architecture uses 4-input look-up tables (4-LUTs) per LE and dedicated carry-chain routing for arithmetic, providing predictable timing closure for state machines and DSP-style datapaths up to the device's logic-capacity ceiling.
The device is fabricated on a 1.5 V core, 0.13 µm process, and supports configuration via passive serial (PS), active serial (AS), and JTAG modes. The 256-ball FBGA package has a 17 mm × 17 mm body with a 1.0 mm ball pitch, suitable for multi-layer FR4 PCBs. Each user I/O is organized into banks with per-bank VCCIO rails that can be mixed between 1.5 V, 1.8 V, 2.5 V, and 3.3 V, allowing direct interfacing to memories and processors of different voltage generations on the same board.
Typical applications for this Cyclone device include industrial control and factory automation backplanes, video and image processing pre-processing pipelines, communications protocol bridging (UART, SPI, I2C, parallel bus glue logic), and consumer-electronics display controllers. Designers also use Cyclone FPGAs as low-cost I/O expanders for embedded processors, custom peripheral controllers, and rapid ASIC prototyping.
When designing with the EP1C6F256C8N, observe the I/O-bank VCCIO rules: each bank has its own voltage reference, and mixing 3.3 V LVTTL with 1.5 V SSTL inputs in the same bank is not allowed. Decouple every VCCINT and VCCIO pin with 0.1 µF X7R ceramic capacitors placed as close to the balls as possible, and route the JTAG TCK/TMS/TDO/TDI signals with 4.7 kΩ pull-ups on TCK/TMS to ensure reliable configuration.
This page synthesizes distributor pricing, same-family drop-in speed-grade alternatives, and practical design notes not found in the original Cyclone datasheet, giving procurement and design engineers a consolidated reference for the EP1C6F256C8N.
直接替換替代品，適用於 EP1C6F256C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1C6F256C8N （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Process Technology, RoHS Status.
EP1C6F256C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C6F256I7N
✅ 直接替換聯絡詢價
查看資料表 →EP1C6F256C8
✅ 直接替換聯絡詢價
查看資料表 →EP1C6F256C7NAB
✅ 直接替換聯絡詢價
查看資料表 →EP1C6F256C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1C6F256C8N 最大額定值與電氣特性
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements (LEs) | 5,980 |
| Embedded Memory (bits) | 92,160 |
| User I/O Pins | 185 |
| Number of PLLs | 2 |
| Core Voltage (VCCINT) | 1.5 V |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| Speed Grade | 8 |
| 封裝 | 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount |
| Process Node | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 |
EP1C6F256C8N 256-bga (fbga-256), 17 × 17 mm, 1.0 mm pitch 腳位配置指南
EP1C6F256C8N（256-bga (fbga-256), 17 × 17 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1C6F256C8N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1C6F256C8N 適用於 6 應用s: Industrial Control & Factory Automation Backplanes, Video & Image Processing Pre-Processing Pipelines, Communications Protocol Bridging & Glue Logic, Custom Peripheral Controllers for Embedded Processors, Consumer Display & Touch-Screen Controllers, Rapid ASIC Prototyping & Design Validation.
Industrial Control & Factory Automation Backplanes
The EP1C6F256C8N fits industrial control backplanes because its 5,980 LEs deliver enough capacity to implement multiple protocol bridges (RS-485, RS-232, SPI, I2C, CAN) on a single device, while 185 user I/Os provide fan-out for backplane connectors and field wiring. The 256-FBGA's 1.0 mm ball pitch is reflow-compatible with standard 4-layer FR4 PCBs used in DIN-rail controllers. Cyclone PLLs generate deterministic clock domains for synchronized motor-control loops, and the 92 Kb embedded RAM serves as line buffers for high-speed serial streams in factory-floor networks.
推薦
Video & Image Processing Pre-Processing Pipelines
The EP1C6F256C8N is used for camera-link pre-processing because its 5,980 LEs and 92 Kb embedded RAM can implement line buffers, color-space converters, and simple spatial filters at video rates. The LVDS-capable I/Os of the Cyclone I support direct connection to LVDS camera-link pairs without external transceivers. Designers typically run the FPGA at 65-100 MHz to process 8- or 16-bit-wide pixel buses, with one PLL multiplying a 27 MHz reference to derive the pixel clock and memory clock. The 256-FBGA package exposes enough I/Os to drive both a video ADC input and an LCD output simultaneously.
推薦
Communications Protocol Bridging & Glue Logic
The EP1C6F256C8N serves as a protocol bridge between mismatched busses (PCI to local bus, UART to SPI, Ethernet MAC to parallel FIFO) because the Cyclone architecture provides 4-LUT-based logic elements with dedicated carry chains for fast glue-logic state machines. With 185 user I/Os and per-bank VCCIO flexibility, the device interfaces directly to 3.3 V LVTTL, 2.5 V SSTL, and 1.8 V LVCMOS peripherals on the same board. Two PLLs can deskew source-synchronous clocks and generate independent baud-rate clocks for multiple serial channels.
