EP1C6F256I7 - Cyclone FPGA, 5980 LE, 185 I/O, 256-BGA | Intel
MPN: EP1C6F256I7 ✗ Cuối đờiEP1C6F256I7 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacture by the user, via a configuration bitstream loaded into on-chip SRAM. The Cyclone family sits in the low-power, low-cost tier of Intel's FPGA portfolio, sitting hierarchically below Cyclone II/III/IV/V and above MAX CPLDs in the company's programmable-logic taxonomy. FPGAs are most often chosen when an application requires parallelism, custom I/O timing, or hardware acceleration that microcontrollers and DSPs cannot deliver economically.
Key features of the EP1C6F256I7 include two PLL blocks for clock synthesis and skew management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, and LVDS on selected banks), embedded multipliers for DSP-style arithmetic, and a configuration scheme compatible with active serial (AS), passive serial (PS), and JTAG modes. The device's RAM blocks total 92 Kbits, distributed across the fabric for efficient FIFO and buffering implementations.
Architecturally, the EP1C6F256I7 uses a 4-input LUT-based logic element with associated carry chain for fast arithmetic and an adjacent programmable register. Interconnect uses Altera's MultiTrack routing fabric with row and column lines optimized for typical designs at 100-200 MHz system clock rates. Embedded multiplier blocks accelerate DSP operations without consuming general logic resources.
Typical applications include industrial control interfaces, low-cost video processing bridges, custom peripheral glue logic, motor control co-processors, and protocol bridging (UART/SPI/I2C to parallel buses). The 256-FBGA footprint also makes it a common choice for space-constrained prototypes migrating from larger QFP-packaged FPGAs.
When designing with this device, note that the FBGA package requires X-ray or BGA rework for prototyping - engineers typically use a socketed development board first. Configuration storage requires a separate serial configuration device (EPCS1/EPCS4), and unused I/O banks should be powered according to the datasheet to avoid leakage. JTAG access via the dedicated TCK/TMS/TDI/TDO pins is the recommended bring-up path.
This page synthesizes distributor pricing, same-family Cyclone drop-in alternatives, and practical design notes not found in the original datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EP1C6F256I7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C6F256I7 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
EP1C6F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2C8F256I7
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1C6F256I7 Tỷ lệ tối đa & tính chất điện
| Family | Cyclone |
| Logic Elements (LE) | 5,980 |
| Logic Array Blocks (LAB) | 598 |
| Total RAM Bits | 92,160 |
| Embedded Multipliers (18x18) | 20 |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Hộp | 256-ball FBGA (F256) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +100C (industrial) |
| Speed Grade | -7 |
| Configuration Mode | AS / PS / JTAG |
| Trạng thái RoHS | Depends on specific order code; verify per lot |
Hướng dẫn cấu hình chân EP1C6F256I7 256-ball fbga (f256)
Cấu hình chân cho EP1C6F256I7 (256-ball fbga (f256) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1C6F256I7.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1C6F256I7 phù hợp cho 6 Áp dụngs: Industrial Control Glue Logic, Motor Control Co-Processor, Custom Video / Display Bridge, Low-Cost Hardware Accelerator Card, Test & Measurement Front-End, Communications Protocol Converter.
Industrial Control Glue Logic
The EP1C6F256I7's 5,980 logic elements and 185 user I/Os provide ample headroom for industrial glue logic that bridges legacy and modern interfaces. The 256-FBGA package's 185 I/Os comfortably accommodate typical 32-bit parallel bus expansions plus dedicated SPI, I2C, and UART pins. Industrial temperature grade (-40C to +100C) ensures reliable operation in factory-floor enclosures. Two PLLs synthesize clocks for both the system logic and isolated sensor sampling channels.
Được đề xuất
Motor Control Co-Processor
The EP1C6F256I7's 20 embedded 18x18 multipliers and two PLLs are ideal for motor control algorithms such as Field-Oriented Control (FOC) and Space Vector PWM. The fabric executes current-loop calculations at the required 10-20 kHz switching rate while offloading position/speed estimation from the host MCU. Industrial temperature grade and 185 I/Os support encoder, Hall-sensor, and PWM-channel interfaces simultaneously.
Được đề xuất
Custom Video / Display Bridge
The EP1C6F256I7 can bridge between RGB parallel camera inputs, BT.656/601 video streams, and LVDS display outputs using its embedded multipliers for chroma resampling and 2D scaling operations. Two PLLs synthesize pixel clocks independently from the system reference. The 256-FBGA package's 185 I/Os accommodate 24-bit RGB plus control and sync signals without external bus multiplexing.
Được đề xuất
Low-Cost Hardware Accelerator Card
Engineers building custom PCIe, USB, or Ethernet-attached accelerator cards often pair the EP1C6F256I7 with a host CPU to offload specific algorithms - CRC32, Reed-Solomon FEC, AES, or custom DSP - that benefit from FPGA parallelism. The 92 Kbits of embedded RAM suffices for small FIFOs and lookup tables; larger datasets stream from host memory via DMA. Industrial temperature grade suits server-room or rugged edge deployment.
Được đề xuất
Test & Measurement Front-End
The EP1C6F256I7 serves as a flexible pattern generator, capture buffer, or protocol exerciser in custom test equipment. Its 185 I/Os handle multi-channel digital acquisition or stimulus, while the embedded multipliers accelerate FFT or correlation functions for signal-integrity analysis. Industrial temperature grade and the rugged 256-FBGA package make it suitable for production ATE fixtures operating in varied environmental conditions.
Được đề xuất
Communications Protocol Converter
The EP1C6F256I7 is widely used as a multi-protocol converter - bridging UART, SPI, I2C, CAN, LIN, and custom serial buses between heterogeneous MCUs or ASICs. Its flexible I/O banks support 3.3V LVCMOS alongside 5V-tolerant inputs (with proper bus-keeper configuration), enabling direct interface to legacy industrial nodes. The 5,980 LE budget accommodates state-machine-based protocol stacks with timing margins.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1C6F256I7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1C6F256I7N | EP1C6F256C8N | EP1C6F256C7N | EP1C12F256I7N | EP2C8F256I7 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | |
| Logic Elements (LE) | 5,980 | 5,980 | 5,980 | 12,060 | 8,256 | |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | |
| Speed Grade | -7 | -7 | -8 | -7 | -7 | |
| Embedded RAM (bits) | 92,160 | 92,160 | 239,616 | 165,888 | ||
| PLLs | 2 | 2 | 2 | 4 | ||
| Embedded 18x18 Multipliers | 20 | 20 | 52 | 36 | ||
| Lead-Free / RoHS | Depends on order code | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | |
| Process Node | 130 nm | 130 nm | 90 nm | |||
| Lifecycle Status | NRND | NRND | NRND | NRND (Cyclone II series) |
Bảo phân biệt quan trọng
- Pb-free / RoHS drop-in option within same family (vsEP1C6F256I7N)
- Doubling logic density in same package (vsEP1C12F256I7N)
- Cyclone II upgrade path with reduced power (vsEP2C8F256I7)
- Same-family commercial-temperature option (vsEP1C6F256C8N)
Ghi chú thiết kế
The 256-ball FBGA package has 1.0 mm ball pitch and requires 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Recommended land pad diameter is 0.4-0.45 mm with NSMD (Non-Solder Mask Defined) pads. X-ray inspection is mandatory after reflow since BGAs cannot be visually inspected from above. Allocate at least 4 decoupling capacitors (100 nF, 10 nF, 100 uF bulk) within 5 mm of each power pin group, following the Altera Cyclone Hardware Reference manual decoupling recommendations for the F256 package.
Configuration failure is the most common Cyclone bring-up issue. Verify MSEL[2..0] pins are pulled to the correct levels for your chosen mode (AS=000, PS=001, JTAG=101) before power-up. For AS mode, ensure nSTATUS and CONF_DONE lines have 10 kohm pull-ups to VCCIO (3.3V) and the EPCS device's nCS pin is connected to the FPGA's dedicated nCSO pin. Use JTAG mode first to validate the bitstream loads before integrating AS configuration in production firmware.
At typical utilization of 60-70% logic and 100 MHz system clock, the EP1C6F256I7 dissipates approximately 0.6-1.2 W. Without airflow on a 4-layer JEDEC EIA/JESD51 test board, junction-to-ambient thermal resistance (theta_JA) is around 18-22 C/W, yielding junction temperature rise of 11-26 C above ambient. For sealed industrial enclosures, derate by 30-40% and ensure at least 200 LFM airflow. Industrial-grade silicon is rated to 100C case temperature - verify with on-die thermal diode if available.
Single-ended I/O on the EP1C6F256I7 supports LVTTL/LVCMOS up to 3.3V with slew-rate and strength control via Quartus II pin assignments. For LVDS inputs/outputs, the device requires a 100-ohm differential termination near the receiver. Series damping resistors (22-33 ohm) on high-speed edge-rate signals (>100 MHz) reduce overshoot on long PCB traces. Use the Quartus II Timing Analyzer with board trace models for closure on DDR or source-synchronous interfaces.
Thông tin tuân thủ
RoHS compliance of EP1C6F256I7 depends on order code suffix: 'N' variants (e.g., EP1C6F256I7N) are Pb-free/RoHS compliant, while the base EP1C6F256I7 part number may contain lead-bearing BGA balls. Verify with distributor material declaration. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete). Conflict minerals compliance should be requested from distributor for new production orders.