推薦
Custom Peripheral Controllers for Embedded Processors
The EP1C6F256C8N is used as a low-cost peripheral controller attached to a host MCU or microprocessor because its 5,980 LEs can host multiple custom peripherals (PWM generators, quadrature encoders, custom bus masters) while the 256-FBGA exposes 185 I/Os for off-board signaling. Designers route processor address/data buses through the FPGA's LVTTL I/O banks, using one PLL to align the local bus clock with the host's clock domain. Embedded RAM serves as FIFO buffers between the host and high-speed external peripherals such as ADCs.
推薦
Consumer Display & Touch-Screen Controllers
The EP1C6F256C8N drives custom LCD or OLED panels because the Cyclone I provides enough logic for timing-controller state machines, color-depth conversion (e.g., 18-bit to 24-bit RGB), and touch-screen digitizer interfaces. Its 185 user I/Os and per-bank VCCIO rails connect directly to 3.3 V TTL LCDs and 1.8 V OLED drivers without external level shifters. Designers use one PLL to multiply a low-frequency crystal to the panel's pixel clock, while the embedded RAM holds frame-buffer lines for double-buffered display updates.
推薦
Rapid ASIC Prototyping & Design Validation
The EP1C6F256C8N is used as a prototype vehicle for ASIC blocks before committing to mask costs because its 5,980 LEs can map representative slices of an ASIC RTL for in-system validation. The 256-FBGA exposes JTAG, AS, and PS configuration ports for rapid bitstream iteration during bring-up. Engineers running ASIC prototypes on Cyclone I typically partition the ASIC into multiple FPGAs, using the embedded 92 Kb RAM to share data between logic regions. The commercial temperature range suits lab validation, while the industrial drop-in (EP1C6F256I7N) supports field trials.
推薦
推薦產品摘要
工程參考資料，適用於 EP1C6F256C8N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1C6F256C7N | EP1C6F256I7N | EP1C6F256C8 | EP1C6F256C7NAB | EP1C6F256C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-BGA (FBGA-256) | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same |
| Logic Elements | 5,980 | 5,980 | 5,980 | 5,980 | 5,980 | 5,980 |
| Embedded Memory (bits) | 92,160 | 92,160 | 92,160 | 92,160 | 92,160 | 92,160 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 185 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | 8 | 7 | 7 | 8 | 7 | 6 |
主要差異化特點
- Lowest unit cost in Cyclone I speed-grade line for the 6 K LE class (對比EP1C6F256C7N)
- Commercial temperature grade optimized for cost-sensitive indoor equipment (對比EP1C6F256I7N)
- Lead-free (Pb-free) assembly with RoHS and REACH compliance (對比EP1C6F256C8)
設計說明
Estimated: at 100 MHz with 60% logic utilization and 3.3 V LVTTL I/O at moderate toggle rate, the EP1C6F256C8N consumes roughly 0.4 W to 0.9 W. Designers should budget at least 1.5 W worst-case dissipation and provide a small copper flood under the FBGA thermal pad. Decouple every VCCINT pin with 0.1 µF X7R ceramic capacitors placed as close to the balls as possible, and add a bulk 47 µF tantalum or polymer capacitor near the FPGA to suppress core-rail droop during simultaneous-switching events.
The 256-FBGA has a 1.0 mm ball pitch, which requires 0.5 mm-pitch via-in-pad or dog-bone fan-outs on a 4-layer FR4 stack-up. Use microvia or laser-drilled stacked-via technology if signal escape routing is tight. Match length (±150 mil) on JTAG TCK/TMS/TDO/TDI signals and add 4.7 kΩ pull-ups on TCK and TMS to ensure reliable configuration. Route differential LVDS pairs with 100 Ω differential impedance and length matching within 50 mil to maintain data-eye margins.
Do not mix 3.3 V LVTTL and 1.5 V SSTL inputs in the same I/O bank: each I/O bank has a single VCCIO rail, and mixed-voltage inputs violate absolute-maximum ratings. Always tie unused user I/Os to a defined logic level (drive to ground or to VCCIO of the bank) rather than leaving them floating, because floating inputs can draw shoot-through current in the I/O cell and cause spurious current spikes. When using Active Serial (AS) configuration, verify that the serial flash (EPCS4/EPCS16) VCC matches the FPGA VCCIO[3] bank voltage before powering up.
合規資訊
RoHS compliance confirmed by 'N' suffix in ordering code. REACH compliance declared by manufacturer. AEC-Q100 is not applicable for a commercial-grade FPGA; the industrial 'I7N' variant is not AEC-Q100 qualified either. Last-time-buy (LTB) status: confirm with Intel PCN before committing to long-life-cycle designs.
